A light-emitting module includes: a plurality of light-emitting elements; a first substrate having an upper surface that includes an element mounting region on which the light-emitting elements are mounted, the first substrate including a plurality of first terminals; a second substrate having an upper surface that includes a substrate mounting region on which the first substrate is mounted, the second substrate including a plurality of second terminals; a plurality of wires each connected to corresponding ones of the first terminals and the second terminals; a light-shielding covering member disposed outward of the element mounting region so as to cover the plurality of wires; and a light-transmissive first projection disposed along the element mounting region between the element mounting region and the first terminals so as to be in contact with the covering member.

Provided is a display device including: a substrate extending in a first direction and a second direction intersecting the first direction and including a display area and a non-display area around the display area; and a display element layer disposed on the substrate in a third direction intersecting the first and second directions, wherein the display element layer includes a bank disposed on the display area of the substrate and having openings; light emitting elements respectively overlapping the openings and at least partially disposed in the openings; and a dam member disposed in the display area along an edge of the display area, and the light emitting elements have a first height in the third direction, and the dam member has a second height greater than the first height in the third direction.

A display device includes: a display panel including a first area, a second area formed to be bendable from the first area, and a third area extending from the second area; a driving chip in the third area; a connection substrate including a first hole overlapping the driving chip and a second hole overlapping the third area, and overlapping at least a portion of the third area; and a first resin layer in the second hole.

A manufacturing method includes providing a first substrate including a circuit layer and an electronic element disposed on the circuit layer, providing a second substrate, bonding the first substrate and the second substrate to form an electronic module, cutting the electronic module, forming a wire on a first surface exposed after cutting the electronic module and on a second surface of the electronic module, wherein the first surface is adjacent to the second surface and the wire is electrically connected to the circuit layer, and disposing a driving element on the second surface of the electronic module to be electrically connected to the wire.

A display device including a window, an electronic device including the display device and a method for repairing the window of the display device are provided. The display device includes a window including a protective layer, a base substrate below the protective layer, an adhesive layer between the protective layer and the base substrate, and a light blocking pattern along an edge of the protective layer and between the protective layer and the adhesive layer, and includes a display module below the window, wherein a cutting line is defined in the base substrate and the cutting line overlaps the light blocking pattern.

A display device and a manufacture method thereof are discussed. The display device can include a substrate, an adhesive layer disposed on the substrate, a driving chip disposed on the adhesive layer, a first planarization layer disposed on the adhesive layer to surround a lower portion of a side surface of the driving chip, a second planarization layer disposed on the first planarization layer to surround an upper portion of the side surface of the driving chip, and at least one protective film disposed between the second planarization layer and the driving chip to cover at least the upper portion of the side surface of the driving chip.

A display module includes a printed circuit board having a conductive pattern formed thereon, a plurality of light emitting elements arranged on the printed circuit board, and electrically connected to the conductive pattern, and a filling layer including an opaque non-conductive material, wherein the printed circuit board comprises a protruding structure disposed in an outer region of the printed circuit board between outermost ones of the light emitting elements and an edge of the printed circuit board, wherein the height of the protruding structure is greater than the height of the conductive pattern, wherein the filling layer is disposed between the plurality of light emitting elements and between the outermost light emitting elements and the protruding structure to cover the conductive pattern.

An optical sensor package includes a light-emitting unit disposed on a package substrate and configured to emit first light toward a target, a light-receiving unit disposed on the package substrate and configured to receive second light obtained when the first light is reflected from the target, and a molding member formed on the package substrate to surround a top surface of an exposed portion of the package substrate, the light-emitting unit, and the light-receiving unit, the molding member including a groove formed in a thickness direction between the light-emitting unit and the light-receiving unit, wherein the groove is filled with an opaque material.

A common cathode electrode structure for vertical LED pixel package, includes a package carrier, vertical LED chips, a conductive column, an insulating isolation support, and a common cathode metal thin film layer. The vertical LED chips are arranged above package carrier, the package carrier includes anodes and a common cathode penetrating therethrough to be external connection point. The anodes are respectively corresponded and electrically connected to P electrodes of the vertical LED chips, and the conductive column is electrically connected to common cathode and N electrodes of vertical LED chips. The common cathode metal thin-film layer is formed on vertical LED chips, conductive column and insulating isolation support to electrically conduct the conductive column and the N electrodes. The anodes and common cathode are in the same plane, which can meet the requirements for embodying SMT for small-spacing LED display module.

A display apparatus includes a substrate, a light-emitting diode disposed on the substrate and including an emission layer, a bank layer disposed on the substrate and defining an opening overlapping the emission layer of the light-emitting diode, a first refractive layer disposed in the opening of the bank layer, and a second refractive layer disposed on the first refractive layer, where the first refractive layer includes a concave top surface and the second refractive layer includes a convex bottom surface and a convex top surface.