Patent classifications
B81B3/0027
Integrated semiconductor devices with single crystalline beam, methods of manufacture and design structure
Bulk acoustic wave filters and/or bulk acoustic resonators integrated with CMOS devices, methods of manufacture and design structure are provided. The method includes forming a single crystalline beam from a silicon layer on an insulator. The method further includes providing a coating of insulator material over the single crystalline beam. The method further includes forming a via through the insulator material exposing a wafer underlying the insulator. The insulator material remains over the single crystalline beam. The method further includes providing a sacrificial material in the via and over the insulator material. The method further includes providing a lid on the sacrificial material. The method further includes venting, through the lid, the sacrificial material and a portion of the wafer under the single crystalline beam to form an upper cavity above the single crystalline beam and a lower cavity in the wafer, below the single crystalline beam.
MICROMECHANICAL DEVICE FOR ENHANCED ACCELERATION MEASUREMENT
Micromechanical device comprising: a semiconductor body; a movable structure configured to oscillate relative to the semiconductor body along an oscillation direction; and an elastic assembly with an elastic constant, coupled to the movable structure and to the semiconductor body and configured to deform along the oscillation direction to allow the oscillation of the movable structure as a function of an acceleration applied to the micromechanical device. The movable structure and the semiconductor body comprise a control structure for the capacitive control of the oscillation of the movable structure: when the control structure is electrically controlled in a first state the micromechanical device is in a first operating mode wherein a total elastic constant of the micromechanical device has a first value, and when it is electrically controlled in a second state the micromechanical device is in a second operating mode wherein the total elastic constant has a second value lower than, or equal to, the first value.
MICROMECHANICAL SENSOR ELEMENT
A micromechanical sensor element includes a substrate, a first structure movably arranged on the substrate, a second structure movably arranged on the substrate and an electrode arrangement, situated on the substrate in a fixed manner, which includes at least one first electrode. The movably arranged structures are coupled with each other by at least one coupling element in such a way that, upon a deflection of the first movably arranged structure along a first direction, the second movably arranged structure undergoes a deflection along an opposite direction. The first electrode includes a plurality of electrode surfaces. The movably arranged structures each include a plurality of movable electrode surfaces. The substrate-fixed electrode surfaces and the movable electrode surfaces engage with each other. The movable electrode surfaces are each situated on sides of the electrode surfaces of the substrate-fixed electrode arrangement facing away from the movably arranged structures.
Inertial sensor sampling with combined sense axes
A sensor system includes a transducer for sensing a physical stimulus along at least two orthogonal axes and an excitation circuit. The transducer includes a movable mass configured to react to the physical stimulus and multiple differential electrode pairs of electrodes. Each of the electrode pairs is configured to detect displacement of the movable mass along one of the orthogonal axes. The excitation circuit is connectable to the electrodes in various electrode connection configurations, with different polarity schemes, that enable excitation and sampling of each of the orthogonal axes during every sensing period. For each sensing period, a composite output signal is produced that includes the combined information sensed along each of the orthogonal axes. The individual sense signals for each orthogonal axis may be extracted from the composite output signals.
MEMS-tunable optical ring resonator
A microelectromechanical systems (MEMS)-tunable optical ring resonator is described herein. The ring resonator includes a resonator ring and a tuner ring, along with one or more springs. The springs may be internal or external, i.e., either within or outside the areal footprint of the resonator ring and the tuner ring. The one or more springs are configured to displace the tuner ring from the resonator ring by a desired gap based upon a desired resonant wavelength of the resonator ring. Tuning is implemented by applying a voltage to the ring resonator, with motion of the tuner ring causing a corresponding change in the effective index of the resonator ring. As the ring resonator is essentially a capacitive device, it draws very little power once tuning is achieved.
MEMS ACTUATOR ELEMENT AND MEMS ACTUATOR ARRAY WITH A PLURALITY OF MEMS ACTUATOR ELEMENTS
A MEMS (micro-electromechanical system) actuator element includes a substrate, a stationary first electrode structure with an edge structure, a second electrode structure with an edge structure, wherein the second electrode structure is deflectably coupled to the substrate by means of a spring structure and electrostatically deflectable by means of the first electrode structure to move the edge structure of the second electrode structure into an intermediate position between a minimum and maximum vertical deflection position, wherein the minimum and maximum deflection position specify a maximum deflection path, wherein the edge structures of the first and second electrode structures are to each other and are vertically spaced apart in the minimum deflection position and wherein, in the maximum deflection position, the vertical immersion path of the edge structure of the second electrode structure into the edge structure of the first electrode structure is up to 0.5 times the maximum deflection path z.sub.Sz.sub.S.
MICRON-RESOLUTION SOFT STRETCHABLE STRAIN AND PRESSURE SENSOR
The present invention features a stretchable strain sensor for detecting minute amounts of strain or pressure. The stretchable strain sensor may comprise a first soft polymer layer, a wrinkled conductive layer disposed on the first soft polymer layer, and a second soft polymer layer disposed on the wrinkled conductive layer. Strain applied to the sensor may cause the wrinkled conductive layer to stretch and crack and send a signal based on resistance. Pressure applied to the sensor may cause the wrinkled conductive layer to deform and crack and send a signal based on resistance. The stretchable strain sensor may be capable of measuring contractions of a tissue, detecting fluid flowing through a microfluidic channel, and detecting whether a microfluidic valve is closed or not.
MEMS SENSOR WITH TWO COMPLIANCES
A piezoelectric microelectromechanical systems microphone is provided comprising a sensor, an anchor region at which the sensor is supported by a substrate, a first region of the sensor adjacent to the anchor region having a first compliance, the first region having at least one piezoelectric layer and at least one electrode, and a second region of the sensor, the second region being adjacent to the first region, having at least one piezoelectric layer and at least one electrode, and having a second compliance, the first and second compliances being different. A method for manufacturing a piezoelectric microelectromechanical systems microphone is also provided.
MEMS SENSOR WITH A THIN REGION
A piezoelectric microelectromechanical systems microphone is provided comprising a sensor, an anchor region at which the sensor is supported by a substrate, a first region of the sensor adjacent to the anchor region, the first region having at least one piezoelectric layer and at least one electrode, and a second region of the sensor, the second region being adjacent to the first region, having at least one piezoelectric layer and at least one electrode, and having a thickness less than the thickness of the first region. A method for manufacturing a piezoelectric microelectromechanical systems microphone is also provided.
Eight spring dual substrate MEMS plate switch and method of manufacture
Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. A two-fold symmetric switch may be formed by a primary, secondary, and optionally tertiary set of voids formed in the movable plate. These voids may define the spring beams which provide a stable and reliable restoring force to the switch.