The present invention relates to a substrate cleaning system and a substrate cleaning method for cleaning a substrate. The substrate cleaning system (50) includes a heater (51), a chemical-liquid diluting module (52), and a cleaning module. A temperature of the diluted-chemical-liquid mixed by the chemical-liquid diluting module (52) is determined to be higher than normal a temperature and lower than a glass transition point of a cleaning member. The cleaning member scrubs the substrate (W) with the diluted chemical liquid having the determined temperature supplied to the substrate (W).

In some implementations, the power plant may include an array having 200 or more modules. In addition, the array may have conterminous modules. Arrays may include modules having a contact point that rests on the ground or a contact surface of one or more structures. In some implementations, 90% of the power-plant arrays have 800 or more modules. In some plants, the ground supports 90 percent of the conterminous modules. In some plants, neither the plants nor the arrays do not contain stowing functionality or extreme dampening functionality.

According to one embodiment, a cleaner head includes a first rotor, a second rotor, and a contact surface. The first rotor can be rotationally driven in a state where an outer peripheral surface of the first rotor is in contact with a sheet that includes organic fiber and is formed on a base, and can remove a part of the sheet from the base. The second rotor is arranged next to the first rotor in a direction along a rotation axis of the first rotor, and is rotated together with the first rotor in a state where the second rotor is not in contact with the sheet. The contact surface is in contact with an outer peripheral surface of the second rotor at a position away from the sheet around the rotation axis.

The group of inventions can be used for removal of deposits in sewers and the simultaneous removal thereof in various pipelines, providing mechanization of the cleaning process in a sewage pipeline and eliminating the need for disassembling the drain system and manually cleaning it. A movable element and a cleaning tool mounted thereon, both arranged within the sewage pipeline, are moved along the sewage pipeline by means of a drive mounted outside the sewage pipeline and connected to the movable element. In the initial position, the cleaning tool is located at the end of the sewage pipeline, outside the sewage pipeline portion connecting the drain pipe with a riser. When the cleaning tool reaches the end position at the junction of the sewage pipeline and the riser, the drive and the movable element move the cleaning tool to its initial position.

A paint brush cleaning system includes a housing and a paint brush cleaner attached to the housing. The housing contains solvent that helps clean a paint brush. The paint brush cleaner rotates a wire brush against the bristles of the paint brush and actuates a pump to eject solvent drawn from the housing as the paint brush is moved in translation. The wire brush is coupled to a retractable cord, which rotates the wire brush. A holder is simultaneously coupled to the retractable cord and the pump. When force is exerted on the holder, the retractable cord rotates the wire brush and the pump ejects solvent. A user can insert a paint brush handle through the holder, thus actuating the pump and rotating the wire brush by applying force to the handle. The housing attaches to a user's belt, providing easy access to the paint brush cleaning system.

The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

The present disclosure relates to an optical fiber processing apparatus. The optical fiber processing apparatus comprising: a fixing module for fixing an optical fiber; and a stripping module for stripping layers outside an uncoated bare fiber of the optical fiber, The stripping module may comprise a stripping member which comprises two bodies arranged in parallel. Each body is provided with two or more kinds of blades suitable for stripping different sizes of layers outside the uncoated bare fiber, and each body is configured to be rotatable about its longitudinal axis to select different blades among the two or more kinds of blades, thereby enabling the stripping member to strip two or more sizes of layers outside the uncoated bare fiber.

A gate valve device includes a cleaning component, a first lifting component, and a second lifting component. The cleaning component is arranged on the second lifting component. The first lifting component is configured to control whether an opening on a side of a vacuum chamber close to a swing gate valve is in a closed state. The second lifting component is configured to, in a case that the opening on the side of the vacuum chamber close to the swing gate valve is in the closed state, control the cleaning component to clean the swing gate valve.

An apparatus for automatically cleaning a nozzle of a gas supply system is provided. The apparatus includes a carrier with a gas inlet that is adapted to sealingly mate with the nozzle of the gas supply system and an automated nozzle cleaning system in the carrier. The automated nozzle cleaning system includes a first nozzle cleaning device, a second nozzle cleaning device, and a function switching plate. The function switching plate comprises a plurality of through holes, a first through hole of the plurality of through holes is configured to engage the first nozzle cleaning device with the gas inlet when the function switching plate is positioned at a first position, and a second through hole of the plurality of through holes is configured to engage the second nozzle cleaning device with the gas inlet when the function switching plate is positioned at a second position.

A handheld snow removing system includes an intake scoop with a rotating intake auger, a discharge chute configured to direct a flow of material to a point outside of the handheld snow removing system, a fan chamber disposed between the intake scoop and the discharge chute, and an energy-conversion device configured to drive elements of the fan chamber and the rotating intake auger. The fan chamber includes a fan configured to create a suction force within the fan chamber to create the flow of material from the intake scoop, through the fan chamber, and out through the discharge chute.