A MEMS vibration sensor die can include a substrate having a top portion, a mounting surface, and an aperture extending at least partially through the substrate. The die can include a first electrode coupled to the top portion of the substrate and positioned over the aperture. The die can include a second electrode disposed between the substrate and the first electrode. The second electrode can be spaced apart from the first electrode. The die can include a proof mass that can have a first portion coupled to the first electrode or the second electrode. The proof mass can have a second end opposite the first portion. The second end can be recessed within the aperture relative to the mounting surface of the substrate. The proof mass can be suspended freely within the aperture. The proof mass can move the first electrode or the second electrode from which it is suspended in response to vibration.

A capacitive accelerometer comprises: a substantially planar proof mass mounted to a fixed substrate by flexible support legs so as to be linearly moveable in an in-plane sensing direction. The proof mass comprises first and second sets of moveable capacitive electrode fingers. First and second sets of fixed capacitive electrode fingers interdigitates with the first and second sets of moveable electrode fingers respectively. A set of moveable damping fingers extend from the proof mass substantially perpendicular to the sensing direction, laterally spaced in the sensing direction. A set of fixed damping fingers mounted to the fixed substrate interdigitates with the set of moveable damping fingers and comprises an electrical connection to the proof mass so that the interdigitated damping fingers are electrically common. The damping fingers are mounted in a gaseous medium that provides a damping effect.

A MEMS sensor includes a substrate and a MEMS layer. A plurality of anchoring points within the MEMS layer suspend a suspended spring-mass system that includes active micromechanical components that respond to a force of interest such as linear acceleration, angular velocity, pressure, or magnetic field. Springs and rigid masses couple the active components to the anchoring points, such that displacements of the anchoring points do not substantially cause the active components within the MEMS layer to move out-of-plane.

A micromechanical sensor includes a substrate having a cavity; a flexible diaphragm that spans the cavity; and a lever element that spans the diaphragm and has a first and a second end section, the end sections lying on opposite sides of a center section. A first joint element is fitted between the first end section and the substrate and a second joint element is fitted between the center section and the diaphragm, so that the lever element is able to be pivoted due to a deflection of the diaphragm. In addition, two capacitive sensors are provided, each having two electrodes, one electrode of each sensor being mounted at one of the end sections of the lever element, and the other being mounted on the substrate. The electrodes of the sensors are disposed in such a way that distances between the electrodes of different sensors are influenced oppositely when the lever element is pivoted. Moreover, the sensor includes an actuator for applying an actuating force between the lever element and the substrate.

A MEMS device includes a package for providing an inner volume, a MEMS microphone arranged in the inner volume, a sound port through the package to the inner volume, and a passive acoustic attenuation filter acoustically coupled to the sound port.

A micromechanical component for a capacitive sensor or switch device, having a substrate having a substrate surface, a diaphragm mounted on the substrate surface having a self-supporting region, at least one lever element and at least one first electrode connected to the at least one lever element. The at least one lever element is connected to the diaphragm in such a way that when there is a warping of the self-supporting region of the diaphragm the at least one lever element is set into a rotational movement, whereby the at least one connected first electrode is set into a first adjustment movement oriented at an angle to the substrate surface. The at least one lever element and the at least one first electrode connected to the at least one lever element are situated between the substrate surface and the diaphragm inner side of the self-supporting region of the diaphragm.

Sensors, systems, and methods for monitoring environmental conditions, such as physical, electromagnetic, thermal, and/or chemical parameters within an environment, over extended periods of time with the use of one or more electromechanical sensing devices and electronic circuitry for processing an output of the sensing devices. The sensing devices each include a cantilevered structure and at least one contact configured for contact-mode operation with the cantilevered structure in response to the cantilevered structure deflecting toward or away from the contact when exposed to the parameter of interest. The cantilevered structure has at least first and second beams of dissimilar materials, at least one of which has at least one property that changes as a result of exposure to the parameter.

Capped microelectromechanical systems (MEMS) devices are described. In at least some situations, the MEMS device includes one or more masses which move. The cap may include a stopper which damps motion of the one or more movable masses. In at least some situations, the stopper damps motion of one of the masses but not another mass.

A gyro sensor includes a plurality of beams connected via a turnaround part. A groove is provided on a main surface of at least one beam of the plurality of beams. Wall thicknesses on the main surface of two sidewalls facing each other of the groove in a direction orthogonal to a longitudinal direction of the beam satisfy 0.9T1/T21.1, where T1 is the wall thickness of one sidewall and T2 is the wall thickness of the other sidewall.

The present invention relates to the fields of physics, material sciences and micro and nano electronics, and concerns a method for producing a rolled-up electrical or electronic component, as can be used for example as a capacitor, or in aerials. The object of the present invention is to provide a low-cost, environmentally friendly and time-saving method for producing a rolled-up electrical or electronic component with many windings. The object is achieved by a method for producing a rolled-up component in which at least two functional and insulating layers, alternately arranged fully or partially over one another, are applied to a substrate with a sacrificial layer, wherein at least the functional or insulating layer that is arranged directly on the sacrificial layer has a perforation, at least on the two sides that are arranged substantially parallel to the rolling direction.