Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

The invention provides a method of detecting crystallographic defects, comprising: sampling wafer of an ingot in complying with a predetermined wafer sampling frequency; identifying crystallographic defects of the wafer to show the crystallographic defects of the wafer; characterizing observation of the crystallographic defects of the wafer and extracting a value characterizing the crystallographic defects; through a result of characterizing the crystallographic defects, obtaining a radial distribution of density of the wafer and categorizing the crystallographic defects; and obtaining an isogram of the crystallographic defects of the wafer to show a crystallographic defect distribution of the whole ingot according to the value characterizing the crystallographic defects and categories of the crystallographic defects. It is no need to break the ingot to obtain the crystallographic defect distribution of the whole ingot, through which the technology for growing the ingot may be effectively adjusted to obtain the ingot with required characteristics of defect.

A system includes a plurality of semiconductor processing tools; a carrier purge station; a carrier repair station; and an overhead transport (OHT) loop for transporting one or more substrate carriers among the plurality of semiconductor processing tools, the carrier purge station, and the carrier repair station. The carrier purge station is configured to receive a substrate carrier from one of the plurality of semiconductor processing tools, purge the substrate carrier with an inert gas, and determine if the substrate carrier needs repair. The carrier repair station is configured to receive a substrate carrier to be repaired and replace one or more parts in the substrate carrier.

Disclosed are apparatus and methods for performing small angle x-ray scattering metrology. This system includes an x-ray source for generating x-rays and illumination optics for collecting and reflecting or refracting a portion of the generated x-rays towards a particular focus point on a semiconductor sample in the form of a plurality of incident beams at a plurality of different angles of incidence (AOIs). The system further includes a sensor for collecting output x-ray beams that are scattered from the sample in response to the incident beams on the sample at the different AOIs and a controller configured for controlling operation of the x-ray source and illumination optics and receiving the output x-rays beams and generating an image from such output x-rays.

Methods and systems for performing simultaneous spectroscopic measurements of semiconductor structures over a broad range of angles of incidence (AOI), azimuth angles, or both, are presented herein. Spectra including two or more sub-ranges of angles of incidence, azimuth angles, or both, are simultaneously measured over different sensor areas at high throughput. Collected light is linearly dispersed across different photosensitive areas of one or more detectors according to wavelength for each subrange of AOIs, azimuth angles, or both. Each different photosensitive area is arranged on the one or more detectors to perform a separate spectroscopic measurement for each different range of AOIs, azimuth angles, or both. In this manner, a broad range of AOIs, azimuth angles, or both, are detected with high signal to noise ratio, simultaneously. This approach enables high throughput measurements of high aspect ratio structures with high throughput, precision, and accuracy.

Production of perforated two-dimensional materials with holes of a desired size range, a narrow size distribution, and a high and uniform density remains a challenge, at least partially, due to physical and chemical inconsistencies from sheet-to-sheet of the two-dimensional material and surface contamination. This disclosure describes methods for monitoring and adjusting perforation or healing conditions in real-time to address inter- and intra-sheet variability. In situ or substantially simultaneous feedback on defect production or healing may be provided either locally or globally on a graphene or other two-dimensional sheet. The feedback data can be used to adjust perforation or healing parameters, such as the total dose or efficacy of the perforating radiation, to achieve the desired defect state.

Non-contact measurement of one or more electrical response characteristics of a LED structure includes illuminating an illumination area of a surface of a light emitting diode structure with one or more light pulses, measuring a transient of a luminescence signal from a luminescence area within the illumination area of the light emitting diode structure with a luminescence sensor, determining a first luminescence intensity at a first time of the measured transient of the luminescence signal from the light emitting diode structure, determining a second luminescence intensity at a second time different from the first time of the measured transient of the luminescence signal from the light emitting diode structure and determining an intensity of the electroluminescence component of the luminescence signal from the light emitting diode structure based on the first luminescence signal and the second luminescence signal.

A method is provided for precisely enlarging a nanopore formed in a membrane. The method includes: applying an electric potential across the nanopore, where the electric potential has a pulsed waveform oscillating between a high value and a low value; measuring current flowing though the nanopore while the electric potential is being applied to the nanopore at a low value; determining size of the nanopore based in part on the measured current; and removing the electric potential applied to the membrane when the size of the nanopore corresponds to a desired size.

Various samples are generated on a substrate. The samples each includes or consists of one or more analytes. In some instances, the samples are generated through the use of gels or through vapor deposition techniques. The samples are used in an instrument for screening large numbers of analytes by locating the samples between a working electrode and a counter electrode assembly. The instrument also includes one or more light sources for illuminating each of the samples. The instrument is configured to measure the photocurrent formed through a sample as a result of the illumination of the sample.

The present invention provides a method for evaluating a semiconductor wafer concerning a breaking strength of a notch portion of the semiconductor wafer, comprising: applying a load to a notch portion of the semiconductor wafer to be evaluated toward the center of the wafer such that the notch portion of the semiconductor wafer is broken; and evaluating the breaking strength of the notch portion. The present invention provides a method and an apparatus for evaluating a semiconductor wafer that can evaluate the breaking strength of a notch portion of a semiconductor wafer with higher precision and higher sensitivity.