Patent classifications
B81B3/0027
MEMS Transducer for Interacting with a Volume Flow of a Fluid, and Method of Producing Same
A MEMS transducer for interacting with a volume flow of a fluid includes a substrate which includes a layer stack having a plurality of layers which form a plurality of substrate planes, and which includes a cavity within the layer stack. The MEMS transducer includes an electromechanical transducer connected to the substrate within the cavity and including an element which is deformable within at least one plane of movement of the plurality of substrate planes, deformation of the deformable element within the plane of movement and the volume flow of the fluid being causally correlated. The MEMS transducer includes an electronic circuit arranged within a layer of the layer stack, the electronic circuit being connected to the electromechanical transducer and being configured to provide a conversion between a deformation of the deformable element and an electric signal.
Liquid-resistant packaging for electro-acoustic transducers and electronic devices
A liquid-resistant microphone assembly includes a substrate defining a sound-entry region and a microphone transducer coupled with the substrate. The transducer has a sound-responsive region acoustically coupled with the sound-entry opening defined by the substrate. A liquid-resistant port membrane spans across the sound-entry opening defined by the substrate. The membrane is gas-permeable. An adhesive layer is positioned between the substrate and the liquid-resistant port membrane, coupling the liquid-resistant port membrane with the substrate and spacing the liquid-resistant port membrane from the substrate to form a gap between the membrane and the substrate. The adhesive layer defines an aperture having a periphery extending around and positioned outward of the sound-entry region. Modules and electronic devices incorporating such a microphone transducer also are disclosed.
MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME
A MEMS microphone includes a substrate defining a cavity, a diaphragm being spaced apart from the substrate, covering the cavity, and being configured to generate a displacement thereof in response to an applied acoustic pressure, an anchor extending from an end portion of the diaphragm, the anchor including a lower surface in contact with an upper surface of the substrate to support the diaphragm, a back plate disposed over the diaphragm, the back plate being spaced apart from the diaphragm such that an air gap is maintained between the back plate and the diaphragm, and defining a plurality of acoustic holes and an upper insulation layer provided on the substrate, covering the back plate, and holding the back plate to space the back plate from the diaphragm, the upper insulation layer having a flat plate shape to prevent sagging of the back plate.
Micro-opto-mechanical system sensor, arrangement and manufacturing method
There is provided a MOMS sensor comprising a fiber interface comprising a fiber passthrough for one or more optical fibers, a cavity comprising an element hermetically encapsulated within the cavity, wherein the element is movably anchored by SiN arms, which are movable with respect to walls of the cavity, wherein the SiN arms comprise anchor portions at first ends of the SiN arms, which are connected to the element, and at second ends of the SiN arms, which are connected to the walls of the cavity, and the fiber interface is configured to receive the fibers through the fiber passthrough into positions for communications of light between the element and the fibers. In this way a robust structure that supports sensitivity of the sensor is provided.
MEMS SENSOR COMPENSATION FOR OFF-AXIS MOVEMENT
A microelectromechanical system (MEMS) sensor includes a MEMS layer that includes fixed and movable electrodes. In response to an in-plane linear acceleration, the movable electrodes move with respect to the fixed electrodes, and acceleration is determined based on the resulting change in capacitance. A plurality of auxiliary electrodes are located on a substrate of the MEMS sensor and below the MEMS layer, such that a capacitance between the MEMS layer and the auxiliary loads changes in response to an out-of-plane movement of the MEMS layer or a portion thereof. The MEMS sensor compensates for the acceleration value based on the capacitance sensed by the auxiliary electrodes.
Microelectromechanical Device for Generating Sound Pressure
Embodiments generally relate to drives for microelectromechanical devices for generating a sound pressure that can be implemented in a microelectromechanical system (MEMS). The movable legs of the actuators are connected to one another by means of connecting elements and form a lateral surface, the volume of which can be changed by the movement of the legs to generate a sound pressure.
MEMS sensor compensation for off-axis movement
A microelectromechanical system (MEMS) sensor includes a MEMS layer that includes fixed and movable electrodes. In response to an in-plane linear acceleration, the movable electrodes move with respect to the fixed electrodes, and acceleration is determined based on the resulting change in capacitance. A plurality of auxiliary electrodes are located on a substrate of the MEMS sensor and below the MEMS layer, such that a capacitance between the MEMS layer and the auxiliary loads changes in response to an out-of-plane movement of the MEMS layer or a portion thereof. The MEMS sensor compensates for the acceleration value based on the capacitance sensed by the auxiliary electrodes.
MEMS actuator element and MEMS actuator array with a plurality of MEMS actuator elements
A MEMS (micro-electromechanical system) actuator element includes a substrate, a stationary first electrode structure with an edge structure, a second electrode structure with an edge structure, wherein the second electrode structure is deflectably coupled to the substrate by means of a spring structure and electrostatically deflectable by means of the first electrode structure to move the edge structure of the second electrode structure into an intermediate position between a minimum and maximum vertical deflection position, wherein the minimum and maximum deflection position specify a maximum deflection path, wherein the edge structures of the first and second electrode structures are to each other and are vertically spaced apart in the minimum deflection position and wherein, in the maximum deflection position, the vertical immersion path of the edge structure of the second electrode structure into the edge structure of the first electrode structure is up to 0.5 times the maximum deflection path z.sub.S.
MEMS device and process
The application describes MEMS transducers comprising a flexible membrane supported at a supporting edge relative to a substrate and further comprising one or more unbound edges. The shape of the unbound edge is selected so that the flexible membrane tends to bend along more than one bend axis in the region of the supporting edge.
Microelectromechanical system microphone
A microelectromechanical system (MEMS) includes a diaphragm with a first surface and a second surface. The first surface is exposed to an environmental pressure. The second surface comprises a plurality of fingers extending from the second surface. The MEMS also includes a backplate comprising a plurality of voids. Each of the plurality of fingers extends into a respective one of the plurality of voids. The MEMS further includes an insulator between a portion of the diaphragm and a portion of the backplate. The diaphragm is configured to move with respect to the backplate in response to changes in the environmental pressure.