A display device includes: a display panel including a first area, a second area formed to be bendable from the first area, and a third area extending from the second area; a driving chip in the third area; a connection substrate including a first hole overlapping the driving chip and a second hole overlapping the third area, and overlapping at least a portion of the third area; and a first resin layer in the second hole.

According to an embodiment of the disclosure, a display device, a resin composition, a method of manufacturing the display device, and an electronic device comprising the display device are provided. The display device includes a base layer, a conductive layer on the base layer, a via layer covering the conductive layer, an electrode layer disposed on the via layer and including a first electrode and a second electrode spaced apart from each other by a separation distance, and a light-emitting element between the first electrode and the second electrode. The conductive layer may be overlapped with the electrode layer in an overlapping area in a plane view. The via layer may have a medium thickness, which is equal to or more than 2 m, in the overlapping area. The separation distance may be equal to or more than 3.0 m.

A semiconductor structure includes packaging structures and a substrate. Each packaging structure includes a light-transmitting layer, micro-LED chips, a first insulating layer, redistribution layers, a second insulating layer, and conductive pieces. The micro-LED chips are on the light-transmitting layer and include an electrode surface and a light-emitting surface facing the light-transmitting layer. The first insulating layer is disposed on the light-transmitting layer and surrounds the micro-LED chips. The redistribution layers are disposed on the first insulating layer and pass through the first insulating layer to be electrically connected to the electrode surfaces. The second insulating layer is disposed on the first insulating layer. The conductive pieces are disposed on the second insulating layer, pass through the second insulating layer to be electrically connected to the redistribution layers, and are between the substrate and the micro-LED chips.

A manufacturing method includes providing a first substrate including a circuit layer and an electronic element disposed on the circuit layer, providing a second substrate, bonding the first substrate and the second substrate to form an electronic module, cutting the electronic module, forming a wire on a first surface exposed after cutting the electronic module and on a second surface of the electronic module, wherein the first surface is adjacent to the second surface and the wire is electrically connected to the circuit layer, and disposing a driving element on the second surface of the electronic module to be electrically connected to the wire.

A display device a method for manufacturing the same and the electronic device are provided. The display device includes a substrate, connection electrodes above the substrate, light-emitting elements respectively above the connection electrodes, and including a semiconductor stack including a first semiconductor layer, an active layer, and a second semiconductor layer, an etch-stop layer above the semiconductor stack, and an insulating layer surrounding a side surface of the semiconductor stack in plan view, and having one end substantially level with a top surface of the etch-stop layer, and a common electrode above the light-emitting elements.

A semiconductor structure, a semiconductor unit, and a formation method thereof are provided. The semiconductor structure includes a underlying layer, a supporting member, and a semiconductor device. The underlying layer has a protruding portion. The supporting member is disposed on the underlying layer. The supporting member includes a bonding portion, a connecting portion, and a carrying portion. The bonding portion is connecting to the protruding portion of the underlying layer. The connecting portion is located next to the bonding portion. The carrying portion is located next to the connecting portion. The semiconductor device is disposed on the carrying portion and exposes the bonding portion and the connecting portion. There is a gap between the carrying portion of the supporting member and the underlying layer.

A display device comprises a substrate comprising one or more LEDs and one or more waveguides. Each LED is capable of emitting light in a first direction towards a corresponding waveguide. The corresponding waveguide is capable of reflecting received light in a second direction towards a viewing surface of the display.

A display device includes a substrate, a pixel electrode disposed on the substrate, an organic layer disposed on the pixel electrode, a light emitting element disposed on the organic layer, including a semiconductor stack, a first protective layer, a contact electrode, and a second protective layer, a connection electrode connecting the light emitting element and the pixel electrode, wherein the first protective layer is an insulating protective layer, the second protective layer is a conductive protective layer, wherein the connection electrode and the second protective layer are etchable with the same etchant.

A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and a surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.

Embodiments of the present invention provide a wearable phototherapy device, comprising a flexible substrate supporting a plurality of light-emitting elements configured to emit therapeutic light of one or more wavelengths. The substrate conforms to a treatment surface and may be integrated into a mask, wrap, patch, or garment insert. A conductive thin-film layer with an integrated metal-grid structure limits current to the light-emitting elements. The elements are arranged in one or more treatment zones, each independently addressable to provide wavelength and intensity control. A connector assembly enables selective attachment and detachment of the substrate to a power and control module. The device provides uniform, targeted illumination for dermatological, cosmetic, or therapeutic applications while maintaining ergonomic comfort.