There is described a method of mounting inserts, comprising the following steps: (i) Application of an adhesive film on one of the faces of an inserts tray (223) covering a plurality of through-holes (241) and respective depressions (242); (ii) Insertion of an insert (230) in each through-hole (241) of the tray (223) from a face of the inserts tray (223) opposite that of the adhesive film, securing one surface of the insert (23) onto this adhesive film; (iii) Cutout of the adhesive film forming a plurality of single films (245) associated with the inserts (230). There is further described an insert mounting device (300), comprising a holding table (314) held by a supporting base (311), the insert mounting device (300) further comprising a rotating tray holder (312), cooperating with a cutting system (313).

A device for stacking a plurality of partially connected labels into a plurality of partially connected pads of labels comprises a robot arm having at least one vacuum source configured to selectively supply a vacuum force. The device also includes a plate coupled to the robot arm and a flexible pad coupled to the plate and including a plurality of apertures configured to direct the majority of the vacuum force through the flexible pad to a surface of the plurality of partially connected labels.

Refers to the present invention, a device (1) that will be fabricated with appropriate material, with several dimensions, to be adapted to a computerized numeric platform, for the structural glazing process, which is a technique of fixing the glass and the frame, through application of the high adhesion double-sided tape between them, the structure remains hidden on the inner side, in two basic steps, one being application and cutting of the high adhesion double-sided tape over the glass sheet, and the other is (applying) correct pressure on them, for the purpose of replacing the current manual process.

Various embodiments of the present disclosure provide a random case sealer. The case sealer includes a top-head-actuating assembly configured to vary the speed of the top-head assembly when ascending (to make room for the case beneath the top-head assembly) and when descending onto the case (to engage the top surface of the case during sealing). This maximizes the speed of the top-head assembly while limiting overshoot (when ascending) and preventing damage to the case (when descending). In certain embodiments the case sealer includes a tape cartridge configured to limit the forces imparted onto the leading and top surfaces of the case during sealing. These features result in increased throughput as compared to prior art random case sealers without requiring stronger cases or more protective dunnage.

A tape sticking apparatus for sticking a masking tape for protecting a peripheral portion of a substrate, such as a wafer, is disclosed. The tape sticking apparatus includes: a substrate holder configured to hold and rotate a substrate; and a tape sticking unit configured to stick a masking tape onto a peripheral portion of the substrate held on the substrate holder.

A component package tape is transported to a pitch feed mechanism section by a tape transport device and is held in a first tape holding section by a tape holding releasing device. Furthermore, a top tape adhered to a carrier tape that is transported to the pitch feed mechanism section is peeled from the carrier tape by a top tape peeling section while being clamped at a leading end section, is transferred to a top tape delivery mechanism section, and is held in a second tape holding section by the tape holding releasing device.

The disclosure relates to a tape laying apparatus configured to lay prepreg tape to mould surface. The tape laying apparatus includes a tape supply spool, a compaction head, a cutting tool and at least one travel distance adjustment component. The tape supply spool is configured for the prepreg tape to be wound thereon. The compaction head is configured for delivering the prepreg tape to the mould surface from the tape supply spool. The cutting tool is movable along a cutting path. The cutting tool is configured to cut the prepreg tape passing through the cutting path. The at least one travel distance adjustment component is movably located between the cutting path and the compaction head and configured to push the prepreg tape passing through the cutting path so as to increase or decrease a travel distance of the prepreg tape from the cutting path to the compaction head.

A digital flatbed cutter is described. The cutter includes a flatbed on which a workpiece can be positioned. A head unit is movable in a plane above the flatbed. A tape applicator head and a cutter head are mounted to the head unit. The tape applicator head includes an applicator roller for applying a strip of tape to the workpiece that is rotatable about an axis that is normal to the plane so that strips of tape can be applied to the workpiece in any direction. The cutter head includes a knife or blade for cutting the workpiece. A creaser head that includes a creaser wheel for creasing the workpiece can also be mounted to the head unit.

A method for detecting irregularities on a material strand made of an elastomeric material comprises the steps of: (a) providing a material strand which defines a longitudinal axis along which the material strand is to be conveyed; (b) bringing a detection element in contact with the material strand, wherein at least one of the detection element being movably mounted in a direction of deflection transverse to the longitudinal axis and a force can act on the detection element in a force direction, (c) setting up a relative movement between the detection element and the material strand along the longitudinal axis; and (d) detecting at least one of a deflection of the detection element in the deflection direction and a force acting on the detection element in the force direction, so as to detect irregularities in the material strand.

Disclosed are systems for applying materials to components. The system comprises a tool operable for transferring a portion of a material from a supply of the material to a component. A first portion of the tool may be configured for cutting along a side or edge of the portion of the material. A second portion of the tool may be configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.