B81B3/0027

MICROMECHANICAL DEVICE INCLUDING A STOP SPRING STRUCTURE
20210323809 · 2021-10-21 ·

A micromechanical device including a substrate, a movable mass, and a stop spring structure, which includes a stop. The substrate includes a substrate surface in parallel to a main extension plane and the movable mass is situated movably above the substrate surface in relation to the substrate. The stop spring structure is connected to the movable mass. The stop is designed to strike against the substrate surface in the event of a deflection of the movable mass in a z direction, perpendicular to the main extension plane. The stop spring structure, at the location of the stop, includes a first spring constant, a second spring constant, in parallel to the main extension plane, and a third spring constant, in parallel to the main extension plane and perpendicular to the x direction. The first spring constant is greater than the second spring constant and/or is greater than the third spring constant.

Method for Manufacturing Three-Dimensionally Structured Member, Method for Manufacturing Acceleration Pickup, Accesleration Pickup, and Acceleration Sensor
20210278433 · 2021-09-09 ·

The purpose of the present invention is to provide a method for manufacturing a three-dimensionally structured member which can be made by a simpler process. The method for manufacturing a three-dimensionally structured member includes shaping a flat plate-shaped base member to produce a three-dimensionally structured member having a plurality of sections that are different from one another in thickness. The manufacturing method comprises: a mask formation step for forming a mask over the whole of at least one main surface of the base member; a mask removal step for removing a part of the mask; and an etching step for etching an exposed part of the base member, wherein a combination of the mask removal step and the etching step is performed on the mask and the base member that correspond to each of the plurality of sections of the three-dimensionally structured member, in the order from thinnest to the thickest of thicknesses of the three-dimensionally structured members.

PIEZOELECTRIC RING GYROSCOPE
20210247186 · 2021-08-12 ·

A ring gyroscope which comprises a substantially circular and flexible ring suspended from a substrate. The gyroscope comprises one or more primary piezoelectric split transducers placed on first sectors of the ring and one or more secondary piezoelectric split transducers placed on one or more second sectors of the ring. Each first sector crosses a transversal symmetry axis (T.sub.1, T.sub.2) of the ring and is symmetric with respect to that symmetry axis, and each second sector crosses a diagonal symmetry axis (D.sub.1, D.sub.2) of the ring and is symmetric with respect to that symmetry axis.

MICRO-OPTO-MECHANICAL SYSTEM SENSOR, ARRANGEMENT AND MANUFACTURING METHOD

There is provided a MOMS sensor comprising a fiber interface comprising a fiber passthrough for one or more optical fibers, a cavity comprising an element hermetically encapsulated within the cavity, wherein the element is movably anchored by SiN arms, which are movable with respect to walls of the cavity, wherein the SiN arms comprise anchor portions at first ends of the SiN arms, which are connected to the element, and at second ends of the SiN arms, which are connected to the walls of the cavity, and the fiber interface is configured to receive the fibers through the fiber passthrough into positions for communications of light between the element and the fibers. In this way a robust structure that supports sensitivity of the sensor is provided.

Composite sensor package

A composite sensor package includes: a substrate; a first sensor and a second sensor, which are arranged on the substrate with a predetermined gap therebetween; a signal processing device disposed on the substrate and processing a signal transmitted through the first and second sensors; and a cover disposed on the substrate, and including a package accommodation space enclosing the first sensor, the second sensor and the signal processing device, wherein the first sensor senses a state of air introduced from an outside and transmits the introduced air to the package accommodation space, and the second sensor senses the state of the air, which passes through the first sensor so as to flow into the package accommodation space.

Method for processing a monocrystalline substrate and micromechanical structure

In various embodiments, a method of processing a monocrystalline substrate is provided. The method may include severing the substrate along a main processing side into at least two monocrystalline substrate segments, and forming a micromechanical structure comprising at least one monocrystalline substrate segment of the at least two substrate segments.

Microphone assembly with back volume vent

The problem of contaminants entering a microphone assembly through a pressure equalization aperture is mitigated by moving the pressure equalization aperture from a location near the acoustic port to a location on the cover of the microphone assembly. This is achieved by fabricating an aperture reduction structure using a separate dedicated die, with an aperture of diameter ˜25 microns or less disposed on the aperture reduction structure, and then coupling the aperture reduction structure to the cover of the microphone. The relatively smaller aperture on the cover after the coupling of the aperture reduction structure is used for pressure equalization of the back volume of the microphone with a pressure outside of the microphone assembly.

MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING SAME
20210147223 · 2021-05-20 ·

A component for a micromechanical system has an upper side and a lower side disposed opposite the upper side and includes at least one first structural element that is arranged in a first region of the component and bounded by at least one first gap and at least one second structural element that is arranged in a second region of the component different from the first region and bounded by at least one second gap. The first region includes a first cutout in the lower side of the component, wherein a first thickness of the component in the first region is reduced in the second region with respect to a second thickness of the component. A minimal second gap width of the at least one second gap is larger than a minimal first gap width of the at least one first gap.

ENERGY HARVESTING DEVICES AND SENSORS, AND METHODS OF MAKING AND USE THEREOF
20210135600 · 2021-05-06 ·

Disclosed herein are energy harvesting devices and sensors, and methods of making and use thereof. The energy harvesting devices can comprise a membrane disposed on a substrate, wherein the membrane comprises a two-dimensional (2D) material and one or more ripples; and a component electrically, magnetically, and/or mechanically coupled to the membrane and/or the substrate, such that the component is configured to harvest energy from the membrane. The sensors can comprise a membrane disposed on a substrate, wherein the membrane comprises a two-dimensional material one or more ripples; and a component electrically, magnetically, and/or mechanically coupled to the membrane and/or the substrate, such that the component is configured to detect a signal from the membrane.

INERTIAL SENSOR SAMPLING WITH COMBINED SENSE AXES

A sensor system includes a transducer for sensing a physical stimulus along at least two orthogonal axes and an excitation circuit. The transducer includes a movable mass configured to react to the physical stimulus and multiple differential electrode pairs of electrodes. Each of the electrode pairs is configured to detect displacement of the movable mass along one of the orthogonal axes. The excitation circuit is connectable to the electrodes in various electrode connection configurations, with different polarity schemes, that enable excitation and sampling of each of the orthogonal axes during every sensing period. For each sensing period, a composite output signal is produced that includes the combined information sensed along each of the orthogonal axes. The individual sense signals for each orthogonal axis may be extracted from the composite output signals.