A display device includes: a display panel including a front surface, on which a display area is define, and a rear surface opposite to the front surface; a connection layer disposed on the rear surface of the display panel; a cover disposed on the connection layer, where a hole overlapping the connection layer is defined through the cover; and a first adhesive layer disposed on the cover, where the first adhesive layer is in contact with the cover, and in contact with the connection layer through the hole of the cover, and the first adhesive layer is detachably connected to the cover and the connection layer.

A display panel and a preparation method therefor, a display apparatus, and a tiled display apparatus are provided. The display panel includes: a substrate including a first surface and a second surface opposite to each other, and a plurality of side surfaces which include at least one selected side surface and connect the first surface with the second surface; a plurality of connecting leads each including a first lead segment located on the first surface, a second lead segment located on the selected side surface, and a third lead segment and a fourth lead segment located on the second surface; a protective layer at least covering side surfaces of the first, second, third and fourth lead segments and a transfer layer covering a surface of the fourth lead segment away from the substrate and electrically connected to the fourth lead segment.

A light-emitting element array according to the present technology includes: a light-emitting element group; a first wire; and a second wire. The light-emitting element group includes a plurality of first light-emitting elements and a plurality of second light-emitting elements that are arrayed in a planar manner to form a light-emitting element surface. The first wire extends in a direction parallel to the light-emitting element surface, has a region overlapping with the plurality of first light-emitting elements and a region overlapping with the plurality of second light-emitting elements as viewed from a direction perpendicular to the light-emitting element surface, is electrically connected to the plurality of first light-emitting elements, and is not electrically connected to the plurality of second light-emitting elements. The second wire extends in a direction parallel to the light-emitting element surface, has a region overlapping with the plurality of first light-emitting elements and a region overlapping with the plurality of second light-emitting elements as viewed from a direction perpendicular to the light-emitting element surface, is electrically connected to the plurality of second light-emitting elements, and is not electrically connected to the plurality of first light-emitting elements.

The present application provides a light-emitting substrate and a display device, the light-emitting substrate includes a substrate, multiple signal lines, and multiple light-emitting units. The signal lines at least include a first signal line and a second signal line. The first signal line is provided with a signal access terminal and a first connection terminal. The second signal line is provided with a second connection terminal. The first connection terminal is electrically connected to the second connection terminal, and the signal access terminal receives signals.

An optoelectronic device for a light display including: a support; a light element with at least one first electrode; primary conductive elements; and secondary conductive elements. The device further includes a first electrically insulating element, wherein for said at least one light element, at least one first connecting portion of at least one of the secondary conductive elements corresponding to the light element is formed in all or part of a first imprint obtained in the first electrically insulating element. The first connecting portion of the secondary conductive element is in contact with the first electrode.

A circuit board includes a base having a plurality of interconnections on an upper surface thereof, a first photosensitive solder resist (PSR) covering the interconnections and defining a pad open region exposing portions of the interconnections, a second PSR covering the first PSR and having an opening exposing the pad open region. The opening of the second PSR is larger than the pad open region of the first PSR.

A manufacturing method of electronic device includes: (a) providing a circuit substrate including: a substrate; a plurality of electronic units disposed on the substrate; and a first bonding member disposed on the substrate, wherein the first bonding member surrounds the electronic units; (b) respectively disposing a plurality of cover plates on at least part of the electronic units, and disposing a bonding material on the first bonding member, wherein one of the cover plates includes a second bonding member and, in the top view direction of the circuit substrate, the second bonding member overlaps at least part of the first bonding member, and the bonding material does not overlap the second bonding member; and (c) melting the bonding material to allow part of the bonding material to flow in between the first bonding member and the second bonding member.

An electronic device including an electronic panel and a sensor is disclosed. The electronic panel has a first region, which includes a first element and a second element separated from each other by a first distance, and a second region, which includes a third element and a fourth element separated from each other by a second distance. Each of the first element and the second element has an emission region and a transmission region. The sensor overlaps the first region of the electronic panel, and the sensor is configured to receive a sense signal passing through the transmission region. A first ratio of the second distance to the first distance is ranged from 0.76 to 1.24, and a second ratio of an area of the transmission region to an area of the first element is ranged from 0.52 to 0.96.

A lighting device, including: a lamp housing and a lamp cap connected to each other and formed a closed space; at least one light-emitting diode filament disposed in the closed space; and a stem connected to the lamp cap and electrical conducted with the light-emitting diode filament, wherein the light-emitting diode filament includes: a chip strip structure; a light conversion unit wrapping the chip strip structure; and electrodes located at two ends of the chip strip structure respectively and electrically connected thereto, wherein at least part of the electrodes are wrapped in the light conversion unit; the chip strip structure includes a substrate with a first end and a second end, and a deposition segment located between the first end and the second end; and the deposition segment includes a plurality of deposition units with a connecting layer disposed therebetween, and a conductor layer electrically connects the deposition units.

This application relates to a light-emitting device and a manufacturing method thereof, comprising a substrate, a plurality of light-emitting chips arranged on the front side of the substrate, and an encapsulation layer disposed on the substrate to cover each light-emitting chip. The encapsulation layer allows light emitted by the LED chips to pass through.