B81B3/0051

3-AXIS ANGULAR ACCELEROMETER
20220155336 · 2022-05-19 · ·

Angular accelerometers are described, as are systems employing such accelerometers. The angular accelerometers may include a proof mass and rotational acceleration detection beams directed toward the center of the proof mass. The angular accelerometers may include sensing capabilities for angular acceleration about three orthogonal axes. The sensing regions for angular acceleration about one of the three axes may be positioned radially closer to the center of the proof mass than the sensing regions for angular acceleration about the other two axes. The proof mass may be connected to the substrate though one or more anchors.

MICROELECTROMECHANICAL INFRARED SENSING DEVICE
20220196479 · 2022-06-23 ·

A microelectromechanical infrared sensing device is provided, which includes a substrate, a sensing plate, a reflecting plate, a plurality of first supporting elements, a plurality of second supporting elements and a plurality of stoppers. The second supporting elements are connected to the sensing plate, such that the sensing plate is suspended above the substrate. The reflecting plate is disposed between the substrate and the sensing plate. The first supporting elements are connected to the reflecting plate, such that the reflecting plate is suspended between the substrate and the reflecting plate. When the reflecting plate moves toward the substrate and at least one of the stoppers contacts the substrate or the reflecting plate, the distance between the reflecting plate and the sensing plate increases.

MICROMECHANICAL STRUCTURE AND MICROMECHANICAL SENSOR

A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.

Microelectromechanical or/and nanoelectromechanical device with out-of-plane displacement having capacitive elements having a variable surface

Microelectromechanical sensor comprising a fixed part and a mobile part suspended from the fixed part such that the mobile part can move at least in an out-of-plane displacement direction, the fixed part comprising at least first electrodes extending parallel to the displacement direction of the mobile part, the mobile part comprising a seismic mass and at least second electrodes extending parallel to the out-of-plane displacement direction, the first electrodes and the second electrodes being located relative to each other so as to be interdigitated, in which the second electrodes are directly connected to the inertial mass and only part of the face of each mobile electrode is facing an electrode fixed at rest.

MICROMECHANICAL DEVICE INCLUDING A STOP SPRING STRUCTURE
20210323809 · 2021-10-21 ·

A micromechanical device including a substrate, a movable mass, and a stop spring structure, which includes a stop. The substrate includes a substrate surface in parallel to a main extension plane and the movable mass is situated movably above the substrate surface in relation to the substrate. The stop spring structure is connected to the movable mass. The stop is designed to strike against the substrate surface in the event of a deflection of the movable mass in a z direction, perpendicular to the main extension plane. The stop spring structure, at the location of the stop, includes a first spring constant, a second spring constant, in parallel to the main extension plane, and a third spring constant, in parallel to the main extension plane and perpendicular to the x direction. The first spring constant is greater than the second spring constant and/or is greater than the third spring constant.

Inertial Sensor, Electronic Apparatus, and Vehicle
20210325425 · 2021-10-21 ·

The inertial sensor includes a substrate, stationary electrodes provided to the substrate, an element section including a movable body which is displaceable with respect to the stationary electrodes, and which has electrodes in a first portion and a second portion opposed to the stationary electrodes, a protrusion which limits a displacement of the movable body, and which has a detection electrode in a portion opposed to the first portion of the movable body, a drive circuit for outputting a drive signal to the element section, a contact detection circuit for outputting a detection signal due to a contact between the electrode in the first portion of the movable body and the detection electrode of the protrusion, a self-diagnostic circuit for outputting a test signal to the element section when receiving the detection signal from the contact detection circuit, and a determination circuit for determining whether or not a level of a signal output by the element section in response to the test signal is out of a threshold value.

MEMS device, inertial measurement unit, vehicle positioning device, portable electronic apparatus, electronic apparatus, and vehicle
11137254 · 2021-10-05 · ·

A MEMS device includes: a base (substrate) having a support part and a fixed electrode (detection electrode); a movable member supported on the support part with a main surface facing the fixed electrode; and a lid joined to the base and forming an accommodation space in which the movable member is accommodated. The lid has an abutting part which faces, via a space, at least a part of an outer edge of the movable member accommodated in the accommodation space and regulates displacement in an in-plane direction of the main surface.

MICROMECHANICAL STRUCTURE AND METHOD OF PROVIDING THE SAME
20210387851 · 2021-12-16 ·

A micromechanical structure has a first micromechanical element, a second micromechanical element and a torsion spring arrangement having a first torsion spring element, having a first center line, mechanically connected to the first micromechanical element at a first contact region and to the second micromechanical element at a second contact region, and having a second torsion spring element, having a second center line, mechanically connected to the first micromechanical member at a third contact region and to the second micromechanical member at a fourth contact region in order to connect the first micromechanical member and the second micromechanical member to be movable relative to each other. A distance between the first and second center lines, starting from the first and third contact regions toward the second and fourth contact regions, decreases in a first portion and increases in a second portion. In a rest position of the micromechanical structure, the first and second torsion spring elements are arranged without contact to each other.

Actuator plate partitioning and control devices and methods

Devices and methods of operating partitioned actuator plates to obtain a desirable shape of a movable component of a micro-electro-mechanical system (MEMS) device. The subject matter described herein can in some embodiments include a micro-electro-mechanical system (MEMS) device including a plurality of actuation electrodes attached to a first surface, where each of the one or more actuation electrode being independently controllable, and a movable component spaced apart from the first surface and movable with respect to the first surface. Where the movable component further includes one or more movable actuation electrodes spaced apart from the plurality of fixed actuation electrodes.

MEMS actuator structures resistant to shock

Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.