An adhesive device comprising a microstructure and polymer designed to interdigitate with the surface structure of a target surface. The device may include a microstructure material having an elastomeric, crosslinked polymer which may swell in the presence of a liquid. In the pre-swell state, the device microstructure may interdigitate with a target surface microstructure. When liquid on the target surface contacts the microstructure surface of the device, the liquid may cause the microstructure surface of the device to swell. The swelling may cause the microstructure to grasp the target surface resulting in adhesion between the device and the target surfaces.

The present disclosure provides a microfluidic chip, and belongs to the field of biological detection technology. The microfluidic chip is divided into a middle region and a peripheral region surrounding the middle region; the middle region includes a liquid storage region and a detection region; the microfluidic chip includes a first substrate and a second substrate opposite to each other; the first substrate includes a first base plate and a first electrode layer; the second substrate includes a second base plate and a second electrode layer; wherein a liquid storage tank and a liquid inlet are on a side of the first base plate proximal to the second substrate, the liquid inlet penetrates through a bottom of the liquid storage tank; the liquid storage tank and the liquid inlet are both in the liquid storage region.

A modification to rough polysilicon using ion implantation and silicide is provided herein. A method can comprise depositing a hard mask on a single crystal silicon, patterning the hard mask, and depositing metal on the single crystal silicon. The method also can comprise forming silicide based on causing the metal to react with exposed silicon of the single crystal silicon. Further, the method can comprise removing unreacted metal and stripping the hard mask from the single crystal silicon. Another method comprises forming a MEMS layer, wherein the forming comprises fusion bonding a handle layer with a device layer. The method also can comprise implanting rough polysilicon on the device layer. Implanting the rough polysilicon can comprise performing ion implantation of the rough polysilicon. Further, the method can comprise performing high temperature annealing. The high temperature can comprise a temperature in a range between around 700 and 1100 degrees Celsius.

A vibration-driven energy harvesting element is formed by processing a substrate having a first Si layer and a second Si layer with an insulating layer in between. The vibration-driven energy harvesting element includes: a fixed electrode formed in the first Si layer; and a movable electrode formed in the second Si layer, opposed to the fixed electrode with a gap space formed in the insulating layer in between, and movable relative to the fixed electrode.

A fluidic device includes a fluidic layer, a capture material, and an electronics layer, the fluidic layer includes a main channel and a pair of sample channels fluidly coupled to the main channel. The pair of sample channels is configured to receive and introduce a sample material into the device. The sample material includes an analyte. The capture material is positioned in a portion of the main channel that is spaced from the pair of sample channels. The capture material has a three-dimensional matrix of receptors therein configured to bond with the analyte. The capture material has a length that is associated with a dynamic range of the fluidic device and a cross-sectional area that is associated with a sensitivity of the fluidic device. The electronics layer includes electrodes configured to measure an electrical resistance through a portion of the capture material.

A MEMS transducer system includes a MEMS transducer device for sensing at least one of pressure signal or acoustic signal. The MEMS transducer device includes first and second diaphragms. Formed between the diaphragms are a spacer, plate capacitor elements, and electrode elements. The plate capacitor elements are coupled to the diaphragms via the spacer. An optional member may be disposed within the spacer. The distal ends of the electrode elements are coupled to a structure such as insulator element. An optional oxides may be formed within the plate capacitor elements. Pressure sensing electrode formed between the diaphragms may be coupled to the insulator element.

Microelectromechanical system are disclosed that include at least one electrode, microelectrode or combination thereof, wherein the at least one electrode comprises a carbon material, a glassy carbon material or a combination thereof. Contemplated systems are suitable for μ-ECoG arrays. Additional microelectromechanical systems are disclosed that include at least one electrode, microelectrode or combination thereof, wherein the at least one electrode comprises a carbon material, a glassy carbon material or a combination thereof; at least one substrate, surface, layer or a combination thereof, wherein the at least one electrode, microelectrode or combination thereof is disposed on, coupled with or otherwise layered on the at least one substrate, surface, layer or a combination thereof; and at least one bump pad, wherein the at least one electrode, microelectrode or combination thereof is coupled with the at least one bump pad via at least one conductive metal. A method of making a microelectromechanical system includes patterning a polymer precursor, a carbon-containing material or a combination thereof onto a surface, a substrate, at least one layer or a combination thereof; and heating or pyrolysing the polymer precursor, a carbon-containing material or a combination thereof in order to form a glassy carbon material. Uses of microelectromechanical systems are also contemplated to measure at least one electrical property in a mammal or for electrocorticography.

A method of manufacturing a composite material, comprising providing a conductive polymer having a hydrophilic end and adding a metal oxide, such that the metal oxide is connected to the hydrophilic end of the conductive polymer, wherein the metal oxide is obtained by subjecting a metal oxide precursor to a dehydration reaction, a polymerization reaction, a condensation reaction, or a combination thereof.

Gas sensor, comprising: a substrate of semiconductor material; a first working electrode on the substrate; a second working electrode on the substrate, at a distance from the first working electrode; an interconnection layer extending in electrical contact with the first and the second working electrode, configured to change its conductivity when reacting with gas species to be detected. The interconnection layer is of titanium oxide, has a porosity between 40% and 60% in volume and is formed by a plurality of meso-pores having at least one dimension in the range 6-30 nm connected to nano-pores having at least one respective dimension in the range 1-5 nm.

A sensor, a composite material and a method of manufacturing the same are provided. The sensor includes a first electrode, a second electrode, and a sensing material layer. The first electrode and the second electrode are separated from each other. The sensing material layer is located between the first electrode and the second electrode and covers the first electrode and the second electrode. The sensing material layer includes the composite material including a conductive polymer and a metal oxide. The conductive polymer has a hydrophilic end. The metal oxide is connected to the hydrophilic end of the conductive polymer. The metal oxide includes a metal oxide precursor.