Patent classifications
B81B3/0086
BENDING TRANSDUCER AS ACTUATOR, BENDING TRANSDUCER AS SENSOR, BENDING TRANSDUCER SYSTEM
A bending transducer includes a deflectable element, a microelectromechanical transducer extending along a centroid fiber of the deflectable element deflecting the deflectable element in a first direction when a first electrical signal is applied, and a second microelectromechanical transducer extending along the centroid fiber deflecting the deflectable element in a second direction opposite to the first direction when a second electrical signal is applied, the centroid fiber being located between sides of the first and second microelectromechanical transducers facing away from each other, and an electrical control configured to vary the first and second electrical signals depending on an input signal such that a change of the first electrical signal and a change of the second electrical signal depends on the electrical input signal, and the phases of the first and second electrical signals are shifted relative to each other. A bending transducer operated as sensor is also presented.
Vibration-Driven Energy Harvesting Element and Vibration-Driven Energy Harvesting Device
A vibration-driven energy harvesting element that outputs an alternating current power from an output line, due to vibration from outside includes: an intermediate electrode that is not connected to the output line; a plurality of electret electrodes, each electret electrode being arranged to face the intermediate electrode and having an electret on at least a part of a surface of the electret electrode on a side facing the intermediate electrode; a holding unit that holds the intermediate electrode and the plurality of electret electrodes such that the intermediate electrode and the plurality of electret electrodes can vibrate with respect to each other; and a charge injector that injects a charge having characteristics opposite to a charge of the electrets formed in the surfaces of the plurality of electret electrodes, to the intermediate electrode.
ELECTRODE ARRANGEMENT FOR A MICRO-ELECTRO-MECHANICAL SYSTEM, MICRO-ELECTRO-MECHANICAL SYSTEM, AND METHOD FOR OPERATING A MICRO-ELECTRO-MECHANICAL SYSTEM
An electrode configuration for a microelectromechanical system, including a first electrode structure and a second electrode structure. The first electrode structure has a receptacle, and the second electrode structure has a finger. The first and second electrode structure are designed for a relative movement in relation to one another along a movement axis. A first width of the receptacle, perpendicular to the movement axis, tapers along the movement axis at least in a first region, and/or a second width of the finger, perpendicular to the movement axis, tapers along the movement axis at least in a second region.
Broad range micro pressure sensor
Disclosed is a micro pressure sensor including a plurality of modules that are operative over different ranges of pressure. The modules include a stack of at least two module layers, each module layer including a module body having walls that define a compartment and with the defined compartment partitioned into at least two sub-compartments, a port for fluid ingress or egress disposed in a first wall of the body, with remaining walls of the body being solid walls, a membrane affixed to a first surface of the module body covering the compartment, and an electrode affixed over a surface of the membrane.
MEMS Microphone
A MEMS microphone includes a base comprising a back cavity and a capacitive system provided on the base. The capacitive system includes a diaphragm and a back plate spaced from the diaphragm for forming a cavity with the diaphragm. The back plate is provided with an electrode layer. An isolation groove is provided on the back plate for separating the electrode layer into an induction electrode and a floating motor. In the invention the induction electrode is separated from the floating electrode by the isolation groove to avoid the influence of the parasitic capacitance generated by the floating electrode on the MEMS microphone when the MEMS microphone is powered and working.
Electromechanical Power Switch Integrated Circuits And Devices And Methods Thereof
An electromechanical power switch device and methods thereof. At least some of the illustrative embodiments are devices including a semiconductor substrate, at least one integrated circuit device on a front surface of the semiconductor substrate, an insulating layer on the at least one integrated circuit device, and an electromechanical power switch on the insulating layer. By way of example, the electromechanical power switch may include a source and a drain, a body region disposed between the source and the drain, and a gate including a switching metal layer. In some embodiments, the body region includes a first body portion and a second body portion spaced a distance from the first body portion and defining a body discontinuity therebetween. Additionally, in various examples, the switching metal layer may be disposed over the body discontinuity.
CAPACITIVE MICROPHONE SENSOR DESIGN AND FABRICATION METHOD FOR ACHIEVING HIGHER SIGNAL TO NOISE RATIO
A capacitive transducer or microphone includes a first substrate of one or more layers and which includes a first surface, a first cavity in the first surface, and a mesa diaphragm that spans the first cavity. The capacitive transducer or microphone includes a second substrate fixed to the first substrate. The second substrate has one or more layers which includes a second cavity having a nonplanar (e.g., contoured or structured or stepped) bottom surface that faces the mesa diaphragm. A shape or relief of the bottom surface of the cavity may advantageously be, to at least some degree, complementary to a deformed shape of the diaphragm. The second substrate may include one or more acoustic holes, non-uniformly distributed thereacross. One or more vents may vent the second cavity.
Reducing parasitic capacities in a microelectronic device
A microelectronic device including a substrate including, in a stack, a base portion, a dielectric portion and an upper layer with a semi-conductive material base, at least one electrical connection element made of an electrically conductive material located above the upper layer and electrically insulated from the upper layer at least by a dielectric layer, the dielectric layer being in contact with the surface of the upper layer, at least one dielectric element including at least one trench forming a closed edge at the periphery or upright of at least one portion of the dielectric electrical connection element, located at least partially in the upper layer and delimiting a closed zone of said upper layer, at least one dielectric element having a portion exposed to the surface of the upper layer, device wherein the dielectric layer totally covers the exposed portion of at least one dielectric element.
MEMS DEVICE
A MEMS device includes a piezoelectric layer made of a piezoelectric single crystal, a first electrode on a first surface of the piezoelectric layer, and a first layer covering the first surface of the piezoelectric layer. At least a portion of the piezoelectric layer is included in a membrane portion. The first electrode is covered with the first layer and includes a recess. The piezoelectric layer includes a through hole that passes through the piezoelectric layer between a surface of the piezoelectric layer, which is opposite to the first direction, and the recess at a position corresponding to at least a portion of the first electrode.
MEMS transducer system for pressure and acoustic sensing
A MEMS transducer system includes a MEMS transducer device for sensing at least one of pressure signal or acoustic signal. The MEMS transducer device includes first and second diaphragms. Formed between the diaphragms are a spacer, plate capacitor elements, and electrode elements. The plate capacitor elements are coupled to the diaphragms via the spacer. An optional member may be disposed within the spacer. The distal ends of the electrode elements are coupled to a structure such as insulator element. An optional oxides may be formed within the plate capacitor elements. Pressure sensing electrode formed between the diaphragms may be coupled to the insulator element.