A method of manufacturing a wiring board includes: providing a substrate including an insulating resin and a metal member provided with an anti-rust layer on a surface facing a second surface of the insulating resin; forming a plurality of first holes passing through the metal member by etching; forming a second hole passing through the insulating resin and communicating with at least one of the first holes from a first surface side of the insulating resin; and filling an electroconductive paste to connect the second hole with any of the plurality of first holes and disposing the electroconductive paste on the first surface of the insulating resin to form wiring continuous with the filled electroconductive paste, the anti-rust layer on the surface of the metal member being removed from an inner bottom surface of the second hole in the forming of the second hole.

An electronic device includes a first substrate, a first circuit layer, a second circuit layer, a side circuit layer, a light-shielding layer, a protective layer, and a circuit board. The first substrate has a first surface, a second surface, and a side surface. The first surface is opposite to the second surface. The side surface connects the first surface and the second surface. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The side circuit layer is disposed on the side surface and electrically connected to the first circuit layer and the second circuit layer. The light-shielding layer is disposed on the side circuit layer. The protective layer is disposed on the light-shielding layer and the second circuit layer, and continuously extends from the side surface to the second surface. The protective layer includes an opening exposing a portion of the second circuit layer. The circuit board is electrically connected to the second circuit layer through the opening.

A display device and a method for manufacturing the same are provided. A light-emitting element includes semiconductor layers including a first semiconductor layer, an active layer, a second semiconductor layer, and a third semiconductor layer, and defining at least one concave groove that is concave downwardly from one surface of the first semiconductor layer, a first protective layer on side surfaces of the semiconductor layers, on a top surface of the first semiconductor layer, and on inner surfaces of the semiconductor layers and on the third semiconductor layer in the concave groove, and a wavelength conversion layer containing wavelength conversion particles in the concave groove.

A display device includes a circuit substrate, a blocker, a first and second pad located on the circuit substrate, a light-emitting element, and a first and second connecting portion. The blocker is located on the circuit substrate, and has an opposite first and second side and an opposite third and fourth side. The first pad is adjacent to the first side of the blocker. The second pad is adjacent to the second side of the blocker. The light-emitting element is located on the blocker and the first and second pads, and includes a first and second electrode. The first connecting portion is connected to the first electrode and the first pad. The second connecting portion is connected to the second electrode and the second pad. The third and fourth sides of the blocker are aligned with a side of each of the first and second connecting portions.

An integrated circuit package includes a substrate having a first surface and a second surface. An electronic integrated circuit chip has a first surface and a second surface, with the second surface mounted on the first surface of the substrate. A preformed glass cover is assembled on the first surface of the substrate and arranged to contain the electronic integrated circuit chip.

Provided is a wiring substrate. The wiring substrate includes a base substrate, a plurality of first units, a plurality of second pad regions, and a plurality of common voltage signal lines. Each of the plurality of first units includes a plurality of first pad regions, and each of the plurality of first pad regions includes at least one first pad group. Each of the second pad regions includes a plurality of second pads including ground pads and output pads. The plurality of common voltage signal lines are arranged along a first direction and extend along a second direction. The common voltage signal line travels through the first unit and the second pad region. Each of the plurality of common voltage signal lines includes a plurality of first portions and a plurality of second portions. The first portions and the second portions are connected successively in the second direction.

A semiconductor device arrangement includes a carrier, a semiconductor device located on the carrier and an adhesive portion between the carrier and the semiconductor device. The semiconductor device includes a semiconductor stack, a first electrode, a second electrode, a first electrical connection and a second electrical connection. The first electrode is located between the semiconductor stack and the first electrical connection, and both of the first electrical connection and the second electrical connection are arranged to face the carrier. The adhesive portion includes a first protruding portion and a second protruding portion. The first protruding portion and the second protruding portion are respectively connected with the first electrical connection and the second electrical connection. The uppermost surfaces of the first electrical connection and the second electrical connection are located at different elevations, and at least one of the first and second electrical connections is located below the semiconductor stack.

Provided is a light string with reduced power consumption and improved brightness, including: at least a first LED luminous body and a second LED luminous body in parallel, wherein each LED luminous body includes at least a resistor, a first LED light emitting chip and a second LED light emitting chip, and each LED luminous body is free of being provided with a current limiting IC chip, wherein the first LED light emitting chip and the second LED light emitting chip each include a plurality of LED light beads of the same specification in series, the first LED light emitting chip includes m LED light beads in series, and the second LED light emitting chip includes n LED light beads in series, and the resistor is in a series relationship with the first LED light emitting chip and the second LED light emitting chip.

The present disclosure provides an optoelectronic device including a base, a light-emitting chip, an interposer, a wavelength conversion member and a wall portion. The base includes a base portion and a conductive portion, and the conductive portion comprises a plurality of coupling surfaces. The base portion covers the conductive portion and exposes the coupling surfaces. The light-emitting chip and the interposer are provided on the base, and having a top surface. The interposer covers the light-emitting chip and exposes the top surface. The wavelength conversion member covers the light-emitting chip and the interposer, and the wavelength conversion member includes an emitting surface. The wall portion is provided on the base. The wall portion covers the interposer and the wavelength conversion member, and exposes the emitting surface of the wavelength conversion member. The emitting surface is parallel to the top surface, and perpendicular to the coupling surfaces.

A display device can include a substrate having a plurality of first sub pixels and a plurality of second sub pixels, a plurality of first light emitting diodes disposed in the plurality of first sub pixels and configured to emit light to one surface of the substrate, and a plurality of second light emitting diodes disposed in the plurality of second sub pixels and configured to emit light to an opposite surface to one surface of the substrate. The plurality of first light emitting diodes and the plurality of second light emitting diodes are alternately disposed on the plane. Accordingly, light is emitted to opposite surfaces of the substrate to display images on the opposite surfaces of the substrate.