A display device includes a display panel including a plurality of sub pixels, each of the plurality of sub pixels including a light emitting diode on a substrate; a passivation layer on the substrate and at least partly covering a lateral side surface of the light emitting diode; and a protection layer on the passivation layer and at least partly covering a lateral side surface of the passivation layer, wherein a lateral end of the passivation layer in a first direction is disposed under the protection layer to form an undercut structure under the protection layer. Accordingly, an undercut structure is formed in a boundary area between the plurality of sub pixels to minimize or suppress a defect of pixel electrodes of the plurality of sub pixels being connected to each other.

A window protective film includes: a shock absorbing layer including acrylic resin and having a modulus of about 300 MPa or less; a base layer located on the shock absorbing layer; and a hard coating layer located on the base layer.

A display device may include a substrate, a plurality of inorganic light-emitting elements disposed on the substrate, a first optical layer disposed around the plurality of inorganic light-emitting elements, a second optical layer disposed on the plurality of inorganic light-emitting elements and the first optical layer, and a first passivation layer disposed on the first optical layer such that the first passivation layer is farther from the substrate than the first optical layer.

The disclosure discloses a display device. The disclosure includes a substrate, a circuit layer on the substrate, and a plurality of banks on the circuit layer. One or more light-emitting elements, each having a first electrode and a second electrode, are disposed one-to-one on the banks. A contact electrode is on the circuit layer, spaced apart from the banks. A first optical layer covers the banks and the light-emitting elements on the banks. A second optical layer covers the first optical layer and includes a contact hole that exposes a portion of the contact electrode. The structure is configured such that, when the distance between the bank and the first optical layer on a surface of the circuit layer is defined as 1, the distance between the first optical layer and the contact hole on the same surface ranges from 0.5 to 2.5, thereby supporting improved structural integrity and reliability.

An electronic device includes a display element layer including a pixel-defining film and a light-emitting element, and a light control layer disposed on the display element layer. The light control layer includes an organic film in which a first region and a second region spaced apart from each other in one direction perpendicular to a thickness direction of the electronic device are defined, a light blocking part disposed in the first region, and an optical pattern disposed in the second region. A first width of the organic film progressively decreases away from the display element layer along the thickness direction, a second width of the light blocking part progressively increases away from the display element layer along the thickness direction, and the first width and the second width are in the one direction.

A method of manufacturing a display device includes forming a release frame exposing an uppermost surface of a display stack, wherein the display stack includes a first stack and a second stack sequentially stacked, and the uppermost surface of the display stack is an upper surface of the second stack, applying a first curable resin on the upper surface of the second stack and the release frame adjacent thereto, forming a flexible coating layer on the second stack by curing the first curable resin, and removing the release frame.

A display device according to embodiments of the present disclosure may include a substrate, an insulating layer disposed on the substrate, a first light emitting device disposed on the insulating layer, a first optical layer surrounding a side surface of the first light emitting device, a second optical layer disposed on a side surface of the first optical layer, and a mirror wall disposed between the first optical layer and the second optical layer.

A method of manufacturing a photonic device including the following steps: providing a structure including a base substrate covered by (Al,In,Ga)N/(Al,In,Ga)N mesas, a first mesa being fully porosified and having flanks covered by a protective layer, a second mesa being non-porosified, and a third mesa including porosified flanks and a non-porosified central portion, epitaxially growing an active structure including InGaN-based quantum wells simultaneously on the first mesa, the second mesa, and the third mesa, to respectively form a first active structure emitting at a first wavelength, a second active structure emitting at a second wavelength, and a third active structure emitting at a third wavelength.

Embodiment relates to a semiconductor light emitting device for a display pixel and a display device including the same. A semiconductor light emitting device for a display pixel according to an embodiment includes a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, the first conductivity type semiconductor layer in the semiconductor light emitting device for a display pixel, a first contact electrode electrically connected to, a metal layer disposed under the first conductivity-type semiconductor layer, a second contact electrode disposed on the second conductivity-type semiconductor layer, and a passivation disposed on the light emitting structure may contain layers. The metal layer may include a magnetic material, and a weight ratio of the magnetic material to the weight of the semiconductor light emitting device may be 0.25% to 36.75%.

Disclosed herein may be a display device including a display panel, the display panel including: a substrate; an insulating layer located on the substrate; a plurality of first electrodes arranged on the insulating layer; a plurality of light-emitting elements arranged on the plurality of first electrodes; a plurality of second electrodes arranged on the plurality of light-emitting elements; an optical layer enclosing the plurality of light-emitting elements; a cover layer located on the optical layer; at least one pattern located on the cover layer; a cover adhesive layer covering the at least one pattern; and a cover located on the cover adhesive layer. The cover may include a planar area, and a curved area formed around the planar area.