H10H29/853

LIGHT EMITTING DIODE FILAMENT HAVING REDUCED OPTICAL CROSS-TALK

The present invention relates to a LED filament (1) having a longitudinal extension (L) and a transverse extension (W) being perpendicular to the longitudinal extension (L), the LED filament (1) comprising: at least one first LED filament portion (2) extending in the longitudinal extension (L) of the LED filament (1) and comprising a plurality of first LED dies (3) adapted to emit first LED light, the first LED dies (3) being encapsulated by a first encapsulant (4) comprising a luminescent material; at least one second LED filament portion (5) parallel to the first LED filament portion (2) and comprising a plurality of red, green, and blue LED dies (6, 7, 8) adapted to emit second LED light comprising at least one of red, green and blue light; wherein the plurality of red, green, and blue LED dies (6, 7, 8) are arranged in rows running in the transverse direction (W) and spaced apart in the longitudinal direction (L), wherein each row comprises at least two LED dies, and wherein at least one of the red LED die and the green LED die (6, 8) is arranged between each blue LED die (7) and the first LED filament portion (2) in order to reduce or prevent optical cross-talk between the first encapsulant (4) and the second LED light.

LIGHT EMITTING DIODE FILAMENT HAVING REDUCED OPTICAL CROSS-TALK

The present invention relates to a LED filament (1) having a longitudinal extension (L) and a transverse extension (W) being perpendicular to the longitudinal extension (L), the LED filament (1) comprising: at least one first LED filament portion (2) extending in the longitudinal extension (L) of the LED filament (1) and comprising a plurality of first LED dies (3) adapted to emit first LED light, the first LED dies (3) being encapsulated by a first encapsulant (4) comprising a luminescent material; at least one second LED filament portion (5) parallel to the first LED filament portion (2) and comprising a plurality of red, green, and blue LED dies (6, 7, 8) adapted to emit second LED light comprising at least one of red, green and blue light; wherein the plurality of red, green, and blue LED dies (6, 7, 8) are arranged in rows running in the transverse direction (W) and spaced apart in the longitudinal direction (L), wherein each row comprises at least two LED dies, and wherein at least one of the red LED die and the green LED die (6, 8) is arranged between each blue LED die (7) and the first LED filament portion (2) in order to reduce or prevent optical cross-talk between the first encapsulant (4) and the second LED light.

LIGHT EMITTING MODULE AND DISPLAY APPARATUS HAVING THE SAME
20250212587 · 2025-06-26 · ·

A light emitting apparatus includes a substrate, a cover layer disposed on an upper surface of the substrate and forming at least one opening that exposes at least a region of the upper surface of the substrate, a light emitting device disposed on the upper surface of the substrate exposed through the opening, and a molding layer covering the cover layer and the light emitting device.

LIGHT EMITTING MODULE AND DISPLAY APPARATUS HAVING THE SAME
20250212587 · 2025-06-26 · ·

A light emitting apparatus includes a substrate, a cover layer disposed on an upper surface of the substrate and forming at least one opening that exposes at least a region of the upper surface of the substrate, a light emitting device disposed on the upper surface of the substrate exposed through the opening, and a molding layer covering the cover layer and the light emitting device.

DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE

Provided is a display panel, including: a base substrate including at least one side region and a display region; pixel units in the display region; a terminal located in the side region on the base substrate; a first wire on the base substrate, having one end electrically connected to the terminal and the other end electrically connected to a pixel driving circuit; a second wire on the base substrate, having one end electrically connected to the terminal, the second wire extends in a direction from the terminal to a side edge of the base substrate. The display panel includes a first conductive layer, a first planarization layer, a second conductive layer and a second planarization layer sequentially provided on the base substrate. An orthographic projection of the terminal on the base substrate is spaced apart from orthographic projections of the first and second planarization layers on the base substrate.

DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE

Provided is a display panel, including: a base substrate including at least one side region and a display region; pixel units in the display region; a terminal located in the side region on the base substrate; a first wire on the base substrate, having one end electrically connected to the terminal and the other end electrically connected to a pixel driving circuit; a second wire on the base substrate, having one end electrically connected to the terminal, the second wire extends in a direction from the terminal to a side edge of the base substrate. The display panel includes a first conductive layer, a first planarization layer, a second conductive layer and a second planarization layer sequentially provided on the base substrate. An orthographic projection of the terminal on the base substrate is spaced apart from orthographic projections of the first and second planarization layers on the base substrate.

DISPLAY PANEL AND DISPLAY DEVICE

Disclosed are a display panel and a display device. The display panel is provided with an display region and a peripheral region, and includes a display substrate and at least one alignment mark disposed in the peripheral region. The display substrate is sequentially provided with a first packaging layer, a light-shielding layer, and a second packaging layer at a side, distal to the base substrate, of a second electrode layer. The light-shielding layer is provided with an opening hole, and a distance between a medial edge of the opening hole and a first end of the light-shielding layer is greater than a distance between a lateral edge of the opening hole and a second end of the light-shielding layer.

DISPLAY PANEL AND DISPLAY DEVICE

Disclosed are a display panel and a display device. The display panel is provided with an display region and a peripheral region, and includes a display substrate and at least one alignment mark disposed in the peripheral region. The display substrate is sequentially provided with a first packaging layer, a light-shielding layer, and a second packaging layer at a side, distal to the base substrate, of a second electrode layer. The light-shielding layer is provided with an opening hole, and a distance between a medial edge of the opening hole and a first end of the light-shielding layer is greater than a distance between a lateral edge of the opening hole and a second end of the light-shielding layer.

LIGHT-EMITTING UNIT AND LIGHT-EMITTING DEVICE
20250268011 · 2025-08-21 ·

A light-emitting unit and a light-emitting device are provided. The light-emitting unit includes a light-emitting chip and an optical encapsulant. The light-emitting unit has a top surface and a bottom surface opposite to each other in the thickness direction, and a surrounding side surface. The top surface and the bottom surface are surrounded by the surrounding side surface, and the light-emitting chip includes a connection pad located on the bottom surface and a wire bonding point that is located on the top surface. The surrounding side surface of the light-emitting chip is surrounded by the optical encapsulant, and the top surface and the bottom surface of the light-emitting chip are exposed outside of the optical encapsulant.

LIGHT-EMITTING UNIT AND LIGHT-EMITTING DEVICE
20250268011 · 2025-08-21 ·

A light-emitting unit and a light-emitting device are provided. The light-emitting unit includes a light-emitting chip and an optical encapsulant. The light-emitting unit has a top surface and a bottom surface opposite to each other in the thickness direction, and a surrounding side surface. The top surface and the bottom surface are surrounded by the surrounding side surface, and the light-emitting chip includes a connection pad located on the bottom surface and a wire bonding point that is located on the top surface. The surrounding side surface of the light-emitting chip is surrounded by the optical encapsulant, and the top surface and the bottom surface of the light-emitting chip are exposed outside of the optical encapsulant.