A method for manufacturing a light-emitting device includes: preparing an intermediate body including: a substrate, and a plurality of light-emitting elements disposed on the substrate, each including a first surface serving as a light extraction surface, a second surface opposite to the first surface, and a lateral surface connecting the first surface and the second surface; applying a powder composition including a reflective member and a silicone resin powder from above the first surfaces of the plurality of light-emitting elements through a sieve to locate the powder composition on the substrate and between the lateral surfaces of the plurality of light-emitting elements; and forming a first covering member by applying vibration to the powder composition and subsequently applying pressure in a thickness direction of the substrate to perform compression molding.

An electronic device includes a first substrate, a first circuit layer, a second circuit layer, a side circuit layer, a light-shielding layer, a protective layer, and a circuit board. The first substrate has a first surface, a second surface, and a side surface. The first surface is opposite to the second surface. The side surface connects the first surface and the second surface. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The side circuit layer is disposed on the side surface and electrically connected to the first circuit layer and the second circuit layer. The light-shielding layer is disposed on the side circuit layer. The protective layer is disposed on the light-shielding layer and the second circuit layer, and continuously extends from the side surface to the second surface. The protective layer includes an opening exposing a portion of the second circuit layer. The circuit board is electrically connected to the second circuit layer through the opening.

A lighting device having a support supporting first light emitting diodes and second light emitting diodes each having a light emitting surface, wherein the light emitting surface of each first light emitting diode has a first area and the light emitting surface of each second light emitting diode has a second area, the second area being strictly lower than the first area.

An optoelectronic apparatus comprises an at least partially transparent first cover, a second cover and at least one first layer segment, in particular intermediate layer segment, which is arranged between the first cover and the second cover. The first layer segment carries an arrangement of a plurality of optoelectronic light sources. The arrangement of the plurality of optoelectronic light sources has a defined shape with a defined contour and the first layer segment has the same shape and the same contour as the arrangement of the plurality of optoelectronic light sources.

Disclosed are a Micro LED micro-display chip and a manufacturing method thereof. The Micro LED micro-display chip includes a driver panel; multiple LED units arranged on the driver panel, wherein the multiple LED units includes multiple LED mesas in a one-to-one correspondence with the multiple LED units, and each of the LED units is independently drivable by the driver panel; a grid structure having multiple grid holes, wherein the multiple grid holes are respectively provided around the multiple LED mesas, and recess areas are formed between the LED mesas and the respective grid holes; a wavelength conversion layer provided on the grid structure, including multiple first wavelength conversion units filling the corresponding recess areas and configured to convert the first color light emitted by the LED units into second color light.

Provided are a semiconductor structure and a manufacturing method thereof according to embodiments of the present disclosure. The semiconductor structure includes: a carrier plate; light-emitting units on the carrier plate and lenses on a side of the light-emitting units away from the carrier plate. Each of the light-emitting units includes a first light-emitting structure, a second light-emitting structure and a third light-emitting structure, that are spaced apart on a surface of the carrier plate and respectively configured to emit light with different wavelengths, the second light-emitting structure surrounds the first light-emitting structure, and the third light-emitting structure surrounds the second light-emitting structure. The lenses respectively correspond to the light-emitting units, and the lenses are configured to converge light emitted by the light-emitting units and mix the colors of the light emitted by the light-emitting units.

A display device is disclosed that includes a display panel including a light emitting diode, a window layer disposed on the display panel, a light blocking member including a first light blocking part disposed between the display panel and the window layer and a second light blocking part disposed between the display panel and the first light blocking part and partially covering a lower surface of the first light blocking part and a dam disposed between the light blocking member and the display panel.

The present invention relates to a vertically stacked LEDoS micro display panel and a manufacturing method therefor, in which an engineering monolithic epitaxy wafer is used when bonding a front wafer and a back wafer to each other, thus making a process for aligning an LED laminate with a CMOS electrode pad unnecessary, and at the same time, each LED laminate emits only light of a specific color, thus making a color filter unnecessary.

A display device includes a light emitting diode disposed on a thin-film transistor (TFT) array substrate, a micro lens disposed on the light emitting diode, overlapping the light emitting diode, and including a resin, and a hydrophobic coating layer disposed on the micro lens and covering the micro lens.

Provided is a manufacturing method for a light-emitting device that can improve yield during manufacturing while achieving wide-angle light distribution. A manufacturing method for a light-emitting device includes: a preparing step of preparing a substrate having an upper surface on which a plurality of light-emitting elements are disposed, each of the plurality of light-emitting elements including a light-emitting layer; a phosphor layer forming step of forming a phosphor layer by pouring a first precursor made of a resin in which phosphor particles are dispersed onto the upper surface of the substrate and heat-curing the poured first precursor, the phosphor layer encompassing the plurality of light-emitting elements; a trench forming step of forming a trench on an upper surface of the phosphor layer to separate each of the light-emitting elements in a top view from a direction perpendicular to the upper surface; a sealing layer forming step of forming a sealing layer by pouring a second precursor made of a translucent resin onto the upper surface of the phosphor layer and heat-curing the poured second precursor; a transmissive-reflective layer forming step of forming a transmissive-reflective layer on the sealing layer, the transmissive-reflective layer partially reflecting and partially transmitting each of a light emitted from the light-emitting layer and a fluorescence emitted from the phosphor layer; and an individualizing step of individualizing the light-emitting device by cutting from an upper surface of the transmissive-reflective layer to the substrate along the trench in depth direction.