An optical interconnect may include an array of microLEDs driven to generate light based on data and/or clock signals, an array of photodetectors to receive the light and generate electrical signals corresponding to the data and/or clock signals, and optical fibers providing at least part of a pathway between the microLEDs and the photodetectors. A reflector structure for each of the microLEDs assists in coupling light from the microLEDs into the optical fibers. The reflector structure may be in the form of a compound parabolic concentrator (CPC).

A display includes a first housing portion having graphic openings and a second housing portion spaced apart from the first housing portion. A first circuit board has LEDs and is disposed between the first and second housing portions. A first side wall and a second side wall define photon recycling cavities in a sequence wherein adjacent photon recycling cavities have a shared end wall an LED. The first side wall has a first angular surface and the second side wall has a second angular surface. The first angular surface and the second angular surface redirecting light from an associated LED of the plurality of LEDs so that light from the plurality of light emitting diode is indirectly communicated through the graphic openings after reflecting from the first angular surface and the second angular surface.

A multilayer board structure includes a plurality of light emitting devices, each light emitting device of the plurality of light emitting devices having a plurality of electrodes formed on a terminal surface thereof, and a multilayer board including a plurality of stacked substrates and implemented with the plurality of light emitting devices. An uppermost substrate of the plurality of stacked substrates has a surface formed with metal layers coupling electrodes of the plurality of light emitting devices. Remaining substrates of the plurality of stacked substrates, other than the uppermost substrate, have surfaces formed with metal layers, respectively. A number of metal layers located directly below the electrodes of the plurality of light emitting devices is the same for each of the electrodes.

A light-emitting device according to an embodiment includes: a base substrate; a plurality of light-emitting cells disposed on the surface of the base substrate and configured to generate light; a plurality of connection metal layers for connecting the plurality of light-emitting cells so that the plurality of light-emitting cells are electrically connected in series; a plurality of bump pads respectively disposed on the plurality of connection metal layers; and a control unit configured to apply current to at least some of the plurality of bump pads so that light is generated from at least one of the plurality of light-emitting cells.

An electronic device including a substrate, an insulation layer, a first organic portion, a shielding structure, and a first optical unit is provided. The insulation layer is disposed on the substrate and includes a first opening. The first organic portion is disposed in the first opening of the insulation layer. The shielding structure is disposed on the insulation layer and includes a retaining wall and a first opening. The first optical unit is disposed in the first opening of the shielding structure. The retaining wall of the shielding structure overlaps with the first opening of the insulation layer.

A display panel includes a first substrate, a second substrate, a plurality of light-emitting components, a bonding layer and a driving component. The first substrate includes a planar portion and a bending portion. The second substrate is disposed on the first substrate. The light-emitting components are disposed on the second substrate. The bonding layer is disposed between the planar portion of the first substrate and the second substrate. The driving component is disposed on a first surface of the bending portion of the first substrate and electrically connected to the light-emitting components. The first surface of the bending portion extends from a surface of the planar portion adjacent to the second substrate, and a projection of the bending portion in a vertical direction falls within the second substrate. A tiled display device including multiple display panels and a manufacturing method of the display panel are also provided.

A light emitting device includes: a support defining first and second recesses partitioned by a wall, an area of a first bottom surface of the first recess is greater than a second bottom surface of the second recess; first and second light emitting elements in the first recess; a third light emitting element in the second recess; a first light transmissive member apart from the third light emitting element in the first recess, including a first wavelength conversion member having an emission peak wavelength longer than the first light emitting element, and overlapping the first and second light emitting elements; and a second light transmissive member located in the second recess and overlapping the third light emitting element.

The first to third light emitting elements are drivable independently.

The emission peak wavelength of the first light emitting element is longer than the second and third light emitting elements.

An electronic device includes a foldable folding area and a first non-folding area and a second non-folding area spaced apart from each other with the folding area interposed therebetween. The electronic device includes: a display module including a display area, a non-display area disposed outside the display area, and a bending area disposed on one side of the non-display area and bent with respect to an imaginary bending axis extending in one direction; a protective layer including a main protective layer overlapping the display area under the display module and a sub-protective layer spaced apart from the main protective layer and overlapping the bending area; and a reinforcing layer overlapping the display module, spaced apart from the main protective layer and disposed between the main protective layer and the sub-protective layer.

In at least one embodiment, an optoelectronic device includes a carrier with a mounting area, an optoelectronic semiconductor chip mounted at the mounting area of the carrier and a filling material arranged on the mounting area laterally next to the semiconductor chip, wherein a side surface of the semiconductor chip is wetted by the filling material. The optoelectronic device further comprises at least one attraction feature at the mounting area laterally next to and spaced from the semiconductor chip. The attraction feature is at least laterally surrounded by the filling material. The attraction feature is different from the portion of the mounting area, which lies laterally next to the attraction feature and which laterally surrounds the attraction feature. Further, the attraction feature is configured to attract a liquid phase of the filling material due to minimization of surface energy.

A display device includes a substrate including island portions spaced apart from each other, defining an opening between the island portions, and including a bridge portion connecting the island portions, a light-emitting element above the island portions, and a luminance compensation layer above the bridge portion, and further including a color conversion material configured to change color in response to stress.