A transparent display device is provided, which comprises a display area in which a plurality of subpixels are disposed to display an image, a plurality of transmissive areas disposed within the display area and transmitting external light, a first non-transmissive area disposed between the transmissive areas disposed to be adjacent to each other in a first direction and not transmitting external light, a second non-transmissive area disposed between the transmissive areas disposed to be adjacent to each other in a second direction and not transmitting external light, a first circuit portion disposed in the first non-transmissive area to drive the subpixel disposed in the first non-transmissive area, and a second circuit portion disposed in the second non-transmissive area to drive the subpixel disposed in the second non-transmissive area.

A display apparatus includes: a substrate; a first wiring on the substrate; and a second wiring on the first wiring and electrically connected to the first wiring, wherein the first wiring and the second wiring comprise an overlapping area in which the first wiring overlaps the second wiring in a plan view, and at least one of the first wiring or the second wiring comprises an opening in the overlapping area.

A display apparatus includes: a substrate; a first wiring on the substrate; and a second wiring on the first wiring and electrically connected to the first wiring, wherein the first wiring and the second wiring comprise an overlapping area in which the first wiring overlaps the second wiring in a plan view, and at least one of the first wiring or the second wiring comprises an opening in the overlapping area.

The light emitting device includes a light emitting portion and an electrode portion each including an epi structure and separated from each other by a trench. The epi structure includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer which are sequentially stacked. A first contact layer and a second contact layer are respectively on the second conductive semiconductor layers of the light emitting portion and the electrode portion. A passivation layer is provided on side surfaces of the light emitting portion and the electrode portion, and the first contact layer and the second contact layer. An opening exposing the first contact layer of the light emitting portion is formed in the passivation layer. A conductive reflective layer is provided on the passivation layer and contacts the first contact layer of the light emitting portion through the opening. A plurality of pores are provided in the first conductive semiconductor layer.

The light emitting device includes a light emitting portion and an electrode portion each including an epi structure and separated from each other by a trench. The epi structure includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer which are sequentially stacked. A first contact layer and a second contact layer are respectively on the second conductive semiconductor layers of the light emitting portion and the electrode portion. A passivation layer is provided on side surfaces of the light emitting portion and the electrode portion, and the first contact layer and the second contact layer. An opening exposing the first contact layer of the light emitting portion is formed in the passivation layer. A conductive reflective layer is provided on the passivation layer and contacts the first contact layer of the light emitting portion through the opening. A plurality of pores are provided in the first conductive semiconductor layer.

A light source includes a substrate, a light-emitting device, and a first bonding member. The first bonding member is disposed between a first electrode of the light-emitting device and a first upper surface of a first metal member of the substrate to bond the first electrode and the first metal member, and is disposed between a second electrode of the light-emitting device and a second upper surface of a second metal member of the substrate to bond the second electrode and the second metal member. An upper portion of the insulating member of the substrate is located between the first electrode and the second electrode of the light-emitting device. Each of the first lower surface of the first metal member, the second lower surface of the second metal member, and the lower portion of the insulating member is exposed.

A light source includes a substrate, a light-emitting device, and a first bonding member. The first bonding member is disposed between a first electrode of the light-emitting device and a first upper surface of a first metal member of the substrate to bond the first electrode and the first metal member, and is disposed between a second electrode of the light-emitting device and a second upper surface of a second metal member of the substrate to bond the second electrode and the second metal member. An upper portion of the insulating member of the substrate is located between the first electrode and the second electrode of the light-emitting device. Each of the first lower surface of the first metal member, the second lower surface of the second metal member, and the lower portion of the insulating member is exposed.

Provided is a display apparatus including a display area and a non-display area outside the display area, wherein the display apparatus includes a plurality of pixels arranged in the display area, each of the plurality of pixels including a transistor and a light-emitting diode electrically connected to the transistor, a connection line arranged in the display area, the connection line electrically connecting adjacent pixels from among the plurality of pixels to each other, and a peripheral line arranged in the non-display area, wherein a modulus of a conductive layer of the transistor is greater than a modulus of the connection line, and the modulus of the connection line is greater than a modulus of the peripheral line.

Provided is a display apparatus including a display area and a non-display area outside the display area, wherein the display apparatus includes a plurality of pixels arranged in the display area, each of the plurality of pixels including a transistor and a light-emitting diode electrically connected to the transistor, a connection line arranged in the display area, the connection line electrically connecting adjacent pixels from among the plurality of pixels to each other, and a peripheral line arranged in the non-display area, wherein a modulus of a conductive layer of the transistor is greater than a modulus of the connection line, and the modulus of the connection line is greater than a modulus of the peripheral line.

A method of manufacturing a display device includes a step of attaching a plurality of LED elements to an adhesive resin layer of a transfer substrate and a step of applying a thermal treatment to a plurality of bump electrodes, whereby electrodes of the plurality of LED elements are bonded to the plurality of bump electrodes of an array substrate. The array substrate has a mounting region to which the plurality of LED elements are mounted from the transfer substrate. Planar areas of the bump electrodes provided in a peripheral edge portion of the mounting region are larger than a planar area of the bump electrode provided in a central portion of the mounting region.