The technology relates to cosharding tables within a distributed storage system. A data table including one or more rows may be received. Each row in the data table may include an identifier key and pieces of data. Each piece of data in the data table may be indexed into individual rows of an index table, wherein each row in the index table includes data associated with the identifier key of the data table from which the piece of data in the respective row was indexed. The index table may be sharded into splits, wherein the sharding includes assigning each row of the index table into one of the splits based on the identifier key of the data table from which the piece of data in the respective row was indexed. The splits may be stored into two or more portions of the distributed storage system.

This application discloses a MEMS chip structure, including a substrate, a side wall, a dielectric plate, a MEMS micromirror array, and a grid array, where the MEMS micromirror array includes a plurality of grooves and a plurality of MEMS micromirrors. The plurality of MEMS micromirrors are in a one-to-one correspondence with the plurality of grooves. The grid array is located above the MEMS micromirror array, and a lower surface of the grid array is connected to upper surfaces of side walls of at least some of the plurality of grooves.

In one example, a method comprises forming a first layer on a substrate surface, forming an opening in the first layer, forming a second layer on the first layer and in the opening, and forming a photoresist layer on the second layer, in which the photoresist layer has a first curved surface over a first part of the first layer and over the opening. The method further comprises etching the photoresist layer and a second part of the second layer over the first part of the first layer to form a second curved surface on the second part of the second layer, and forming a mirror element and a support structure in the second layer, including by etching a third part of the second layer and removing the first layer.

A system includes an optical reflector to reflect the light, the optical reflector having a rotor, a first stator, and a second stator. The system further includes a controller in communication with the optical reflector. The controller is to drive the optical reflector by applying a first actuation voltage to the first stator, and a second actuation voltage to the second stator. Further, the controller is to apply an excitation voltage to the first stator. Furthermore, the controller is to determine a relationship between a first capacitance between the rotor and the first stator, and a second capacitance between the rotor and the second stator. Based on the relationship, the controller is to determine a position attribute of the optical reflector.

A MEMS element includes a substrate, a fixing portion provided at the substrate, first and second actuators provided at the fixing portion, a drive target member coupled to the first and second actuators, a third actuator provided at the fixing portion, and a restriction member coupled to the third actuator. The first and second actuators drive the drive target member in a direction parallel to or crossing an upper surface of the substrate. The third actuator drives the restriction member in a direction crossing a movement direction of the drive target member to position the restriction member within a movement plane of the drive target member such that the restriction member restricts displacement of the drive target member.

A tunable wavelength filtering device is presented in which the tuning mechanism is based on altering the incident angle to an optical thin film coating stack, or thin film optical filter. Rotating mirrors, such as Micro-Electro-Mechanical Systems (MEMS) tilt-mirrors, are used to alter the incident angle of the optical beam coming from an input fiber, and also to aim or align the exiting beam to an output optical fiber. The optical thin film coating stack can be implemented onto a glass substrate, to form a thin film filter chip. The thin film filter chip can be fixed in place, and the incident angle and exiting angle of the optical beam is varied by adjusting the tilt angle of the two rotating mirrors.

A laser marking system including a spatial light modulator (SLM) with a multi-pixel, linear array of is microelectromechanical systems (MEMS) based diffractors, and methods of operating the same are disclosed. Generally, the system includes, in addition to the SLM, a laser operable to illuminate the SLM; imaging optics operable to focus a substantially linear swath of modulated light onto a surface of a workpiece, the linear swath including light from multiple pixels of the SLM, and a controller operable to control the SLM, laser and imaging optics to mark the surface of the workpiece to record a two-dimensional image thereon. In one embodiment, the diffractors include a number of electrostatically deflectable ribbons suspended over a substrate. In another, each diffractor is two-dimensional including an electrostatically deflectable first reflective operable to brought into optical interference with light reflected from a second reflective surface on a faceplate, or an adjacent diffractor.

Described examples include an apparatus having a substrate with a substrate surface. The apparatus also includes an element with a planar surface facing the substrate surface and with a nonplanar surface opposite the planar surface facing away from the substrate surface.

A micro-electro-mechanical system (MEMS) device may include a mirror structure suspended from a first hinge and a second hinge that are arranged to enable the mirror structure to be tilted about a tilt axis. The mirror structure may include a first actuator and a second actuator located on opposite sides of the tilt axis. The MEMS device may include a fixed electrode coupled to first actuator to cause the mirror structure to tilt about the tilt axis in a first direction based on a fixed voltage applied to the fixed electrode. The MEMS device includes a driving electrode coupled to the second actuator to cause the mirror structure to tilt about the tilt axis in a second direction opposite from the first direction based on a driving voltage applied to the driving electrode.

A die-wrapped packaged device includes at least one flexible substrate having a top side and a bottom side that has lead terminals, where the top side has outer positioned die bonding features coupled by traces to through-vias that couple through a thickness of the flexible substrate to the lead terminals. At least one die includes a substrate having a back side and a topside semiconductor surface including circuitry thereon having nodes coupled to bond pads. One of the sides of the die is mounted on the top side of the flexible circuit, and the flexible substrate has a sufficient length relative to the die so that the flexible substrate wraps to extend over at least two sidewalls of the die onto the top side of the flexible substrate so that the die bonding features contact the bond pads.