G06F117/10

Heterogeneous integration of components onto compact devices using moir? based metrology and vacuum based pick-and-place

A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moir? alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Heterogeneous integration of components onto compact devices using moiré based metrology and vacuum based pick-and-place

A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moir alignment techniques resulting in highly accurate, parallel assembly of feedstocks.