Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.

Caging structures are disclosed for caging or otherwise reducing the mechanical shock pulse experienced by MEMS device beam structures during events that may cause mechanical shock to the MEMS device. The caging structures at least partially surround the beam such that they limit the motion of the beam in a direction perpendicular to the beam's longitudinal axis, thereby reducing stress on the beam during a mechanical shock event. The caging structures may be used in combination with mechanical shock-resistant beams.

A MEMS device includes: a substrate as a base including a support portion and a detection electrode as a fixed electrode; a movable body supported to the support portion with a major surface of the movable body facing the fixed electrode; and an abutment portion facing at least a portion of an outer edge of the movable body and restricting rotational displacement in an in-plane direction of the major surface. The abutment portion includes an abutment surface including an abutment position at which the movable body abuts against the abutment portion due to the rotational displacement of the movable body, and a hollow portion provided opposing the abutment surface.

A physical quantity sensor includes: a movable body that includes a beam, a coupling portion that is connected with the beam and is provided in a direction intersecting with the beam, and a first and second mass portions that are connected with the coupling portion at connection positions; a first and second fixed electrodes are opposed to the first and second mass portions; and a protrusion are provided and protrude toward the first and second mass portions. In the intersecting direction, in a case where a distance from connection positions to end portions of the first and second mass portions opposite to the beam is L, and a distance from the protrusions to end portions of the first and second mass portions opposite to the beam is L1, the distance L1 is 0.5 L or longer and 3.1 L or shorter.

A sensor for sensing a physical transmitter field dependent on a physical quantity to be measured, including: a sensor circuit for sensing the transmitter field and for outputting a sensor signal dependent on the transmitter field a circuit carrier having a first region in which at least a part of the sensor circuit is supported and a second region in which at least a first mechanical interface and a second mechanical interface for connecting the circuit carrier to a retainer are arranged, and a noise resistance element, which is arranged between the first region and the second region and which is designed to conduct structure-borne noise entering via the first mechanical interface to the second mechanical interface.

A sensor unit with high reliability and stable detection accuracy against vibrations of an installation target object is to be provided. A sensor unit includes: a sensor module configured including a substrate with inertial sensors mounted thereon, and an inner case in which the substrate is installed; and an outer case accommodating the sensor module. A recessed part is formed in the inner case. The inertial sensors are arranged in an area overlapping with the recessed part as viewed in a plan view seen from the direction of thickness of the substrate, and a filling member is provided to fill a space formed by the substrate and the recessed part. The sensor module is joined to a bottom wall of the outer case via a joining member.

A capacitive microelectromechanical acceleration sensor where one or more rotor measurement plates and one or more stator measurement plates are configured so that the movement of a proof mass in the direction of a sense axis can be measured in a capacitive measurement conducted between them. One or more first rotor damping plates and one or more first stator damping plates form a first set of parallel plates which are orthogonal to a first damping axis, and the first damping axis is substantially orthogonal to the sense axis.

A method for producing a micromechanical device having a damper structure. The method includes: (A) providing a micromechanical wafer having a rear side; (B) applying a liquid damper material onto the rear side; (C) pressing a matrix against the rear side in order to form at least one damper structure in the damper material; (D) curing the damper material; and (E) removing the matrix.

A method for tuning one or more sensor devices is provided, wherein each sensor device comprises one or more proof masses configured to move in response to an external stimulus of interest, and the one or more proof masses are also susceptible to move in response to one or more stimuli other than the external stimulus of interest. Each sensor device also comprises one or more pick-off mechanisms respectively associated with each of the one or more proof masses. The one or more pick-off mechanisms is proportionally responsive to a motion of the sensor device. The method for tuning includes adjusting gain of one or more of the pick-off mechanisms to reduce an output of each sensor device when the one or more proof masses move in response to the one or more stimuli other than the external stimulus of interest.

MEMS devices include fluid confinement structures on either a fixed part of a substrate and/or on a suspended element. The fluid confinement structures may be configured to confine a viscoelastic fluid in a limited part of a gap between one or more vertical sidewalls of both the fixed part of the substrate and either the suspended element or the drive beam or both the suspended element and drive beam such that one part of the gap is bridged by the fluid and another part of the gap is not, The structures may be configured to prevent flow of the fluid to other parts of the gap.