In an embodiment a display unit includes a first contact layer, a second contact layer, a plurality of connection region and a plurality of optoelectronic semiconductor components, wherein the first contact layer has a plurality of row lines at a row spacing from one another, wherein the second contact layer has a plurality of column lines at a column spacing from one another, wherein the first contact layer and the second contact layer are arranged stacked, wherein each of the connection regions electrically conductively connects at least one row line to at least one column line, and wherein the row spacing deviates by less than 50% from the column spacing.

A micro light-emitting element includes a substrate and at least one micro light-emitting diode. Each micro light-emitting diode includes a semiconductor epitaxial stacked layer, which includes a first-type semiconductor layer, an active layer and a second-type semiconductor layer, and comprises a first surface and a second surface; the first surface is located on a side near the first-type semiconductor layer, the second surface is located on a side near the second-type semiconductor layer, and the first surface faces towards the substrate; and an adhesive film layer, which is located between the substrate and the semiconductor epitaxial stacked layer. An etching protective layer is disposed between the adhesive film layer and the first surface. The micro light-emitting element can reduce damage to the semiconductor epitaxial stacked layer during a residual adhesive removing process after laser lifting-off of each micro light-emitting diode, thus improving reliability of the micro light-emitting element.

The micro LED array electronic device suggested in one example of the present invention is a micro LED array comprising a plurality of light emitting devices arranged in columns and rows, which comprises two electrodes formed extending in one direction on a substrate; and cured polymers that fill the gap between the electrodes and vertically spaced electronic devices and comprises ferromagnetic particles, wherein the gap between the plurality of electronic devices is 5 m or more and 100 m or less.

A semiconductor device includes: a first light-emitting unit and a second light-emitting unit, wherein: the first light-emitting unit includes: a first lower semiconductor stack, including a first sub-sidewall; a first upper semiconductor stack, formed on the first lower semiconductor stack, including a second sub-sidewall; and a first sidewall, including the first sub-sidewall and the second sub-sidewall; wherein the first lower semiconductor stack includes a first upper surface not covered by the first upper semiconductor stack; the second light-emitting unit includes: a second lower semiconductor stack; a second upper semiconductor stack formed on the second lower semiconductor stack; wherein the second lower semiconductor stack includes a second upper surface not covered by the second upper semiconductor stack; a connecting electrode, formed on the first light-emitting unit and the second light-emitting unit and contacting the second upper surface to electrically connect the first light-emitting unit and the second light-emitting unit; and a first contact electrode, formed on the first upper surface and electrically connected to the first lower semiconductor stack, including a fist contact pad; wherein: the first sub-sidewall and the second sub-sidewall are directly connected to form a first slope; and in a top view, the second upper surface surrounds the second upper semiconductor stack.

A display panel includes a substrate, electronic elements, first electrodes, and connection lines. The substrate includes a first main surface and a second main surface, and multiple side surfaces connecting the two main surfaces. At least one side surface is a selected side surface. Each connection line includes a first line segment, a second line segment and a third line segment. The third line segment is disposed on the second main surface, and includes a bonding portion and a non-binding portion, the bonding portion being farther away from the selected side surface relative to the non-binding portion. A maximum dimension of the bonding portion in a direction perpendicular to an extension direction thereof is less than a maximum dimension of the non-bonding portion in a direction perpendicular to an extension direction thereof. Bonding portions of third line segments are used for bonding a circuit board.

A lighting device disclosed in an embodiment of the invention includes a heat dissipation plate having a recess portion; a circuit board accommodated in the recess portion of the heat dissipation plate and having pads; a light source portion having bonding pads; connection members respectively connecting between the pads and the bonding pads; and an adhesive member that adheres the light source portion to the heat dissipation plate. The light source portion includes a support member; light emitting devices having light emitting chips and a wavelength conversion layer; and a resin member. Each of the connection members has a ribbon shape, and a width of each of the connection members is more than twice the thickness of each of the connection members, and each of the connection members may include two ends respectively connected to the bonding pads and the pads, and a center portion extending convexly between the two ends.

In an embodiment an optoelectronic arrangement includes a carrier, at least one optoelectronic device configured to emit light through at least one emission surface and including at least one side edge and a center with a rotational axis substantially perpendicular to the at least one emission surface, and a breakable anchoring structure coupling the at least one optoelectronic device to the carrier on a surface facing away the at least one emission surface and including a first main surface that is at least partially attached to the at least one optoelectronic device, wherein the first main surface is displaced with respect to the center and includes a corner facing the center with a smallest distance to it, and wherein the first main surface comprises a triangular shape with an angle at the corner of less than 60 or wherein the first main surface comprises a non-rectangular shape that is symmetrical along an axis through the corner and the center.

A light-emitting device includes a substrate; a frame disposed on an upper surface of the substrate; a first light-emitting element disposed on the upper surface of the substrate and within a first region along an inner periphery of the frame; a second light-emitting element disposed on the upper surface of the substrate and within a second region surrounded by the first region; a wall part disposed on the upper surface of the substrate, contacting the frame, and extending from the inner periphery of the frame toward the second region; a wavelength conversion member disposed on the upper surface of the substrate and within a region surrounded by the frame, and covering the wall part, the first light-emitting element, and the second light-emitting element; and a circuit including a first drive circuit that drives the first light-emitting element and a second drive circuit that drives the second light-emitting element.

A light-emitting device includes a substrate; a first frame disposed on the substrate; a second frame disposed on the substrate and inward of the first frame; a first light-emitting element disposed on the substrate and between the first and second frames; a second light-emitting element disposed on the substrate and inward of the second frame; a first wavelength conversion member disposed on the substrate and within a region surrounded by the first frame, and covering the second frame, the first light-emitting element, and the second light-emitting element; and a circuit including a first drive circuit that drives the first light-emitting element and a second drive circuit that drives the second light-emitting element. The first wavelength conversion member includes a phosphor-containing portion, phosphor particles are present predominantly on a substrate side of the phosphor-containing portion, and a height of the second frame is less than a thickness of the phosphor-containing portion.

A semiconductor light emission element includes: a substrate having insulating or semi-insulating properties; a light-emitting functional layer where a first semiconductor layer having a first polarity, a light emission layer, and a second semiconductor layer having a second polarity are sequentially laminated on the substrate; an insulating film covering the light-emitting functional layer; a first pad electrode and a second pad electrode electrically connected to the first semiconductor layer and the second semiconductor layer, respectively, and at least one intermediate pad electrically insulated from the light-emitting functional layer, the first, second, and at least one intermediate pads being provided on the insulating film; and a pad separation groove separating each of the first pad electrode, the second pad electrode, and the intermediate pad, and exposing the insulating film.