A light-emitting array includes a semiconductor LED structure, multiple outcoupling structures, multiple independent first electrical contacts, and second electrical contact(s). The LED structure extends contiguously over the array. The second electrical contacts are in electrical contact with the second semiconductor layer. Each outcoupling structure is a protruding portion of the second semiconductor layer. Each first electrical contact includes a circumscribed electrode layer opposite a corresponding outcoupling structure. Each outcoupling structure and corresponding first electrical contact define a corresponding discrete, circumscribed pixel region within the contiguous area of the array, each pixel region separate from the others. Some light emitted in the pixel region is collected or redirected by the outcoupling structure to exit the outcoupling structure and propagate away from the array.

A light emitting diode (LED) display device includes: a first electrode layer and a second electrode layer disposed to be spaced apart from each other on a substrate; a plurality of micro-LED elements stacked in a longitudinal direction to be parallel to a plane of the substrate on the first electrode layer and the second electrode layer and stacked to be spaced apart from each other; and a first connection electrode coupled to both ends of the plurality of micro-LED elements and extending from one ends of the plurality of micro-LED elements to the first electrode layer and a second connection electrode extending from the other ends of the plurality of micro-LED elements to the second electrode layer and connected to the second electrode layer.

A placement member includes a first surface; a plurality of electrode members arranged on the first surface, and including a first electrode member and a second electrode member that are spaced apart from each other; and a plurality of identification marks configured to identify a reference line for alignment, and including a first identification mark provided on a first electrode member side of the placement member and a second identification mark provided on a second electrode member side of the placement member, the first identification mark and the second identification mark being configured to aid in distinguishing between the first electrode and the second electrode, wherein a shape of the first identification mark and a shape of the second identification mark are different from each other.

A chip including: four connection pads receiving respectively a supply voltage, a reference voltage, a first data signal, and a second data signal; at least two pixels; at least two drivers, each driver being configured to control one of the pixels, the drivers being coupled in a sequence; each driver including a first input and a first output, the first output of each driver being coupled to the first input of the following driver in the sequence, each driver being configured, in a programing step, to be programmed by storing digital data from the second data signal, and, in a display step, to drive one of the pixels from the stored digital data and from the first data signal.

A display device includes: a substrate; a pixel circuit layer on the substrate; a first connection electrode and a second connection electrode on the pixel circuit layer; a first bump on the first connection electrode, and a second bump on the second connection electrode, the first bump and the second bump including materials having different elastic moduli; and a light-emitting element including a first electrode electrically connected to the first connection electrode and a second electrode electrically connected to the second connection electrode.

A method includes transferring a first subset of the first LEDs from a first substrate to a first backplane to form first subpixels in pixel regions, transferring a first subset of the second LEDs to a second backplane and separating the first subset of the second LEDs from a second substrate to leave first vacancies on the second substrate, forming an additional electrically conductive material on a second subset of second LEDs located on the second substrate after transferring the first subset of the second LEDs to the second backplane, positioning the second substrate over the first backplane, such that the first subpixels are disposed in the first vacancies, and transferring the second subset of the second LEDs to a second subset of bonding structures on the first backplane to form second subpixels in the pixel regions, while a gap exists between the first subpixels and the second substrate.

A display panel includes a substrate, a transistor provided on the substrate, a first protective structure, an electroless nickel immersion gold terminal, and a second protective structure. The first protective structure is provided on a side of the insulation dielectric layer away from the substrate, and the first protective structure is provided with a through hole. The electroless nickel immersion gold terminal is provided on a side of the first protective structure away from the substrate, and the electroless nickel immersion gold terminal is connected to the first pole through the through hole. The second protective structure is provided on a side of the first protective structure away from the first protective structure, and the second protective structure is opened with a groove, and the groove exposes at least a portion of the electroless nickel immersion gold terminal.

A manufacturing method of a display device includes providing a plurality of pad electrodes exposed through an opening defined through a base layer and arranged in a first direction and a plurality of bump electrodes on the pad electrodes overlapping the pad electrodes, respectively, when viewed in a plane, placing a preliminary metal layer having a substantially non-uniform thickness in a second direction intersecting the first direction on the pad electrodes and the bump electrodes, placing a mold on the preliminary metal layer to form a metal layer with a flat upper surface, and irradiating a laser to a first portion of the metal layer, the first portion of the metal layer not overlapping the pad electrodes and the bump electrodes, to form a plurality of metal patterns. The pad electrodes are electrically connected to the bump electrodes by (via) the metal patterns.

A wafer includes: a substrate; a plurality of light emitting elements on the substrate, each of the plurality of light emitting elements includes a semiconductor stack, a first contact electrode, and a second contact electrode; a plurality of pin pads on the substrate and including a semiconductor stack; and a plurality of connectors connecting different pin pads to each of the first contact electrode and the second contact electrode of a light emitting element from among the plurality of light emitting elements.

Provided is a micro-light emitting diode (micro-LED) pixel including a first micro-LED, a second micro-LED on the first micro-LED, a level of the first micro-LED and a level of the second micro-LED being different from each other in a vertical direction, and a first reflective layer on the first micro-LED opposite to the second micro-LED, the first reflective layer being configured to reflect light incident from at least one of the first micro-LED and the second micro-LED in a direction opposite to the incident direction, wherein on a plane from a top plan view, a size of the first micro-LED and a size of the second micro-LED are different from each other in a horizontal direction, and wherein the first micro-LED and the second micro-LED are aligned in vertical direction corresponding to a main emission direction of light.