This application provides a pixel unit, a manufacturing method therefor, a microdisplay, and a pixel-level discrete device. The pixel unit includes a backplane and a display unit. The display unit is arranged on the backplane, and includes a first device layer and a second device layer. The first device layer includes a first compound light-emitting layer and a second compound light-emitting layer. The second device layer includes a color conversion layer and a third compound light-emitting layer. The color conversion layer is arranged above the first compound light-emitting layer. The color conversion layer is arranged, so that the compound light-emitting layer can implement color development through color conversion, to reduce power and improve performance. The pixel unit occupies less space in the horizontal direction. A decrease in external quantum efficiency caused by a size effect is effectively reduced, power consumption is effectively reduced, and performance such as brightness is improved.

In an embodiment a display unit includes a first contact layer, a second contact layer, a plurality of connection region and a plurality of optoelectronic semiconductor components, wherein the first contact layer has a plurality of row lines at a row spacing from one another, wherein the second contact layer has a plurality of column lines at a column spacing from one another, wherein the first contact layer and the second contact layer are arranged stacked, wherein each of the connection regions electrically conductively connects at least one row line to at least one column line, and wherein the row spacing deviates by less than 50% from the column spacing.

Selective bonding integrates semiconductor devices onto a receiver substrate. A laser releases devices from a substrate according to a pattern. The pattern syncs laser frequency and speed/location of the stage with the receiver substrate, or uses a diffractive optical element and pottering, or masks the emitted laser to a desired size/shape. Laser steering employs digital micromirror devices or fast scanning mirrors followed by an f-theta lens. Sequential selective bonding and laser processing enables full-colour display by transferring violet or blue micro-LEDs and employing colour-conversion layers or sequentially patterning red, green, and blue sub-pixels. The same method transfers driving circuits onto a substrate. A pattern from defective devices is generated after test and used for repair. A second round prints micro-devices onto pads in or beside defective devices. Sidewalls coated with a reflective layer stops crosstalk between pixels, improves light-extraction efficiency, improves emission angle, and provides a uniform light pattern.

The micro LED array electronic device suggested in one example of the present invention is a micro LED array comprising a plurality of light emitting devices arranged in columns and rows, which comprises two electrodes formed extending in one direction on a substrate; and cured polymers that fill the gap between the electrodes and vertically spaced electronic devices and comprises ferromagnetic particles, wherein the gap between the plurality of electronic devices is 5 m or more and 100 m or less.

A display panel includes a substrate, electronic elements, first electrodes, and connection lines. The substrate includes a first main surface and a second main surface, and multiple side surfaces connecting the two main surfaces. At least one side surface is a selected side surface. Each connection line includes a first line segment, a second line segment and a third line segment. The third line segment is disposed on the second main surface, and includes a bonding portion and a non-binding portion, the bonding portion being farther away from the selected side surface relative to the non-binding portion. A maximum dimension of the bonding portion in a direction perpendicular to an extension direction thereof is less than a maximum dimension of the non-bonding portion in a direction perpendicular to an extension direction thereof. Bonding portions of third line segments are used for bonding a circuit board.

In an embodiment an optoelectronic arrangement includes a carrier, at least one optoelectronic device configured to emit light through at least one emission surface and including at least one side edge and a center with a rotational axis substantially perpendicular to the at least one emission surface, and a breakable anchoring structure coupling the at least one optoelectronic device to the carrier on a surface facing away the at least one emission surface and including a first main surface that is at least partially attached to the at least one optoelectronic device, wherein the first main surface is displaced with respect to the center and includes a corner facing the center with a smallest distance to it, and wherein the first main surface comprises a triangular shape with an angle at the corner of less than 60 or wherein the first main surface comprises a non-rectangular shape that is symmetrical along an axis through the corner and the center.

A method of manufacturing a wiring board includes: providing a substrate including an insulating resin and a metal member provided with an anti-rust layer on a surface facing a second surface of the insulating resin; forming a plurality of first holes passing through the metal member by etching; forming a second hole passing through the insulating resin and communicating with at least one of the first holes from a first surface side of the insulating resin; and filling an electroconductive paste to connect the second hole with any of the plurality of first holes and disposing the electroconductive paste on the first surface of the insulating resin to form wiring continuous with the filled electroconductive paste, the anti-rust layer on the surface of the metal member being removed from an inner bottom surface of the second hole in the forming of the second hole.

An electronic device includes a first substrate, a first circuit layer, a second circuit layer, a side circuit layer, a light-shielding layer, a protective layer, and a circuit board. The first substrate has a first surface, a second surface, and a side surface. The first surface is opposite to the second surface. The side surface connects the first surface and the second surface. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The side circuit layer is disposed on the side surface and electrically connected to the first circuit layer and the second circuit layer. The light-shielding layer is disposed on the side circuit layer. The protective layer is disposed on the light-shielding layer and the second circuit layer, and continuously extends from the side surface to the second surface. The protective layer includes an opening exposing a portion of the second circuit layer. The circuit board is electrically connected to the second circuit layer through the opening.

A display panel includes an integrated circuit substrate, a light-emitting device layer and a second electrode. The light-emitting device layer includes light-emitting devices disposed respectively in light-emitting areas and insulating layers disposed respectively in insulating barrier areas, and each insulating barrier area is disposed between two adjacent light-emitting areas. Each insulating layer has opposite ends respectively connected to the second electrode and the integrated circuit substrate and each light-emitting device is surrounded by several insulating layers, so that the several insulating layers, the second electrode and the integrated circuit substrate together form a closed accommodating chamber for accommodating the light-emitting device.

A wiring substrate includes a plurality of functional units arranged in an array. Each of the functional units includes: a plurality of first pad groups arranged along a first direction, and a second pad group located at a side of the plurality of the first pad groups along the second direction. The second pad group includes a plurality of channel pads and at least two functional pads, and a quantity of pads in the second pad group is even and the pads in the second pad group are arranged at intervals in a 2*N array. The plurality of channel pads are arranged at intervals along a same direction in a first line and are respectively connected one-to-one with a plurality of first pad groups of which a quantity is same as a quantity of the plurality of the channel pads.