An actuator system can be used to adjust a position of a component in a spatial light modulator. The actuator system has a pair of actuators that are coupled together by a frame that is used to adjust the height of the component relative to the substrate. The frame includes a pair of moment arms that are coupled to the actuators and a pair of connecting arms that are coupled to the moment arms. The connecting arms are then connected together at about the center of the frame, which portion of the frame can be used to raise or lower the plate. The center of the frame can be raised or lowered by a shortening or lengthening of the connecting arms relative to each other.

According to one embodiment, a MEMS device is disclosed. The MEMS device includes a substrate, and a MEMS vibrator provided on the substrate. The MEMS vibrator includes a first vibration portion disposed above the substrate, and a control electrode to control a vibration property of the first vibration portion. The control electrode is disposed without contacting the first vibration portion.

A micro-electro-mechanical actuator device includes a fixed structure and a mobile structure. The mobile structure includes a first deformable band, a second deformable band, and a third deformable band, both of which extend on opposite sides of the first deformable band, each of which carries a piezoelectric actuator. In a working condition, in which the second and third piezoelectrics are biased, the second and third deformable bands are subjected to a negative bending, while the first deformable band is subjected to a positive bending. There are thus generated two translations that add together, causing a displacement of the first deformable band greater than the one that may be obtained by a single membrane of an equal base area.

A micromechanical z-inertial sensor includes a substrate; a movable seismic mass in a micromechanical functional layer; a torsion spring connected to the movable seismic mass and about which the seismic mass able to rotate; an electrode layer below the seismic mass and that, in an outer region is connectible to a potential of the substrate and is connected to the seismic mass via an insulating layer; and electrodes at a distance above and below an inner region of the electrode surface.

An actuator includes a diaphragm, a lower electrode on the diaphragm, an electromechanical transducer film on the lower electrode, and an upper electrode on the electromechanical transducer film. The diaphragm includes a first silicon oxide film having a thickness of 0.5 m or more, a silicon layer on the first silicon oxide film, a thickness of which is 3 m or more, and a second silicon oxide film on the silicon layer, a thickness of which is 0.5 m or more. A volume resistivity of the silicon layer is 10.sup.3 .Math.cm or more and 10.sup.6 .Math.cm or less.

A MEMS loudspeaker for generating sound waves in the audible wavelength spectrum includes a carrier substrate with a substrate cavity with two substrate openings formed on two opposite sides of the carrier substrate, and a diaphragm anchored in the substrate. An actuator structure is arranged in the region of one of the two substrate openings and configured to vibrate the diaphragm to generate sound waves. An intermediate cavity is formed in a space between the diaphragm and the actuator structure. A coupling element is disposed in the intermediate cavity and connects the actuator structure to the diaphragm and can vibrate with respect to the carrier substrate.

The MEMS actuator is formed by a body, which surrounds a cavity and by a deformable structure, which is suspended on the cavity and is formed by a movable portion and by a plurality of deformable elements. The deformable elements are arranged consecutively to each other, connect the movable portion to the body and are each subject to a deformation. The MEMS actuator further comprises at least one plurality of actuation structures, which are supported by the deformable elements and are configured to cause a translation of the movable portion greater than the deformation of each deformable element. The actuation structures each have a respective first piezoelectric region.

A MEMS sensor, in particular a microphone, of a piezoelectric type, formed in a membrane of semiconductor material accommodating a compliant portion, which extends from a first surface to a second surface of the membrane. The compliant portion has a Young's modulus lower than the rest of the membrane. A sensitive region having piezoelectric material extends on the first surface, over the compliant portion and is fixed at its ends to the membrane on opposite sides of the compliant portion. A third area of the membrane, arranged between the compliant portion and the second surface, forms a hinge element.

A microphone includes: a substrate configured to have a through hole formed at a central portion thereof; a vibration membrane disposed to cover the through hole on the substrate to include a slit pattern in which slit patterns are arranged in a plurality of lines along a circular edge thereof; a fixed membrane separately mounted at an upper portion of the vibration membrane with an air layer therebetween to have a plurality of air inlets that extend therebetween in a direction of the air layer; and a support layer configured to support the fixed membrane separately mounted on the vibration membrane.

In methods and apparatus for increasing efficiency and optical bandwidth of a microelectromechanical system piston-mode spatial light modulator, an example apparatus includes: an electrode with spring legs; a base electrode; a mirror displacement determiner to determine a periodic signal corresponding to a displacement distance of the electrode beyond an instability point of the electrode; and a voltage source to output a periodic voltage to the base electrode in response to the periodic signal. The periodic voltage causes the spring legs to vary displacement of the electrode with respect to the base electrode according to the periodic voltage. The displacement includes distances beyond the instability point.