The present invention is applicable to the technical field of display devices and relates to a display device which uses, for example, a light-emitting diode (LED). To achieve the aforementioned objective, the present invention comprises: a wiring board; a light-emitting element which is composed of individual pixels and arranged on the wiring board; an insulation layer which is located at least on a side surface of the light-emitting element; and a black-colored layer which is located on the insulation layer, wherein the black-colored layer may include a material formed by modifying the material constituting the insulation layer.

The present application provides a display panel, a manufacturing method thereof, and a display device. By defining a first height difference between a first terminal part and a second terminal part of a first bonding terminal, so that after attaching a protective layer, a suspended area is defined between the protective layer and the first terminal part, so that when preparing a surrounding wire, a metal conductive thin film is disconnected in the suspended area, thus the surrounding wire will not be lifted when the protective layer is removed, so as to alleviate a problem of peeling of a surrounding wire of existing display panels when removing a protective layer.

Provided are a method for manufacturing a display panel, a display panel and a display device, which relate to the field of display technology and are used to optimize the performance of the display panel. The method includes: forming a light-emitting device layer on one side of a substrate, the light-emitting device layer including a plurality of light-emitting elements; forming a first light management layer on a side of the light-emitting device layer away from the substrate, the first light management layer including a plurality of openings spaced apart from each other; forming a second light management layer, at least part of which being located in the openings, the second light management layer including resin and dye, a photocuring treatment and a thermal curing treatment are performed during the formation of the second light management layer, and the photocuring treatment is performed earlier than the thermal curing treatment.

A display comprises a plurality of LEDs on a substrate. Each pixel of the display comprises one or more LEDs of the plurality of LEDs and a transparent region of the display. The transparent region transmits light external to the display through the display.

Disclosed are an integrated LED packaging structure and a packaging method, and relates to the technical field of LED packaging. The disclosure includes a shell, a bottom end of the shell is fixedly connected to a pin platform, a top end of the shell is fixedly connected to an LED plug, three lamp beads are fixedly mounted at a top end of the LED plug, a bottom end of the pin platform is fixedly connected to a cup cavity, and a bottom end of the cup cavity is fixedly connected to connecting pins. The top end of the LED plug is provided with LED sockets in positions corresponding to the lamp beads, and bottom ends of inner sides of the LED sockets are fixedly connected to insulating plates. Furthermore, a combination of an in-line and SMD form is adopted, and the lower half part adopts an SMD structure.

There is disclosed a method of manufacturing a light emitting diode (LED) arrangement, the method comprising the steps of installing an LED on a circuit board; and covering the circuit board and other electronic components on the circuit board with a layer of silicon coating; wherein a top emitting area of the LED is kept exposed or uncovered for increasing efficiency of the LED arrangement. Also disclosed is a lighting system, comprising a plurality of light emitting diode (LED) strips in connection with a photo-voltaic (PV) panel, the LED strips comprising a plurality of LEDs and infra-red (IR) LEDs, wherein the plurality of LEDs and IR LEDs are installed on the LED strips at a ratio of 1:8, for mitigating shadow losses and for increasing efficiency of the lighting arrangement.

Provided is a display substrate, including an array substrate, a connection layer, and a light-emitting functional layer, wherein the connection layer is disposed between the array substrate and the light-emitting functional layer; and the connection layer is provided with a plurality of via holes, and the light-emitting functional layer comprises a plurality of light-emitting units, wherein each of the light-emitting units is electrically connected with a conductive structure in at least one via hole, and an orthographic projection of the via hole on a carrying surface of the connection layer is disposed outside an orthographic projection of a light-emitting region of a corresponding light-emitting unit on the carrying surface.

A method for ultraviolet-laser transfer and cleaning of microelectronic devices includes transferring a microelectronic device from a donor substrate to a receiver substrate, and cleaning the microelectronic device after transfer. Prior to transfer, the microelectronic device is coupled to the donor substrate via a sacrificial layer containing gallium. A first ultraviolet laser beam ablates the sacrificial layer to release the microelectronic device from the donor substrate, leaving behind a gallium residue on the newly exposed surface of the microelectronic device. A second ultraviolet laser beam ablates the gallium residue to clean the microelectronic device. The first and second ultraviolet laser beams may be generated by the same ultraviolet laser. As compared to liquid etching, laser ablation of the gallium residue eliminates a wet-chemistry step and may be performed by the same laser apparatus used for transfer. Laser cleaning is particularly advantageous when the receiver substrate is intolerant to liquid etching.

This application provides a pixel unit, a manufacturing method therefor, a microdisplay, and a pixel-level discrete device. The pixel unit includes a backplane and a display unit. The display unit is arranged on the backplane, and includes a first device layer and a second device layer. The first device layer includes a first compound light-emitting layer and a second compound light-emitting layer. The second device layer includes a color conversion layer and a third compound light-emitting layer. The color conversion layer is arranged above the first compound light-emitting layer. The color conversion layer is arranged, so that the compound light-emitting layer can implement color development through color conversion, to reduce power and improve performance. The pixel unit occupies less space in the horizontal direction. A decrease in external quantum efficiency caused by a size effect is effectively reduced, power consumption is effectively reduced, and performance such as brightness is improved.

A display device comprises a light emitting diode (LED) which includes a porous semiconductor material, wherein the device comprises a pixel comprising a plurality of subpixels each having a light-emitting layer. A first subpixel has a first light-emitting layer having a first area A1, and a second subpixel has a second light-emitting layer having a second area A2 different from the first area A1. The first subpixel is configured to emit at a first peak wavelength, and the second subpixel is configured to emit at a second peak wavelength different from the first peak wavelength. A method of controlling this display device and a method of manufacturing said display device are also provided.