A manufacturing method of electronic device includes: (a) providing a circuit substrate including: a substrate; a plurality of electronic units disposed on the substrate; and a first bonding member disposed on the substrate, wherein the first bonding member surrounds the electronic units; (b) respectively disposing a plurality of cover plates on at least part of the electronic units, and disposing a bonding material on the first bonding member, wherein one of the cover plates includes a second bonding member and, in the top view direction of the circuit substrate, the second bonding member overlaps at least part of the first bonding member, and the bonding material does not overlap the second bonding member; and (c) melting the bonding material to allow part of the bonding material to flow in between the first bonding member and the second bonding member.

A display device includes pixels including light-emitting elements disposed in each emission area. Each of the pixels includes at least one array including the light-emitting elements and disposed in the emission area, and a number of the light-emitting elements disposed in each of arrays of the pixels is greater than aa minimum number of the light-emitting elements in the each of the arrays having a normal distribution or Poisson distribution.

A display device includes a substrate including a display area and a non-display area, a plurality of pixel electrodes disposed on the substrate in the display area, light emitting elements each disposed on a corresponding one of the plurality of pixel electrodes, a common electrode disposed on the light emitting elements and commonly connected to a plurality of pixels, and an auxiliary electrode disposed on the common electrode and not overlapping with the light emitting elements in a thickness direction of the substrate.

A light emitting element is disclosed. The light emitting element may include: a first light emitting cell in a first pixel area, a second light emitting cell in the first pixel area on the first light emitting cell, and a third light emitting cell in a second pixel area spaced and/or apart (or spaced part or separated) from the first pixel area in a plan view. The first light emitting cell may be to emit first light. The second light emitting cell may be to emit second light having a wavelength that may be different from a wavelength of the first light. The third light emitting cell may be to emit third light having a wavelength that may be different from each of the wavelength of the first light and the wavelength of the second light.

Discussed is a display device and a method for manufacturing the display device, where the display device includes a substrate, a wiring electrode disposed on the substrate, semiconductor light emitting devices electrically connected to the wiring electrode, an anisotropic conductive layer disposed between the semiconductor light emitting devices and includes conductive particles and an insulating material, and a light-transmitting layer formed between the semiconductor light emitting devices, where the semiconductor light emitting devices includes first semiconductor light emitting devices emitting a first color and second semiconductor light emitting devices emitting a second color different from the first color, and where the first and second semiconductor light emitting devices are alternately disposed with each other.

A method for manufacturing a display module includes the steps of: transferring LEDs of a substrate to a first relay substrate; transferring the LEDs of the first relay substrate to a second relay substrate in a primary stretch array such that a gap between adjacent LEDs on the second relay substrate is greater than a gap between adjacent LEDs on the first relay substrate in one direction from among a row direction and a column direction; and transferring the LEDs of the second relay substrate to a target substrate in a secondary stretch array such that a gap between adjacent LEDs on the target substrate is greater than a gap between adjacent LEDs on the second relay substrate in a remaining direction from among the row direction and the column direction.

This application relates to a light-emitting device and a manufacturing method thereof, comprising a substrate, a plurality of light-emitting chips arranged on the front side of the substrate, and an encapsulation layer disposed on the substrate to cover each light-emitting chip. The encapsulation layer allows light emitted by the LED chips to pass through.

In an embodiment a method for producing at least one optoelectronic device includes providing a substrate body, providing a substrate frame on the substrate body, wherein the substrate frame comprises at least one recess, providing at least one optoelectronic component on the substrate body, wherein the substrate frame and the at least one optoelectronic component are placed in relation to one another such that the at least one optoelectronic component is arranged in the at least one recess and providing a filler material in the at least one recess such that the at least one optoelectronic component is covered by the filler material, wherein the filler material is provided by a casting process.

A chip including: four connection pads receiving respectively a supply voltage, a reference voltage, a first data signal, and a second data signal; at least two pixels; at least two drivers, each driver being configured to control one of the pixels, the drivers being coupled in a sequence; each driver including a first input and a first output, the first output of each driver being coupled to the first input of the following driver in the sequence, each driver being configured, in a programing step, to be programmed by storing digital data from the second data signal, and, in a display step, to drive one of the pixels from the stored digital data and from the first data signal.

A display device includes a substrate, a plurality of metal interconnects formed on the substrate, and a plurality of light-emitting elements disposed on the substrate. Each of the plurality of light-emitting elements includes a pair of electrode pads and is electrically connected to corresponding metal interconnects via the pair of electrode pads. A surface of each of the metal interconnects in an area where the light-emitting elements are not mounted is formed with an uneven shape for scattering external light.