A display substrate, including a first substrate and a backplane arranged in a sequentially laminated manner, and a light-emitting layer, where the light-emitting layer includes a binding pads and a light-emitting elements arranged one-to-one corresponding to each other, where the binding pad is arranged on a side of the backplane away from the first substrate, and a pin of the light-emitting element is electrically connected to the binding pad, where the binding pad includes a first region and a second region, the orthographic projection of the first region on the backplane is covered by the orthographic projection of the light-emitting element on the backplane, and the orthographic projection of the second region on the backplane is arranged on the outer side of the orthographic projection of the light-emitting element on the backplane.

In an embodiment an optoelectronic semiconductor device includes a semiconductor layer sequence having an active region oriented perpendicular to a growth direction of the semiconductor layer sequence and a passivation regrowth layer oriented at least in part oblique to the active region, wherein the passivation regrowth layer is located directly on the semiconductor layer sequence and runs across a lateral boundary of the active region, wherein the semiconductor layer sequence and the passivation regrowth layer are based on the same semiconductor material system, and wherein the semiconductor material system is InGaAlP or AlInGaAsP.

A chip structure includes a chip wafer unit and a color conversion substrate unit disposed on a light-exit side of the chip wafer unit. The chip wafer unit includes a light-emitting layer and an electrode layer sequentially stacked in a first direction. The light-emitting layer includes light-emitting portions. Each light-emitting portion includes at least two light-emitting sub-portions. The electrode layer includes a cathode, connection electrodes, and anodes in one-to-one correspondence with the light-emitting portions. The at least two light-emitting sub-portions are sequentially connected through at least one connection electrode. Among the at least two light-emitting sub-portions sequentially connected, a first one light-emitting sub-portion is a first selected light-emitting sub-portion, and a last one light-emitting sub-portion is a second selected light-emitting sub-portion. The first selected light-emitting sub-portion is connected to the cathode, and the second selected light-emitting sub-portion is connected to an anode.

In an embodiment an arrangement includes a plurality of optoelectronic semiconductor components arranged in a common plane, wherein each semiconductor component is laterally delimited by side faces, and wherein each semiconductor component has a semiconductor body with an active region configured to emit electromagnetic radiation, a radiation outlet side configured to couple out the electromagnetic radiation, a rear face opposite to the radiation outlet side, and a contact structure arranged on the rear face. The arrangement further includes an output element, an electrically insulating insulation layer and an electrical connection structure, wherein the insulation layer is arranged between side faces of adjacent semiconductor components and is absorbent or reflective of the electromagnetic radiation.

A driving backplane includes a substrate, a plurality of pad groups, and a plurality of marks. The plurality of pad groups and the plurality of marks are located on a same side of the substrate, a pad group includes at least one pad, and orthogonal projections of the plurality of marks on the substrate and orthogonal projections of the plurality of pad groups on the substrate have no overlap. The pad group corresponds to at least one mark. An orthogonal projection of the at least one mark on the substrate is located on a circumference of an orthogonal projection of a corresponding area of the pad group on the substrate, is adjacent to an orthogonal projection of the pad group on the substrate, and has a first gap from the orthogonal projection of the pad group on the substrate.

A wiring substrate, an electronic element and an electronic apparatus is provided according to the disclosure, the wiring substrate includes: a base substrate; connection lines located on the substrate, wherein at least two connection lines are configured to transmit different signals; a plurality of pads, wherein any two pads are distributed at intervals, and the pads include first pads; a first pad group composed of at least three first pads; wherein the connection lines include a first type of connection line, which includes a plurality of branch portions, different branch portions are connected with different first pads, and any two branch portions are arranged at intervals.

A light-emitting device and a display apparatus. The light-emitting device extracts, by means of a light extraction member, light emitted from a side surface (a second light-emitting surface) of a semiconductor light source; the light from the side surface is collected to a top part to be emitted to a wavelength conversion member together with light from a first light-emitting surface; white light is emitted from a top part (a second abutting surface of the wavelength conversion member; and after passing through a light-transmitting layer, the white light is emitted from a top part of the light-transmitting layer that is in the thickness direction thereof and is provided with a light inhibition layer, and the white light from the top part is partially inhibited by the light inhibition layer.

Disclosed are an integrated LED packaging structure and a packaging method, and relates to the technical field of LED packaging. The disclosure includes a shell, a bottom end of the shell is fixedly connected to a pin platform, a top end of the shell is fixedly connected to an LED plug, three lamp beads are fixedly mounted at a top end of the LED plug, a bottom end of the pin platform is fixedly connected to a cup cavity, and a bottom end of the cup cavity is fixedly connected to connecting pins. The top end of the LED plug is provided with LED sockets in positions corresponding to the lamp beads, and bottom ends of inner sides of the LED sockets are fixedly connected to insulating plates. Furthermore, a combination of an in-line and SMD form is adopted, and the lower half part adopts an SMD structure.

An LED carrier plate, comprising a carrier plate front side and a carrier plate back side, wherein a plurality of through holes penetrate the carrier plate front side and the carrier plate back side, and the plurality of through holes at least comprise two rows of through holes; at least every three through holes enclose one island-shaped carrier plate region on the carrier plate front side; and at least two electrode pins are arranged in the island-shaped carrier plate region, and are configured to be connected to an LED arranged on the carrier plate front side. In addition, further disclosed is an LED display device using the LED carrier plate. The carrier plate and the LED display device can achieve both light transmission and LED display/lighting effects.

This application provides a pixel unit, a manufacturing method therefor, a microdisplay, and a pixel-level discrete device. The pixel unit includes a backplane and a display unit. The display unit is arranged on the backplane, and includes a first device layer and a second device layer. The first device layer includes a first compound light-emitting layer and a second compound light-emitting layer. The second device layer includes a color conversion layer and a third compound light-emitting layer. The color conversion layer is arranged above the first compound light-emitting layer. The color conversion layer is arranged, so that the compound light-emitting layer can implement color development through color conversion, to reduce power and improve performance. The pixel unit occupies less space in the horizontal direction. A decrease in external quantum efficiency caused by a size effect is effectively reduced, power consumption is effectively reduced, and performance such as brightness is improved.