A method of manufacturing a fluorescent substance includes forming dicing trenches on one surface of a fluorescent substance wafer along lattice-shaped dicing lines, and a lower surface grinding operation (S6) of grinding a surface opposite to a surface of the wafer in which the dicing trenches are formed as much as a predetermined thickness using a disk-shaped grinder so that the wafer is divided into a plurality of fluorescent substances, which are color conversion members for light emitting diodes (LEDs).

Embodiments of a display device are described. A display device includes a substrate (204) and a sub-pixel (R1, R2) configured to emit a display light having an emission spectrum with a first peak wavelength and a second peak wavelength. The sub-pixel includes a microLED (218) disposed on the substrate and a NS-based CC layer (220) disposed on the microLED. The NS-based CC layer includes QDs configured to emit a first light having the first peak wavelength. The microLED is configured to emit a second light having the second peak wavelength. A first portion of the second light is absorbed by the QDs and down-converted to the first light and a second portion of the second light is transmitted through the NS-based CC layer (220).

A display panel and a preparation method thereof are provided. In some embodiments, a first film layer and a second film layer are combined, light conversion material is injected from a draining cavity of the second film layer to a groove of the first film layer, the second film layer is then removed, and a light conversion layer is formed within the groove.

A method of forming a micro light-emitting diode (microLED) array may include forming pixel isolation structures on a sacrificial substrate, and mounting the microLEDs on a separate backplane. The processes that forms the pixel isolation structures, and which may damage the backplane or microLEDs can be separately performed on the sacrificial substrate. The pixel isolation structures can then be attached to the backplane and the sacrificial substrate can be removed. This allows the formation of the pixel isolation structures to be isolated, the microLEDs to be tested early in the process, and the interface between the microLEDs and subsequent layers to be free of adhesive.

A light-emitting apparatus includes a luminescent structure and a stepped-index structure, and can further include an LED. The luminescent structure absorbs light at an excitation wavelength and emits light at one or more emission wavelengths longer than the excitation wavelength. The stepped-index structure is a stack of multiple transparent layers positioned between and in contact with an ambient medium and the luminescent structure, with corresponding refractive indices lower than the refractive index of the luminescent structure, higher than the refractive index of the ambient medium, and monotonically decreasing from the luminescent structure toward the ambient medium. The LED can be positioned with its light-emitting surface facing the surface of the luminescent structure opposite the stepped-index structure. The stepped-index structure can increase transmission of light from the luminescent structure into the ambient medium.

A display device includes: a substrate; a light emitting element disposed on the substrate; a bank layer disposed on the light emitting element and defining an opening overlapping the light emitting element in a plan view; a color conversion pattern disposed inside the opening and having an outer side surface including a contact portion that contacts an upper surface of the bank layer; and a capping layer covering the bank layer and the color conversion pattern. An angle between a first tangent from the contact portion to the outer side surface of the color conversion pattern and a second tangent from the contact portion to the upper surface of the bank layer in a direction away from the color conversion pattern is greater than or equal to about 90 degrees and less than about 180 degrees.

A display apparatus includes a backplane substrate including driving elements, and a first light-emitting section, a second light-emitting section, and a third light-emitting section spaced apart from each other on the backplane substrate, the first light-emitting section being configured to emit light of a first wavelength, the second light-emitting section being configured to emit light of a second wavelength, and the third light-emitting section being configured to emit light of a third wavelength, where each of the first light-emitting section, the second light-emitting section and the third light-emitting section includes a p-type semiconductor layer, an active layer configured to emit blue light, and an n-type semiconductor layer stacked in a direction perpendicular to an upper surface of the backplane substrate.

A display device includes a substrate including a first surface, a second surface, and a side surface between the first surface and the second surface, a pixel circuit layer on the first surface and the side surface of the substrate and including a transistor, and a light emitting element on the pixel circuit layer and electrically connected to the transistor, wherein the side surface of the substrate has an inclination.

A display device including sub-pixel areas including a first sub-pixel area, a second sub-pixel area, and a third sub-pixel area includes: light-emitting elements which are disposed on a base layer and include a first light-emitting element in the first sub-pixel area, a second light-emitting element in the second sub-pixel area, and a third light-emitting element in the third sub-pixel area; a first color conversion layer in the first sub-pixel area, a second color conversion layer in the second sub-pixel area, and a scattering layer in the third sub-pixel area, which are disposed on the light-emitting elements; and a bank which is disposed between the sub-pixel areas and includes a substrate material on which semiconductor layers grow.

In an embodiment a method for producing at least one optoelectronic device includes providing a substrate body, providing a substrate frame on the substrate body, wherein the substrate frame comprises at least one recess, providing at least one optoelectronic component on the substrate body, wherein the substrate frame and the at least one optoelectronic component are placed in relation to one another such that the at least one optoelectronic component is arranged in the at least one recess and providing a filler material in the at least one recess such that the at least one optoelectronic component is covered by the filler material, wherein the filler material is provided by a casting process.