A window protective film includes: a shock absorbing layer including acrylic resin and having a modulus of about 300 MPa or less; a base layer located on the shock absorbing layer; and a hard coating layer located on the base layer.

A display device may include a substrate including a display area and a non-display area outside the display area; a plurality of pixel driving circuits disposed on the display area of the substrate; a plurality of light-emitting elements disposed on the pixel driving circuit and electrically connected to each pixel driving circuit; a plurality of pad electrodes disposed on the non-display area of the substrate; at least one or more multilayer insulating structure disposed in a lower side of the plurality of pad electrodes; and one or more reinforcement patterns disposed between the pad electrode and the multilayer insulating structure.

Light-emitting diode (LED) devices and more particularly lens structures for LED chips in LED packages are disclosed. Lens structures include complex shapes for achieving various emission patterns in LED packages. Complex lens shapes include arrangements of multiple lenses within a same LED package. A first lens is arranged on an LED chip with a self-forming shape, followed by a second lens that encapsulates the first lens. The self-forming shape of the first lens provides the ability to have lens widths that taper inward and depressions positioned relative to the underlying LED chip. Combinations of shapes for the first and second lenses may be configured to collectively provide tailored light emission profiles in corresponding LED packages.

The present invention discloses cartridge structure and chiplets and cartridge layers. The invention further discloses, method of transferring pixel elements with chiplet cartridge structure and also various methods of fabrication for pixel elements having chiplet cartridge.

An LED light source comprises a hollow pedestal comprising side walls having reflective interior surfaces that define sides of an internal cavity. An LED mounting surface is disposed within the cavity, with one or more LEDs disposed on the LED mounting surface. A light transmitting optical element is disposed opposite from the mounting surface, spaced apart from the one or more LEDs, and supported by the pedestal side walls. The LED light source provides a narrowed radiation pattern that may, for example, be advantageously employed for backlighting LCOS and other displays.

Light-emitting diode (LED) devices and more particularly lens structures in LED packages are disclosed. Lens structures include complex shapes for achieving various emission patterns in LED packages. Complex lens shapes include lens widths that are greater than corresponding widths of support elements, including lead frame structures or submount structures. Complex lens shapes further include inward depressions positioned relative to underlying LED chips for directing peak emission intensities off center relative to LED packages. Exemplary LED packages further include encapsulant layers positioned between lenses and underlying LED chips for providing one or more of improved surfaces for lens formation and improved adhesion.

An electronic device includes a flexible substrate, a circuit layer, a first electronic unit and a second electronic unit. The flexible substrate includes a main portion and a curve portion connected to the main portion. The circuit layer is disposed on the flexible substrate, and includes a first pad disposed on the main portion and a second pad disposed on the curve portion. The first electronic unit is bonded on the first pad. The second electronic unit is bonded on the second pad. An area of the second pad is different from an area of the first pad.

A display panel includes a drive backplane and a plurality of light-emitting chips arranged on the drive backplane. Each of the light-emitting chips includes an N-type semiconductor layer, a multi-quantum well layer and a P-type semiconductor layer arranged on the undoped semiconductor layer in sequence and an undoped semiconductor layer. The undoped semiconductor layer is provided with a conductive via. The light-emitting chip further includes a conductive pattern portion, a part of the conductive pattern portion is located in the conductive via and is in contact with the N-type semiconductor layer, and another part of the conductive pattern portion protrudes from the conductive via and is connected to the drive backplane.

An LED light source module (100) includes a substrate (10) and light mixing chip groups (20). A first light emitting area (101) and a second light emitting area (102) are symmetrically arranged on the surface of the substrate (10) with respect to a reference axis (11). The plurality of light mixing chip groups (20) are arranged in the first light emitting area (101) and the second light emitting area (102) in an array. Chips arranged in the light mixing chip groups (20) in the first light emitting area (101) and chips arranged in the light mixing chip groups (20) in the second light emitting area (102) are symmetrically arranged with respect to the reference axis (11). Two adjacent columns of light mixing chip groups (20) are arranged in offset positions, and two adjacent rows of light mixing chip groups (20) are arranged in offset positions.

A display module may include: a substrate including a first pad and a common electrode pad; a light emitting diode including a first electrode connected to the first pad, and a second electrode; a conductive connector connected to the common electrode pad, and connecting the second electrode to the common electrode pad; an adhesive layer on the substrate; and a conductive layer on the adhesive layer, the conductive layer connecting the second electrode to the conductive connector, wherein the second electrode is on a side surface of the light emitting diode, the side surface being between a light emitting surface of the light emitting diode and a bottom surface of the light emitting diode that is opposite to the light emitting surface, and the light emitting surface is exposed from the conductive layer, and the conductive layer surrounds the second electrode of the light emitting diode.