A photoelectric packaging structure, and a preparation method of the photoelectric packaging structure, and a camera module having the photoelectric packaging structure are provided. The photoelectric packaging structure includes a substrate module and a photosensitive chip. The substrate module includes a substrate, and the substrate module defines a plurality of channels. The photosensitive chip is located on the substrate, and includes a photosensitive area and a non-photosensitive area connected to the photosensitive area. Two ends of each of the channels extend to the substrate and the non-photosensitive area, respectively. A conductive layer is formed on an inner wall of each of the channels to form a hollow conductive channel. The hollow conductive channel is electrically connected to the substrate and the non-photosensitive area.

A sensor package comprises a first substrate and a second substrate. A first substrate sensor element is mounted on an inner surface of the first substrate and between the first substrate and the second substrate, and a second substrate sensor element is mounted on an inner surface of the second substrate and between the first substrate and the second substrate. A first side sensor element and a second side sensor element are mounted vertically between the first substrate and the second substrate, wherein the first and second side sensor elements have respective sensing areas facing away from each other and outwards of the sensor package, and wherein the first and second side sensor elements are electrically coupled to at least one of the first substrate and the second substrate. A first side clear mold and a second side clear mold are formed to cover the respective sensing areas of the first and second side sensor elements. An encapsulant layer is formed between the first substrate and the second substrate to encapsulate the first substrate sensor element, the second substrate sensor element and the first and second side sensor elements.

An optical interposer can be formed from multiple wafers, including a photonic integrated circuit wafer and an interposer wafer. The photonic integrated circuit wafer can be bonded to a rigid carrier structure, and material near waveguides can be removed such that the waveguides can be coupled to waveguides of the interposer. The photonic integrated circuit can be separated into multiple rigid dies which can be bonded to the interposer separately. Additional processing can be performed to form electrical connections to the rigid dies to form an ultra-low optical interposer.

A photosensitive chip, a manufacturing method thereof, and a photosensitive module are provided. The photosensitive chip includes an isosceles trapezoid body, a positive electrode, and a negative electrode. The isosceles trapezoid body comprises an N-type semiconductor layer and a P-type semiconductor layer. The P-type semiconductor layer is disposed adjacent to the N-type semiconductor layer. The positive electrode is electrically connected to the P-type semiconductor layer, and the negative electrode is electrically connected to the N-type semiconductor layer.

A method for manufacturing a semiconductor apparatus includes a step of preparing a first semiconductor substrate, a second semiconductor substrate including a first semiconductor layer and a second semiconductor layer, and a third semiconductor substrate, a bonding step of bonding the second semiconductor substrate and the third semiconductor substrate to one main surface of the first semiconductor substrate, and a thinning step of removing at least the second semiconductor layer of the second semiconductor substrate by wet etching after the bonding step. The first semiconductor layer includes a P type impurity region or an N type impurity region, the second semiconductor layer includes a P+ region. An etching rate of an etchant used in the thinning step for the second semiconductor layer is higher than an etching rate for the first semiconductor layer.

The present disclosure relates to the technical field of photovoltaics, and in particular, to a segmented solar cell, a method for forming the same, and a photovoltaic module. The segmented solar cell is formed by cutting a solar cell, and the segmented solar cell includes a substrate and a cutting surface formed by cutting a solar cell to form the segmented solar cell. The cutting surface exposes a cross section of the substrate. At least part of the cutting surface includes a first texture structure, the first texture structure includes polygonal portions, and at least one polygonal portion of the polygonal portions partially overlaps with at least one neighboring polygonal portion of the polygonal portions. According to the present disclosure, it is conducive to at least improving performance of the segmented solar cell and the photovoltaic module.

An optical interposer can be formed from multiple wafers, including a photonic integrated circuit wafer and an interposer wafer. The photonic integrated circuit wafer can be bonded to a rigid carrier structure, and material near waveguides can be removed such that the waveguides can be coupled to waveguides of the interposer. The photonic integrated circuit can be separated into multiple rigid dies which can be bonded to the interposer separately. Additional processing can be performed to form electrical connections to the rigid dies to form an ultra-low optical interposer.

According to an embodiment, a method of manufacturing an optical sensor package includes forming a partition wall in each of substrate units on a substrate strip, mounting sensor elements on each of the substrate units, the sensor elements including a light-emitting unit and a light-receiving unit, and forming a molding member, using an encapsulant, in each of the substrate units, wherein the partition wall is arranged between the light-emitting unit and the light-receiving unit.

An optical interposer can be formed from multiple wafers, including a photonic integrated circuit wafer and an interposer wafer. The photonic integrated circuit wafer can be bonded to a rigid carrier structure, and material near waveguides can be removed such that the waveguides can be coupled to waveguides of the interposer. The photonic integrated circuit can be separated into multiple rigid dies which can be bonded to the interposer separately. Additional processing can be performed to form electrical connections to the rigid dies to form an ultra-low optical interposer.

A curved photovoltaic tile (100) and a manufacturing method thereof. The method includes: cutting at least one complete solar cell (11) to obtain a plurality of flat solar cells (12); electrically connecting the plurality of flat solar cells (12) to form a flat solar cell unit (13); arranging the flat solar cell unit (13) on a flat backsheet (14) to obtain a flat assembly (10); shaping the flat assembly (10) to obtain a curved assembly (20); and stacking and fixing the curved assembly (20) and a curved panel (30) to obtain the curved photovoltaic tile (100), wherein the curved assembly (20) has a same shape as the curved panel (30).