Patent classifications
B81B3/0054
Integrated electroacoustic MEMS transducer with improved sensitivity and manufacturing process thereof
An electroacoustic MEMS transducer, having a substrate of semiconductor material; a through cavity in the substrate; a back plate carried by the substrate through a plate anchoring structure, the back plate having a surface facing the through cavity; a fixed electrode, extending over the surface of the back plate; a membrane of conductive material, having a central portion facing the fixed electrode and a peripheral portion fixed to the surface of the back plate through a membrane anchoring structure; and a chamber between the membrane and the back plate, peripherally delimited by the membrane anchoring structure.
ROTATIONAL SPEED SENSOR WITH MINIMIZED INTERFERENCE MOVEMENTS IN THE DRIVING MODE
A rotation rate sensor having a first structure movable with respect to the substrate, a second structure movable with respect to the substrate and with respect to the first structure, a first drive structure for deflecting the first structure with a motion component parallel to a first axis, and a second drive structure for deflecting the second structure with a motion component parallel to the first axis. The first and second structures are excitable to oscillate in counter-phase, with motion components parallel to the first axis, the first drive structure having a first spring mounted on the substrate to counteract a pivoting of the first structure around an axis parallel to a second axis extending perpendicularly to a principal extension plane, the second drive structure having a second spring mounted on the substrate to counteracts a pivoting of the second structure around a further axis parallel to the second axis.
Micromirror device and projection device
A micromirror device including a drive unit, which includes a movable drive element, which is situated in a first plane, and a guiding device, and a mirror, which is elastically coupled to the drive element and is situated in the idle position in a second plane, which is in parallel to the first plane, the guiding device being designed to guide a movement of the drive element on a straight line situated in the first plane. Furthermore, a corresponding projection device is described.
INTEGRATED ELECTROACOUSTIC MEMS TRANSDUCER WITH IMPROVED SENSITIVITY AND MANUFACTURING PROCESS THEREOF
An electroacoustic MEMS transducer, having a substrate of semiconductor material; a through cavity in the substrate; a back plate carried by the substrate through a plate anchoring structure, the back plate having a surface facing the through cavity; a fixed electrode, extending over the surface of the back plate; a membrane of conductive material, having a central portion facing the fixed electrode and a peripheral portion fixed to the surface of the back plate through a membrane anchoring structure; and a chamber between the membrane and the back plate, peripherally delimited by the membrane anchoring structure.
MICROELECTROMECHANICAL SYSTEM WITH SPRING FOR MAGNET PLACEMENT
Apparatuses, systems, and methods associated with placement of magnets within a microelectromechanical system device are disclosed herein. In embodiments, a method of affixing at least one magnet in a microelectromechanical system, may include affixing an electromagnetic actuator to a base structure of the microelectromechanical system, the affixing including affixing the electromagnetic actuator within a recess formed in the base structure. The method may further include placing a magnet within the recess, wherein the recess includes at least a portion of a spring, the spring affixed to the base structure and extending into the recess, the placing including placing the magnet on a side of the electromagnetic actuator, between the spring and the side of the electromagnetic actuator, the spring pressing the magnet against the side of the electromagnetic actuator and maintaining a position of the magnet in response to the placing the magnet within the recess.
Microelectronic component arrangement and production method for a microelectronic component arrangement
A microelectronic component arrangement includes a sensor and a carrier. The sensor has a detection surface and a region including contact elements situated at a first distance with respect to one another. The carrier includes a mounting surface, and the sensor is fixed on the carrier by the contact elements situated at a first distance with respect to one another at least regionally. The detection surface is opposite the mounting surface in a manner having a second distance with respect to the mounting surface. The contact elements are wetted by a mechanically stabilizing material, the region including the contact elements is enclosed by the mechanically stabilizing material, and the detection surface is free of the mechanically stabilizing material.
CHECK-VALVE AND MICROCHEMICAL CHIP USING THE SAME
A check-valve comprises: a thin sheet and a thick sheet; flow paths for flowing fluid which are formed by penetrating the thin sheet and the thick sheet; a flow-in chamber and a flow-out chamber which are connected to the flow paths; a partition sheet which is bonded to the thin sheet and the thick sheet while being sandwiched therebetween, and has a flexible inner flange which projects in cavities of the flow-in chamber and the flow-out chamber and does not close the flow-out valve chamber by flexing toward the flow-out valve chamber in a normal flow, and closes the flow-in valve chamber by flexing toward the flow-in valve chamber in a reverse flow; and a through-pass hole which is opened at the partition sheet and connects the both valve chambers.
Support pillar
A support pillar is formed under a movable film for support. The support pillar includes a plurality of first metal micropillars, a base metal connection pillar layer and a first oxide encapsulation layer. The first metal micropillars are formed under the movable film and conductively connected to the movable film via metal connection. The base metal connection pillar layer is formed under the first metal micropillars and conductively connected to the first metal micropillars. The first oxide encapsulation layer fully or partially encapsulates the first metal micropillars to insulate the first metal micropillars from air, and shape the support pillar into a column shape.
ACCELERATION SENSOR HAVING SPRING FORCE COMPENSATION
The invention relates to an acceleration sensor (100) having a sensor material (120) which is mounted by means of spring elements (130) so as to be movable along a movement axis (x) over a substrate (110), first trim electrodes (140) which are connected to the sensor material (120), and second trim electrodes (150) which are connected to the substrate (110) and are associated with the first trim electrodes (140). When the sensor material is deflected along the movement axis, a spring force acting on the sensor material (120) is generated by the spring elements (130), and when the sensor material (120) is deflected, au electrostatic three acting on the sensor material (120), which counteracts the spring force, is generated by application of an electrical trim voltage between the first trim electrodes (140) and the second trim elements (150).
Sound producing cell
A sound producing cell includes a membrane and an actuating layer. The membrane includes a first membrane subpart and a second membrane subpart, wherein the first membrane subpart and the second membrane subpart are opposite to each other. The actuating layer is disposed on the first membrane subpart and the second membrane subpart. The first membrane subpart includes a first anchored edge which is fully or partially anchored, and edges of the first membrane subpart other than the first anchored edge are non-anchored. The second membrane subpart includes a second anchored edge which is fully or partially anchored, and edges of the second membrane subpart other than the second anchored edge are non-anchored.