Provided is a MEMS acoustic sensor including a substrate and a cavity, a back plate supported on the substrate and including a plurality of through-holes, at least one anchor projecting from the back plate toward the substrate, and a diaphragm supported by the at least one anchor and deformed by a sound wave introducing from the outside through the cavity, wherein no part of the deformed diaphragm comes into contact with the substrate.

The present invention provides a MEMS microphone, including a substrate and a capacitive structure. The capacitive structure includes a back plate and a vibration diaphragm. The vibration diaphragm includes a main body and a plurality of supporting structures for supporting the main body. Each supporting structure includes a supporting beam and two spring structures. Each spring structure includes at least two beam arms extending along the extension direction of the peripheral edge of the main body, and the beam arm closest to the main body is spaced apart from the main body. The sensitivity of the MEMS microphone in the present invention is higher.

A displacement increasing mechanism has a fixing portion, first and second actuators coupled to the fixing portion, a first beam having first and second end portions and coupled to the first actuator at the first end portion, a second beam having third and fourth end portions and coupled to the second actuator at the third end portion, and a drive target member coupled to a parallel arrangement portion at which the first and second beams are arranged in parallel with each other. The first actuator is driven to pull the first beam from a second end portion side in the direction of extending the first beam, and the second actuator is driven to push the second beam form a fourth end portion side in the direction of extending the second beam.

In methods and apparatus for increasing efficiency and optical bandwidth of a microelectromechanical system piston-mode spatial light modulator, an example apparatus includes: an electrode with spring legs; a base electrode; a mirror displacement determiner to determine a periodic signal corresponding to a displacement distance of the electrode beyond an instability point of the electrode; and a voltage source to output a periodic voltage to the base electrode in response to the periodic signal. The periodic voltage causes the spring legs to vary displacement of the electrode with respect to the base electrode according to the periodic voltage. The displacement includes distances beyond the instability point.

A gas sensor includes a silicon substrate, a detecting electrode, a first isolation film, a heating resistor, and a second isolation film that are successively stacked. The gas sensor has a base structure and a cantilever structure with a curled free end, and a gas sensitive material is provided on the end of the cantilever structure. A sensor array composed of the gas sensor, and a method for manufacturing the gas sensor are also provided. The method includes (1) selecting a sacrificial layer; (2) preparing a detecting electrode; (3) preparing a first isolation film; (4) preparing a heating resistor; (5) preparing a second isolation film; (6) releasing the membrane; and (7) loading the gas sensitive material.

A method of post-processing an actuator element is presented. The method begins by receiving a fabricated actuator element including a metallic layer contacting a substrate, sacrificial layer proximate the metallic layer, and a first dielectric layer on the sacrificial layer. The metallic layer has an end proximal to and contacting at least part of the substrate and a distal end extending over the first dielectric layer. A second dielectric is deposited on a portion of the metallic layer at the distal end. And, the sacrificial layer is removed.

A pressure sensor including: a structure which delimits a main cavity of a closed type, the structure being at least partially deformable as a function of a pressure external to the structure; and a MEMS device, which is arranged in the main cavity and generates an output signal, which is of an electrical type and is indicative of the pressure inside the main cavity.

The present disclosure provides a displacement amplification structure and a method for controlling displacement. In one aspect, the displacement amplification structure of the present disclosure includes a first beam and a second beam substantially parallel to the first beam, an end of the first beam coupled to a fixture site, and an end of the second beam coupled to a motion actuator; and a motion shutter coupled to an opposing end of the first and second beams. In response to a displacement of the motion actuator along an axis direction of the second beam, the motion shutter displaces a distance along a transversal direction substantially perpendicular to the axis direction.

The present disclosure provides a displacement amplification structure and a method for controlling displacement. In one aspect, the displacement amplification structure of the present disclosure includes a first beam and a second beam substantially parallel to the first beam, an end of the first beam coupled to a fixture site, an end of the second beam coupled to a motion actuator, and a motion shutter coupled to an opposing end of the first and second beams. In response to a displacement of the motion actuator along an axis direction of the second beam, the motion shutter displaces a distance along a transversal direction substantially perpendicular to the axis direction.

A gas sensor includes a silicon substrate, a detecting electrode, a first isolation film, a heating resistor, and a second isolation film that are successively stacked. The gas sensor has a base structure and a cantilever structure with a curled free end, and a gassensitive material is provided on the end of the cantilever structure. A sensor array composed of the gas sensor, and a method for manufacturing the gas sensor are also provided. The method includes (1) selecting a sacrificial layer; (2) preparing a detecting electrode; (3) preparing a first isolation film; (4) preparing a heating resistor; (5) preparing a second isolation film; (6) releasing the membrane; and (7) loading the gas sensitive material.