A display apparatus includes a backplane substrate including driving elements, and a first light-emitting section, a second light-emitting section, and a third light-emitting section spaced apart from each other on the backplane substrate, the first light-emitting section being configured to emit light of a first wavelength, the second light-emitting section being configured to emit light of a second wavelength, and the third light-emitting section being configured to emit light of a third wavelength, where each of the first light-emitting section, the second light-emitting section and the third light-emitting section includes a p-type semiconductor layer, an active layer configured to emit blue light, and an n-type semiconductor layer stacked in a direction perpendicular to an upper surface of the backplane substrate.

A light-emitting component includes a connection board with a mounting side. The light-emitting component also includes a light source. The light source is fastened and electrically connected to the connection board on the mounting side. The light-emitting component further includes a cover which covers the connection board in places on its mounting side and laterally surrounds the light source. The light-emitting component additionally includes an optical element. The optical element has a central region which is arranged downstream of the light source on the mounting side of the connection board. A provision is made to prevent impingement of light in the central region of the optical element.

A light-emitting element includes semiconductor layers including a first semiconductor layer, a light-emitting layer and a second semiconductor layer, a contact electrode disposed on the semiconductor layers, a first reflective layer in which an opening exposing a portion of the contact electrode is defined, the first reflective layer being disposed on a second portion of the contact electrode which is different from the first portion, a conductive adhesive layer disposed on the first portion of the contact electrode, the conductive adhesive layer including a second reflective layer including a material different from that of the first reflective layer, and a bonding electrode disposed on the first reflective layer and the conductive adhesive layer and connected to the contact electrode through the conductive adhesive layer. One surface of the semiconductor layers and the contact electrode is covered with the first reflective layer and the conductive adhesive layer.

A method for fabricating a single pixel multi-color micro light-emitting diode device for a display panel comprises providing a substrate supporting a pixel driver, forming a metal bonding layer on top of the substrate, fabricating a first LED structure layer on top of the metal bonding layer, and fabricating a second LED structure layer on top of the first LED structure layer. The method further includes coating a first-type electrode to contact a lower portion of the first LED structure layer, a lower portion of the second LED structure layer, and the metal bonding layer, respectively. The first-type electrode electrically connects the pixel driver to the lower portion of the first LED structure layer and the lower portion of the second LED structure layer through the metal bonding layer.

A display device includes a lower substrate, a bonding electrode disposed on the lower substrate, and a light emitting element disposed on the bonding electrode. The bonding electrode includes a first bonding metal layer and a second bonding metal layer sequentially disposed on the lower substrate, each including a bonding metal, a third bonding metal layer disposed between the first bonding metal layer and the second bonding metal layer, and including the bonding metal, a first thin film layer disposed between the first bonding metal layer and the third bonding metal layer, and a second thin film layer disposed between the second bonding metal layer and the third bonding metal layer, and the first thin film layer and the second thin film layer include a material with an atomic volume that is greater than or equal to about 80% of an atomic volume of the bonding metal.

A light-emitting diode (LED) epitaxial structure includes a first color epitaxial layer and a second color epitaxial layer that are stacked. Each of the first color epitaxial layer and the second color epitaxial layer includes a first stress buffer layer, a first carrier injection layer, a light-emitting layer, and a second carrier injection layer that are sequentially stacked in a first direction. The light-emitting layers are of different colors. One of the first carrier injection layer and the second carrier injection layer is an electron injection layer, and the other of the first carrier injection layer and the second carrier injection layer is a hole injection layer.

This application relates to a light-emitting device and a manufacturing method thereof, comprising a substrate, a plurality of light-emitting chips arranged on the front side of the substrate, and an encapsulation layer disposed on the substrate to cover each light-emitting chip. The encapsulation layer allows light emitted by the LED chips to pass through.

A light-emitting element package can include a first layer having an oval shape, a first semiconductor light-emitting element group on the first layer, a first electrode pad group on the first layer, and a second electrode pad group on the first layer. The first layer can have a first region comprising an oval major axis, a second region contacting the first region on one side of the oval major axis, and a third region contacting the first region on the other side of the oval major axis. The first semiconductor light-emitting element group can be disposed on the first region and can include a plurality of semiconductor light-emitting elements. The first electrode pad group can be disposed on the second region and can include a plurality of electrode pads. The second electrode pad group can be disposed on the third region and can include a plurality of redundancy electrode pads.

A display may include: a circuit board including a first drive electrode and a second drive electrode; and a light-emitting diodes (LED) including: semiconductor layers stacked in a horizontal direction parallel to a surface of the circuit board, the semiconductor layers including: an n-type semiconductor layer; a light-emitting layer; and a p-type semiconductor layer; a first pixel electrode in contact with the first drive electrode; and a second pixel electrode in contact with the second drive electrode.

A display device according to an embodiment includes a lower substrate, a first bonding electrode disposed on the lower substrate, a first light emitting element disposed on the first bonding electrode, a second bonding electrode disposed on the first light emitting element, and a second light emitting element disposed on the second bonding electrode, the second bonding electrode includes a first distributed Bragg reflector including at least one pair of a first transparent conductive layer and a second transparent conductive layer having different refractive indices that are alternately stacked.