An apparatus for transferring a substrate is disclosed herein. More specifically, the apparatus relates to substrate handling systems used in semiconductor device manufacturing, and more particularly, to substrate handling systems having a substrate handler with enclosed moving elements and increased compatibility with post-CMP cleaning modules. The apparatus includes one or more indexing assemblies. Each of the indexing assemblies including an enclosure, an actuator assembly disposed within the enclosure, and two handling blades disposed outside of the disclosure. Each of the two blades are moveable in either of a translational or a rotating manner.

A substrate transfer mechanism for transferring a substrate to each of a plurality of stacked processing modules that process the substrate includes an arm base provided with a first driver, a lift configured to move up and down the arm base, a first arm extending transversely from a lower side of the arm base, and having a tip end that pivots around a vertical axis with respect to the arm base by the first driver, a second arm extending transversely from an upper side of the tip end of the first arm, and having a tip end that pivots around a vertical axis with respect to the first arm along with the pivoting of the first arm, and a substrate holder provided on an upper side of the tip end of the second arm, and configured to rotate around a vertical axis with respect to the second arm.

A substrate transfer mechanism for transferring a substrate to each of a plurality of stacked processing modules that process the substrate includes an arm base provided with a first driver, a lift configured to move up and down the arm base, a first arm extending transversely from a lower side of the arm base, and having a tip end that pivots around a vertical axis with respect to the arm base by the first driver, a second arm extending transversely from an upper side of the tip end of the first arm, and having a tip end that pivots around a vertical axis with respect to the first arm along with the pivoting of the first arm, and a substrate holder provided on an upper side of the tip end of the second arm, and configured to rotate around a vertical axis with respect to the second arm.

An end effector adapted to be carried by a robot positioning apparatus for packing items of produce, the end effector adapted in use for holding an open topped elongate container (tube) in an inverted orientation, wherein the tube has a closed bottom end and an open top end; the end effector comprising: at least one actuatable movable element located on the end effector so as to be adjacent the open end of a tube held by the end effector; wherein the actuatable movable element is configured to be operable between: an extended position which at least partially extends over the open end of a tube held by the end effector to at least partially obstruct the open end of the tube; and a retracted position so that the open end of the container is substantially unobstructed to allow items of produce to be received in the tube.

The transfer operation of moving the slider between one fixed linear module and the movable linear module while locating the movable linear module in the facing range facing toward the one fixed linear module, out of the plurality of linear modules arranged in parallel, is performed. At this time, a judgement process of judging whether or not the coordinate axis of the one fixed linear module and the coordinate axis of the movable linear module are continuous is performed. If it is judged that the coordinate axes are not continuous, the transfer operation is performed while the speed control is executed for the slider. Thus, it is possible to suppress the occurrence of a situation where the transfer operation of moving the slider between the movable linear modules cannot be performed due to the discontinuity of the coordinate axes respectively set for the movable linear modules.

A pre-jig wafer carrier disc installation/uninstallation device and a method thereof, including a first displacement mechanism, a wafer frame installation/uninstallation mechanism, a wafer installation/uninstallation mechanism, a mask installation/uninstallation mechanism and a robotic arm arranged around the first displacement mechanism. The said mechanisms sequentially stack the wafer frame, the wafer and the mask on the first displacement mechanism to form an assembly. An installation/uninstallation mechanism is disposed at a movable end of the robotic arm. The robotic arm drives the installation/uninstallation mechanism to remove and lock the assembly on an assembly carrier section of a carrier disc for successive processing. After the wafers are processed, the robotic arm drives the installation/uninstallation mechanism to move the assembly back onto the first displacement mechanism. The said mechanisms sequentially disassemble the assembly and recover the mask, the wafer and the wafer frame.

A pre-jig wafer carrier disc installation/uninstallation device and a method thereof, including a first displacement mechanism, a wafer frame installation/uninstallation mechanism, a wafer installation/uninstallation mechanism, a mask installation/uninstallation mechanism and a robotic arm arranged around the first displacement mechanism. The said mechanisms sequentially stack the wafer frame, the wafer and the mask on the first displacement mechanism to form an assembly. An installation/uninstallation mechanism is disposed at a movable end of the robotic arm. The robotic arm drives the installation/uninstallation mechanism to remove and lock the assembly on an assembly carrier section of a carrier disc for successive processing. After the wafers are processed, the robotic arm drives the installation/uninstallation mechanism to move the assembly back onto the first displacement mechanism. The said mechanisms sequentially disassemble the assembly and recover the mask, the wafer and the wafer frame.

An automated system for de-stacking a plurality of stacked objects, the automated system comprising a lift assembly and a grabber assembly. The lift assembly comprises a tower, and a number of electric motors. The tower is configured to rotate about a vertically-extending axis. One of the electric motors is configured to rotate the tower. Another one of the electric motors is configured to raise and lower the grabber assembly. The grabber assembly is configured to move with the tower as the tower rotates and comprises a claw and an electric motor. The claw is configured to grasp the objects individually. The electric motor of the grabber assembly is configured to actuate the claw. The first, second, and third electric motors are configured to operate in a refrigerated environment.

An automated system for de-stacking a plurality of stacked objects, the automated system comprising a lift assembly and a grabber assembly. The lift assembly comprises a tower, and a number of electric motors. The tower is configured to rotate about a vertically-extending axis. One of the electric motors is configured to rotate the tower. Another one of the electric motors is configured to raise and lower the grabber assembly. The grabber assembly is configured to move with the tower as the tower rotates and comprises a claw and an electric motor. The claw is configured to grasp the objects individually. The electric motor of the grabber assembly is configured to actuate the claw. The first, second, and third electric motors are configured to operate in a refrigerated environment.

A method includes: receiving a substrate on a first stage by a holder of a substrate transfer mechanism; causing the substrate to pass through a first measurement part, and measuring a first true deviation amount between the holder and the substrate at a first position; causing, when transferring the substrate toward a second stage, the substrate to pass through a second measurement part, and measuring a second true deviation amount between the holder and the substrate at a second position; reflecting a difference between the first and second true deviation amounts to a physical model to correct the physical model; calculating a position correction amount of the holder on the second stage from a thermal displacement amount of the holder at the second position; and controlling the substrate transfer mechanism based on the position correction amount to perform a position correction of the holder.