An ultrasonic sensor includes an element substrate having a first and a second surface at an opposite side of the first surface, including an opening section piercing through the element substrate in a Z direction from the first to second surface, a vibrating plate on the first surface of the element substrate to close the opening section, a plurality of vibration regions extending along an X direction orthogonal to the Z direction on the vibration plate in positions overlapping the opening section, and a plurality of piezoelectric elements to correspond to the plurality of vibration regions of the vibration plate. The opening section includes, on the first surface, a first and second side parallel to the X direction and a third and fourth side coupling end portions in the X direction of the first and second sides at an acute or obtuse angle to the first and the second side.

In an angular velocity sensor, a pair of support parts are separated from each other in an x-axis direction in an orthogonal coordinate system xyz. A main part extends along the x-axis. A pair of extension parts connect two ends of the main part and inner sides of the support parts. The driving arms extend from the main part alongside each other in a y-axis direction separated from each other in the x-axis direction. The detecting arm extends from the main part in the y-axis direction at a position which is between the pair of driving arms. The driving circuit supplies voltages so that the pair of driving arms vibrate so as to bend to inverse sides from each other in the x-axis direction. The detecting circuit detects the signal generated due to bending deformation of the detecting arm in the z-axis direction.

An ultrasonic sensor includes a vibration plate that includes a vibration portion and is formed of a resin; a wall portion that is provided on the vibration plate, surrounds the vibration portion and is formed of a resin; and a piezoelectric element that is provided in the vibration portion of the vibration plate. Accordingly, the wall portion surrounding the vibration portion can suppress a frequency variation of an ultrasonic wave output from the ultrasonic sensor and can deform the ultrasonic sensor into a shape corresponding to a surface of an object having various shapes.

A wafer level ultrasonic chip module includes a substrate, a composite layer, a conducting material, and a base material. The substrate has a through slot that passes through an upper surface of the substrate and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The protective layer has an opening, from which a partial upper surface of the ultrasonic body is exposed. The conducting material is in contact with the upper surface of the ultrasonic body. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.

An ultrasound system, probe and method are provided. The ultrasound system includes a transducer with piezoelectric transducer elements polarized in a poling direction. A bipolar transmit circuit is configured to generate a transmit signal having first and second polarity segments. The first and second polarity segments have corresponding first and second peak amplitudes. A bias generator is configured to generate a bias signal in a direction of the poling direction. The bias signal is combined with the transmit signal to form a biased transmit signal that is shifted in the direction of the poling direction and still includes both of positive and negative voltages over a transmit cycle.

A piezoelectric drive element disposed on a placement surface of a metal substrate includes a piezoelectric drive body having a first main surface opposite the placement surface, a second main surface on a placement surface side, and a side surface, and a first electrode disposed on the first main surface. The piezoelectric drive element is disposed on the placement surface such that a part of the placement surface is located outside the side surface. A second bonding member having conductivity includes a first portion disposed between the placement surface and the piezoelectric drive element, and a second portion being continuous from the first portion and disposed in a corner formed by the part of the placement surface and the side surface. The second portion does not reach the first electrode.

An object of the present invention is to provide a piezoelectric element capable of improving the sound pressure particularly in a high frequency band by decreasing the impedance in a case of being used as an electroacoustic transducer or the like, and a piezoelectric speaker formed of a piezoelectric film. The object can be achieved by using a piezoelectric film in which a piezoelectric layer containing piezoelectric particles in a polymer matrix is sandwiched between electrode layers, a planar shape is a polygon, the piezoelectric film has a protruding portion protruding from a side of a polygon other that a shortest side, and the protruding portion is provided with connecting portions for connecting an external power supply and an electrode layer or identical connecting portions are provided in the vicinity of end portions on a side other than the shortest side.

Various embodiments of an interconnect device and modules and systems that utilize such interconnect device are disclosed. In one or more embodiments, the interconnect device can include a printed circuit board (PCB). The PCB can include a substrate forming a resiliently deflectable element, a conductive material disposed on the substrate, and an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material. The interconnect device can also include a connector that includes a connecting pin configured to electrically couple with the electrical contact of the resiliently deflectable element of the PCB and cause the resiliently deflectable element to deflect when the element contacts the connecting pin.

A piezoelectric element includes a piezoelectric body including a piezoelectric material, and a first electrode and a second electrode provided on the piezoelectric body. The piezoelectric body includes a base and a plurality of drivers. The base includes a first main surface and a second main surface opposing each other. The plurality of drivers is arranged on the first main surface in such a way as to be separate from each other. Each of the plurality of drivers includes a third main surface contacting the first main surface and a fourth main surface opposing the third main surface. The base includes a plurality of first regions in which the plurality of drivers is provided and a second region provided between the first regions adjacent to each other. The base is curved.

Disclosed is an electronic device. The electronic device includes a housing provided with an opening, a functional device movably mounted on the housing, and a driving mechanism and a transmission mechanism mounted in the housing. The driving mechanism includes a piezoelectric device that vibrates when being energized. The transmission mechanism includes a cam disposed at an inner side of the functional device and including a wheel body mounted on the piezoelectric device and a protruding portion disposed at a wheel rim of the wheel body. The piezoelectric device drives the cam to rotate between a first location and a second location. When the cam is at the first location, the functional device is located in the housing. When the cam is at the second location, the protruding portion drives at least part of the functional device to extend out of the housing from the opening.