A light-emitting and driving device package and a method of manufacturing the same are disclosed. The package includes a substrate having a first pad portion and a second pad portion, a driver IC mounted on the first pad portion, a light-emitting device mounted on the second pad portion and configured to emit light upon receiving a drive signal from the driver IC, a first encapsulant formed on the substrate in a wall shape, a second encapsulant configured to cover and protect at least a portion of the driver IC, and a third encapsulant configured to cover and protect at least a portion of the light-emitting device. The disclosure enables integrated packaging of the light-emitting device and the driver IC while enhancing optical efficiency.

Embodiments relate to a method of encapsulating an LED display module, where the method includes: placing a substrate, on which a multiple number of LEDs are mounted, in a chamber and forming a vacuum; dispensing a protective material such that the protective material embeds and surrounds the plurality of LEDs; breaking the vacuum formed in the chamber; flattening the dispensed protective material by placing a flattening board on the dispensed protective material and pressing; and curing the flattened protective material by irradiating UV rays onto the flattened protective material. An embodiment of the invention can suppress the occurrence of bubbles at the portions around the chip LEDs or package LEDs and at the interface between the protective layer and the PCB during the procedure for forming the protective layer for an LED display module.

A display module is provided. The display module includes a circuit board, a plurality of pixel structures and a light blocking layer. The pixel structures are disposed on the circuit board. Each of the pixel structures includes a plurality of light-emitting diode chips and a protection layer. The light-emitting diode chips are disposed on the circuit board. The protection layer encases the light-emitting diode chips. The light blocking layer is disposed on the circuit board and surrounds the pixel structures.

A method of manufacturing a light-emitting module includes: providing a first substrate that has an upper surface including an element mounting region and has first terminals disposed on the upper surface and located outward of the element mounting region; providing a second substrate that has an upper surface including a substrate mounting region in which the first substrate is to be mounted and has second terminals disposed on the upper surface and located outward of the substrate mounting region; mounting a plurality of light-emitting elements in the element mounting region of the first substrate; mounting the first substrate in the substrate mounting region of the second substrate; connecting respective ones of the first terminals and respective ones of the second terminals via respective ones of wires; and disposing a covering member that covers the wires, the first terminals, and the second terminals.

A thin film light emitting diode (LED) package for high power applications and method of fabricating the LED package are described. The epitaxial growth substrate is removed and a molding compound is used as underfill to substantially completely fill the space between under bump metallization (UBM) under the remaining semiconductor stack. The molding compound provides mechanical support for the LED package during processing after the epitaxial growth substrate is removed. A temporary adhesive layer and frame is used to support the semiconductor stack and is removed after processing. A reflective material is disposed between LED die after removing the growth substrate. A conversion layer deposited on the semiconductor stack converts light emitted by the semiconductor stack to light of one or more other wavelengths.

According to one embodiment, a display device includes an organic insulating layer, a light reflecting layer, a light emitting element, a sealing layer having an inclined surface having a lower end and an upper end, and a coating layer. An interface between the inclined surface and the coating layer is configured to reflect light traveling through the sealing layer toward the light reflecting layer. The lower end is located below a middle of the light emitting element in a height direction of the light emitting element. The upper end is located above the middle of the light emitting element in the height direction of the light emitting element.

Optoelectronic structures and methods of assembly are described. In an embodiment, an optoelectronic structure includes a frontplane directly bonded to a backplane, and a cover window attached to the frontplane so that a cavity forms between the cover window and an optical layer of the frontplane. In an embodiment, the width of the cover window is less than the width of the backplane. In an embodiment, the width of the cover window is equal to the width of the backplane.

An electronic device includes a foldable folding area and a first non-folding area and a second non-folding area spaced apart from each other with the folding area interposed therebetween. The electronic device includes: a display module including a display area, a non-display area disposed outside the display area, and a bending area disposed on one side of the non-display area and bent with respect to an imaginary bending axis extending in one direction; a protective layer including a main protective layer overlapping the display area under the display module and a sub-protective layer spaced apart from the main protective layer and overlapping the bending area; and a reinforcing layer overlapping the display module, spaced apart from the main protective layer and disposed between the main protective layer and the sub-protective layer.

In at least one embodiment, an optoelectronic device includes a carrier with a mounting area, an optoelectronic semiconductor chip mounted at the mounting area of the carrier and a filling material arranged on the mounting area laterally next to the semiconductor chip, wherein a side surface of the semiconductor chip is wetted by the filling material. The optoelectronic device further comprises at least one attraction feature at the mounting area laterally next to and spaced from the semiconductor chip. The attraction feature is at least laterally surrounded by the filling material. The attraction feature is different from the portion of the mounting area, which lies laterally next to the attraction feature and which laterally surrounds the attraction feature. Further, the attraction feature is configured to attract a liquid phase of the filling material due to minimization of surface energy.

A display device includes a substrate, a light-emitting element, and an encapsulation layer. The light-emitting element is disposed on the substrate, the encapsulation layer is disposed on the substrate and covers the light-emitting element, the light-emitting element has a first width in a first direction, the encapsulation layer has a top surface, the top surface includes a first trench, the first trench has a second width in the first direction, and the second width is greater than the first width.