A micro-electro-mechanical systems (MEMS) die includes a piston; an electrode facing the piston, wherein a capacitance between the piston and the electrode changes as the distance between the piston and the electrode changes; and a resilient structure (e.g., a gasket or a pleated wall) disposed between the piston and the electrode, wherein the resilient structure supports the piston and resists the movement of the piston with respect to the electrode. A back volume is bounded by the piston and the resilient structure and the resilient structure blocks air from leaving the back volume. The piston may be a rigid body made of a conductive material, such as metal or a doped semiconductor. The MEMS die may also include a second resilient structure, which provides further support to the piston and is disposed within the back volume.

A MEMS sensor includes at least one anchor that extends into a MEMS layer and a proof mass suspended from the at least one anchor. Each anchor is coupled to the proof mass via two compliant springs that are oriented perpendicular to each other and attached to a respective anchor. The compliant springs absorb non-measured external forces such as shear forces that are applied to the sensor packaging, preventing these forces from modifying the relative location and operation of the proof mass.

A system and method for precisely positioning a moveable structure in a micro-electromechanical system (MEMS). The system includes a substrate and a moveable device structure supported on the substrate. The device structure is moveable from an initial position to a deployment position at a predetermined offset angle to the substrate. A moveable anchor structure is supported on the substrate in proximity to the device structure. The anchor structure is locked to the device structure when the device structure is moved to the deployment position.