An electronic device includes a flexible substrate, a circuit layer, a first electronic unit and a second electronic unit. The flexible substrate includes a main portion and a curve portion connected to the main portion. The circuit layer is disposed on the flexible substrate, and includes a first pad disposed on the main portion and a second pad disposed on the curve portion. The first electronic unit is bonded on the first pad. The second electronic unit is bonded on the second pad. An area of the second pad is different from an area of the first pad.

A display device includes a pixel including an emission area and a non-emission area, a bank disposed in the non-emission area, an insulating layer disposed on the bank, light emitting elements disposed in the emission area, and connection electrodes electrically connected to the light emitting elements. The insulating layer overlaps a first area of the bank, and includes an opening exposing a second area of the bank in a plan view. The connection electrodes overlap the first area of the bank in a plan view.

Provided is a display substrate, including: a base substrate; a plurality of conductive patterns on base substrate; a plurality of light-emitting elements on base substrate, where the plurality of light-emitting elements are arranged in array and spaced apart from each other, and at least one light-emitting element includes a first electrode, a first type semiconductor layer, a light-emitting layer, a second type semiconductor layer, and a second electrode, first electrode is electrically connected to conductive pattern, first type semiconductor layer is located on a side of first electrode, light-emitting layer is located on a side of first type semiconductor layer, second type semiconductor layer is located on a side of light-emitting layer, and second electrode is located on a side of second type semiconductor layer; and a conductive light-shielding portion on base substrate, located in a gap between two adjacent light-emitting elements, and being electrically connected to second electrode.

A method for manufacturing a display module includes the steps of: transferring LEDs of a substrate to a first relay substrate; transferring the LEDs of the first relay substrate to a second relay substrate in a primary stretch array such that a gap between adjacent LEDs on the second relay substrate is greater than a gap between adjacent LEDs on the first relay substrate in one direction from among a row direction and a column direction; and transferring the LEDs of the second relay substrate to a target substrate in a secondary stretch array such that a gap between adjacent LEDs on the target substrate is greater than a gap between adjacent LEDs on the second relay substrate in a remaining direction from among the row direction and the column direction.

A method for manufacturing an individualized-piece-film that can obtain excellent workability of individualized pieces, an individualized-piece-film, and a display device. The method irradiates a laser light from a base material side to an anisotropic conductive film formed on a base material to remove the anisotropic conductive film in the irradiated area (removal portion), thereby forming individualized pieces of a predetermined shape. The thickness of the anisotropic conductive film is 1 m or more and 10 m or less, the melt viscosity of the anisotropic conductive film at 30 C. is 2,000 Pa*s or more and 800,000 Pa*s or less, and 90% or more of the conductive particles in the anisotropic conductive film are present at an average of the center positions of the conductive particles in the thickness direction of the anisotropic conductive film.

An assembling substrate which serves to assemble a plurality of light-emitting elements. The assembling substrate includes an assembly substrate, a plurality of first assembling electrodes disposed on the assembly substrate, a plurality of second assembling electrodes disposed on the assembly substrate and configured to face the plurality of first assembling electrodes at predetermined intervals, and an organic layer disposed on the assembly substrate and including a plurality of opening portions, wherein some of the plurality of first assembling electrodes include a plurality of first holes disposed to overlap the plurality of opening portions, wherein some of the plurality of second assembling electrodes include a plurality of second holes disposed to overlap the plurality of opening portions, and, wherein the plurality of first holes and the plurality of second holes are disposed to overlap the opening portions of some of the plurality of opening portions.

A pixel structure for improving light emitting efficiency is disclosed in the present disclosure. The pixel structure includes a pixel lens, a negative electrode pad layer, a conductive semiconductor layer, a quantum well, an isolation layer, a positive electrode layer, a dielectric layer and an integrated circuit (IC) chip layer from top to bottom, and the quantum well is arranged inside the conductive semiconductor layer. A three-surface covering reflective layer is arranged between the lower surface of the conductive semiconductor layer and the top of the positive electrode layer. The conductive semiconductor layer comprises an inverted trapezoidal semiconductor part and a continuous planarization layer. The bevels on the two sides of the inverted trapezoidal semiconductor part converge and reflect the light emitted by the quantum well in the direction of the pixel lens. And the negative electrode pad layer is arranged on the continuous planarization layer.

The display device may include a substrate, a first assembly wiring and a second assembly wiring on the substrate, an insulating layer having a recess on the first assembly wiring and the second assembly wiring, a partition wall disposed on the first assembly wiring and the second assembly wiring and having an assembly hole that is in contact with the recess, a semiconductor light-emitting element in the assembly hole, a fixing member in the recess, and a connection electrode between an outer side of the semiconductor light-emitting element and an inner side of the assembly hole. The fixing member and the connection electrode may include an aggregate of lumps in which a plurality of conductive nanoparticles are entangled with each other.

A method for manufacturing a ceramic sintered body substrate includes preparing a ceramic substrate 1 provided with a through hole 2 before firing (S11), disposing a first metal paste 3 in the through hole (S12), and firing the ceramic substrate provided with the first metal paste (S14). In the disposing of the first metal paste, the first metal paste includes a plurality of particles of first metal powder (4) and a plurality of particles of active metal powder (50), and the first metal powder includes a metal powder (4a) serving as a core, and a covering metal member (40b) having a melting point lower than a melting point of the metal powder and covering at least a part of the metal powder, and in the firing of the ceramic substrate, a firing temperature is a temperature in a range from 700 C. to less than the melting point of the metal powder.

In an embodiment a method includes providing a carrier having an electronic semiconductor chip arranged on the carrier, providing a substrate having a functional layer arranged on the substrate, arranging the substrate over the carrier such that the functional layer faces toward the electronic semiconductor chip, and pressing the substrate onto the carrier, wherein the functional layer is pressed onto the electronic semiconductor chip so that the electronic semiconductor chip is pressed onto the carrier and connected to the carrier, and wherein the functional layer is deformed in response to pressing the electronic semiconductor chip.