A method produces at least one defined connecting layer between two components, wherein the first component is produced from a first metallic material and the second component is produced from a second metallic material and the first and/or second component has a coating of a third metallic material, the melting temperature of which is lower than the melting temperature of the first and second materials. In this case, the coating of at least one of the components is heated locally to a connecting temperature, which lies above the melting temperature of the third material and lies below the melting temperature of the first material and below the melting temperature of the second material, and is cooled down in order to form a defined connecting layer when the coating solidifies.

A high resolution system for additive manufacturing, soldering, welding and other laser processing applications. A blue laser system for additive manufacturing, soldering, welding and other laser processing applications and operation for additive manufacturing of materials. Systems and methods for laser processing of materials, laser processing by matching preselected laser beam wavelengths to the material to be processed to have high or increased levels of absorptivity by the materials, and in particular laser additive manufacture of raw materials into large structures, parts, components and articles with laser beams having high absorptivity by starting raw materials.

A secondary battery manufacturing method according to an example embodiment of the present disclosure includes an electromagnetic welding step of joining together a first metallic component and a second metallic component included in the secondary battery by electromagnetic welding, and a laser welding step of applying laser light to weld an unjoined part of the first metallic component and the second metallic component, the unjoined part being not joined by the electromagnetic welding step.

An electrical connector includes a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy. The second layer has a thickness of 8% to 30% of the thickness of the electrical connector. The electrical connector also includes a third layer which is formed of a solder alloy that consists essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy that is tin.

A layered bonding material 10 includes a base material 11, a first solder section 12a stacked on a first surface of the base material 11, and a second solder section 12b stacked on a second surface of the base material 11. A coefficient of linear expansion of the base material 11 is 5.5 to 15.5 ppm/K, the first solder section 12a and the second solder section 12b are made of lead-free solder, and both of a thickness of the first solder section 12a and a thickness of the second solder section 12b are 0.05 to 1.0 mm.

Provided is a metal joint (5) including: a AgCuZn layer (7); and CuZn layers (6) joined to both surfaces of the AgCuZn layer (7), wherein the AgCuZn layer (7) has a composition in which a Cu component is 1 atm % or more and 10 atm % or less, a Zn component is 1 atm % or more and 40 atm % or less, and the balance is a Ag component with respect to the total 100 atm %, and wherein the CuZn layers (6) have a composition in which a Zn component is 10 atm % or more and 40 atm % or less and the balance is a Cu component with respect to the total 100 atm %. It is therefore possible to obtain the metal joint (5), which is capable of joining metal base materials to each other without being limited to aluminum-based materials, and also have high mechanical strength.

A method of joining at least two substrates includes welding the at least two substrates together with a multi-step welding process. The multi-step welding process includes: reducing a mismatch between the at least two substrates by melting on both sides of the at least two substrates to form a melted portion that does not overlap a joint line between the at least two substrates with a first welding step; and increasing melt volume and penetration depth of the melted portion between the at least two substrates with a second welding step.

A hairpin welding method welds wire ends of at least two copper wires, arranged flush next to one another, to one another by a laser beam. The laser beam is generated with a beam cross section that impinges on the wire ends at an end side and has a round core region and a ring region surrounding the round core region. A ratio of an external diameter of the ring region to a diameter of the core region is between 7:1 and 2:1. A ratio of a laser power in the core region to a laser power in the ring region is between 10:90 and 70:30.

A method for joining copper hairpins includes providing at least two ends to be joined to one another of the copper hairpins, and joining the copper hairpins. The copper hairpins are joined by laser beam welding with a machining beam having a wavelength of less than 1000 nm.

In an example, use of a solder joint may include a solder joint layer having a melted solder material containing Sn as a main component and further containing Ag and/or Sb and/or Cu; and a joined body including a NiPCu plating layer on a surface of the joined body in contact with the solder joint layer. The NiPCu plating layer may contain Ni as a main component and may contain 0.5% by mass or greater and 8% by mass or less of Cu and 3% by mass or greater and 10% by mass or less of P, and the NiPCu plating layer may have a microcrystalline layer at an interface with the solder joint layer.