The present disclosure relates to fluidic systems and devices for processing, extracting, or purifying one or more analytes. These systems and devices can be used for processing samples and extracting nucleic acids, for example by isotachophoresis. In particular, the systems and related methods can allow for extraction of nucleic acids, including non-crosslinked nucleic acids, from samples such as tissue or cells. The systems and devices can also be used for multiplex parallel sample processing.

A micromechanical device that includes a first substrate, at least one first cavity, and a sealed inlet to the first cavity, the inlet extending through the first substrate. The inlet includes a laser-drilled first subsection and a plasma-etched second subsection, the plasma-etched second subsection having an opening to the first cavity, and the inlet in the first subsection being sealed by a molten seal made of molten mass of at least the first substrate. A combined laser drilling and plasma etching method for manufacturing micromechanical devices is also described.

A method for forming a film that covers a side wall of a through hole in a substrate having the through hole, the method including, in the following order, the steps of providing a substrate having a through hole that passes therethrough from a first surface to a second surface, which is a surface opposite to the first surface, forming, on the first surface, a lid member that blocks an opening of the through hole open on the first surface, recessing, in a direction away from the first surface, a surface of the lid member that blocks the opening by removing part of the lid member through the opening, and forming a film that covers the side wall of the through hole.

There is provided a nozzle substrate including a nozzle hole penetrating in a thickness direction. The nozzle substrate includes a main substrate including a first surface and a second surface, an oxidation film formed on the second surface of the main substrate, and a water repellent film formed on a surface at an opposite side to the main substrate side of the oxidation film. The nozzle hole includes a first through hole penetrating the main substrate in a thickness direction, a second through hole penetrating the oxidation film and being connected to the first through hole, and a third through hole penetrating the water repellent film and being connected to the second through hole. An inner circumference surface of the second through hole and an inner circumference surface of the third through hole are approximately flush.

Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) device in which a slit at a movable mass of the MEMS device has a top notch slit profile. The MEMS device may, for example, be a speaker, an actuator, or the like. The slit extends through the movable mass, from top to bottom, and has a width that is uniform, or substantially uniform, from the bottom of the movable mass to proximate the top of movable mass. Further, in accordance with the top notch slit profile, top corner portions of the MEMS substrate in the slit are notched, such that a width of the slit bulges at the top of the movable mass. The top notch slit profile may, for example, increase the process window for removing an adhesive from the slit while forming the MEMS device.

A sensing device includes a stack of dielectric layers having conductive materials disposed between the dielectric layers. A nanopore is disposed through the stacks of dielectric layers and separates the conductive materials to provide electrodes on opposite sides of the nanopore. Contacts connect to each of the electrodes.

A method for processing a silicon substrate is provided the method including repeatedly and alternately performing: an etching step of forming an etching pattern on the silicon substrate; and a protective film formation step of forming a protective film on a wall surface of the silicon substrate exposed in the etching step, wherein the method includes a protective film removal step of removing the protective film, which has been formed in the protective film formation step, by using a peeling solution, and wherein in the protective film formation step, the protective film is formed by using a mixed gas including 2,3,3,3-tetrafluoropropene and perfluorocyclobutane.

A micro-electro mechanical system (MEMS) pressure sensor includes a first substrate, a second substrate and a sensing structure. The second substrate is substantially parallel to the first substrate. The sensing structure is between the first substrate and the second substrate, and bonded to a portion of the first substrate and a portion of the second substrate, in which a first space between the first substrate and the sensing structure is communicated with outside, and a second space between the second substrate and the sensing structure is communicated with or isolated from the outside.

A method of fabricating nanopores in a-material, the method comprising: irradiating the material to create a track of damage in the material, the track of damage having one or more dimensions in the nanometre range; and etching the track of damage with an etchant to produce a nanopore.

A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.