A substrate processing method includes processing a substrate, which has a first main surface to which a protection tape is attached, from a side of a second main surface thereof, which is opposite from the first main surface; and transferring the substrate in a state that an electrostatic supporter configured to be attracted by an electrostatic attraction force is connected to the substrate after being processed in the processing of the substrate. Since the substrate after being processed is transferred in the state that the electrostatic supporter is connected thereto, weakness of the substrate can be supported by the electrostatic supporter, so that deformation or damage of the substrate during the transfer thereof can be suppressed.

There is provided a conveyance system that conveys a workpiece to each of plural processing apparatuses. The conveyance system includes a conveyance passage, an automated workpiece conveying vehicle that travels on the conveyance passage, a stock unit, and a control unit. The conveyance passage is set in a space directly above the processing apparatus across the plural processing apparatuses. The stock unit includes a workpiece conveying part that conveys the workpiece between a workpiece stocker that houses the workpiece supplied to the processing apparatus and the automated workpiece conveying vehicle.

There is provided a conveyance system that conveys a workpiece to each of plural processing apparatuses. The conveyance system includes a conveyance passage, an automated workpiece conveying vehicle that travels on the conveyance passage, a stock unit, and a control unit. The conveyance passage is set in a space directly above the processing apparatus across the plural processing apparatuses. The stock unit includes a workpiece conveying part that conveys the workpiece between a workpiece stocker that houses the workpiece supplied to the processing apparatus and the automated workpiece conveying vehicle.

In an overhead conveyance vehicle that travels along a rail serving as a conveyance track mounted on a ceiling and conveys a target magazine along the rail, when an elevating unit holding the magazine is hoisted or lowered between a conveyance position and a transfer position, a controller for controlling the operation of the overhead conveyance vehicle determines, based on an image captured by a camera, the presence or absence of an obstacle in an imaging range captured by the camera.

In an overhead conveyance vehicle that travels along a rail serving as a conveyance track mounted on a ceiling and conveys a target magazine along the rail, when an elevating unit holding the magazine is hoisted or lowered between a conveyance position and a transfer position, a controller for controlling the operation of the overhead conveyance vehicle determines, based on an image captured by a camera, the presence or absence of an obstacle in an imaging range captured by the camera.

A substrate transfer device according to an embodiment includes: a holding part configured to hold a substrate having a pattern formed on a front surface thereof; and a supply part configured to supply an inert gas, which locally keeps the front surface of the substrate held by the holding part in a low oxygen state, to the front surface of the substrate.

A substrate transfer device according to an embodiment includes: a holding part configured to hold a substrate having a pattern formed on a front surface thereof; and a supply part configured to supply an inert gas, which locally keeps the front surface of the substrate held by the holding part in a low oxygen state, to the front surface of the substrate.

To provide a transfer chamber capable of replacing a chemical filter without affecting an internal atmosphere, and shortening or eliminating stop time of a transfer process of a wafer (W) associated with replacement of the chemical filter. The transfer chamber transfers the wafer (W) to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL1) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) provided in the midstream of the circulation path (CL1), and a connecting and disconnecting means (8) which switches connection and disconnection of the chemical filter unit (7) to and from the circulation path (CL1).

To provide a transfer chamber capable of replacing a chemical filter without affecting an internal atmosphere, and shortening or eliminating stop time of a transfer process of a wafer (W) associated with replacement of the chemical filter. The transfer chamber transfers the wafer (W) to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL1) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) provided in the midstream of the circulation path (CL1), and a connecting and disconnecting means (8) which switches connection and disconnection of the chemical filter unit (7) to and from the circulation path (CL1).

Baffle plate to be attached to fluid flow-forming body includes baffle plate main body that is attachable to and detachable from fluid flow-forming body. Baffle plate main body allows a fluid to which suction is applied by negative pressure generated by fluid flow-forming body to pass through, while preventing a member from entering concave part of fluid flow-forming body. Baffle plate also includes support member that is attached to main body of fluid flow-forming body at one end thereof, and supports baffle plate main body at the other end thereof such that baffle plate main body opposes end face of fluid flow-forming body. Support member supports baffle plate main body such that a gap between end face and baffle plate main body is maintained, and a fluid path is formed that allows a fluid flowing out of concave part to flow.