A lighting device disclosed in an embodiment of the invention includes a heat dissipation plate having a recess portion; a circuit board accommodated in the recess portion of the heat dissipation plate and having pads; a light source portion having bonding pads; connection members respectively connecting between the pads and the bonding pads; and an adhesive member that adheres the light source portion to the heat dissipation plate. The light source portion includes a support member; light emitting devices having light emitting chips and a wavelength conversion layer; and a resin member. Each of the connection members has a ribbon shape, and a width of each of the connection members is more than twice the thickness of each of the connection members, and each of the connection members may include two ends respectively connected to the bonding pads and the pads, and a center portion extending convexly between the two ends.

A display module includes a display substrate including a front surface and a rear surface opposite to the front surface, an array of pixels on the front surface, wherein a plurality of micro light emitting diodes (LEDs) are in each pixel, a plurality of through vias in the display substrate and that extend from the front surface to the rear surface, a printed circuit board (PCB) on the rear surface of the display substrate, and a film substrate on the rear surface of the display substrate and including a first coupling portion coupled to at least one of the through vias, a second coupling portion coupled to the PCB, and a connection portion that connects the first coupling portion and the second coupling portion. Each of the through vias is electrically connected to at least one pixel in the array of pixels.

A polychrome micro LED pixel includes at least two light emitting structures, and each of the at least two light emitting structures includes at least two sub-pixels. A micro LED display panel includes an integrated circuit (IC) backplane including a bottom pad array, the bottom pad array including a plurality of groups of bottom pads; and a micro LED array formed on the IC backplane, the micro LED array including a plurality of polychrome micro LED pixels. One micro LED pixel of the plurality of micro LED pixels is electrically connected with one group of bottom pads of the plurality of groups of bottom pads.

In an embodiment a method for producing at least one optoelectronic device includes providing a substrate body, providing a substrate frame on the substrate body, wherein the substrate frame comprises at least one recess, providing at least one optoelectronic component on the substrate body, wherein the substrate frame and the at least one optoelectronic component are placed in relation to one another such that the at least one optoelectronic component is arranged in the at least one recess and providing a filler material in the at least one recess such that the at least one optoelectronic component is covered by the filler material, wherein the filler material is provided by a casting process.

An optoelectronic semiconductor component is provided. The optoelectronic semiconductor component includes a base, an electrical connection structure located on the base, a plurality of light-emitting chips located on the electrical connection structure, a plurality of wavelength converters located on the light-emitting chips, and a separation structure located on the electrical connection structure and covering the light-emitting chips and the wavelength converters. The base includes a base material and a plurality of conductor parts. The base material covers the conductor parts which penetrate the base material. The electrical connection structure includes an intermediate part and a plurality of metal parts The intermediate part covers the metal parts. A part of the conductor parts of the base extends into the electrical connection structure and are electrically connected to the metal parts of the electrical connection structure. The metal parts extend into the separation structure and are electrically connected to the light-emitting chips.

A display device includes a substrate, a plurality of metal interconnects formed on the substrate, and a plurality of light-emitting elements disposed on the substrate. Each of the plurality of light-emitting elements includes a pair of electrode pads and is electrically connected to corresponding metal interconnects via the pair of electrode pads. A surface of each of the metal interconnects in an area where the light-emitting elements are not mounted is formed with an uneven shape for scattering external light.

The present disclosure is applicable to the technical field of display devices and relates to a display device using, for example, a light emitting diode (LED). To this end, the present disclosure may comprise: a wiring board; an electrode pad partitioned on the wiring board; a plurality of light emitting diodes connected to the electrode pad to form unit pixels; an encapsulation layer formed on the wiring board to cover the plurality of light emitting diodes; an optical film positioned on the encapsulation layer; and a light scattering agent dispersed and distributed within the encapsulation layer, wherein the light scattering agent may comprise: a first light scattering agent; and a second light scattering agent having a scattering degree different from that of the first light scattering agent.

According to the present specification, provided is a micro LED display device. The micro LED display device includes a substrate, a supply voltage line on the substrate, and a micro LED area disposed on the supply voltage line. At least one portion of the supply voltage line is disposed at the vertical lower part of the micro LED area.

A semiconductor structure and a method for manufacturing a semiconductor structure are provided. The semiconductor structure includes a driving substrate, a first epitaxial structure coupled to the driving substrate, and a second epitaxial structure coupled to the first epitaxial structure, where the driving substrate is selectively coupled to a first semiconductor layer and a second semiconductor layer of the first epitaxial structure, and a third semiconductor layer and a fourth semiconductor layer of the second epitaxial structure by metal electrodes to independently control the first epitaxial structure and the second epitaxial structure.

A display device includes multiple layout units arranged in array and multiple light emitting elements disposed in the layout units. Each layout unit includes multiple pixel units, multiple repair units and a common electrode. Each pixel unit includes multiple sub-pixel units, and each sub-pixel unit includes a pixel electrode. One of the repair units is used to repair any one of three of the sub-pixel units, and each repair unit includes a repair electrode. In each layout unit, the number of the repair electrodes is smaller than the number of the pixel electrodes. Each light emitting element includes a first pad electrically connected to the pixel electrode or the repair electrode, and a second pad electrically connected to the common electrode. The light emitting elements have a shortest connecting line between the first pad and the second pad apiece while the shortest connecting lines are parallel to each other.