The present disclosure relates to systems, methods, devices for cantilever based pressuring monitoring, and the like. The systems and devices of the present disclosure can be used in caustic or harsh environments. Continuous pressure monitoring using the described devices can enable real-time adjustments for precise process control, contributing to improved efficiency and product quality.

A piezoelectric microelectromechanical systems device can include a cavity bounded by walls and an asymmetrical bimorph structure at least partially spanning the cavity that includes at least a piezoelectric layer and two electrode layers. The electrode layers can have relative thicknesses configured to compensate for expected temperature stress in the bimorph structure. Thus, metals having different thicknesses can be positioned and configured to compensate deflection due to thermal stress of any or all of the piezoelectric layer, the first metal layer, and second metal layer and a substrate. A method for making the piezoelectric microelectromechanical systems device is also provided.

A system for reducing electromotive force (EMF) errors is disclosed. The system may include a circuit component with a plurality of leads soldered to a circuit board. The system may also include a filler material coupled to at least a first lead of the plurality of leads. The system may exhibit an asymmetrical thermal conduction of the first lead relative to a different lead of the plurality of leads due to the filler material.

A MEMS sensor module includes an inner space enclosed by a side wall, a dividing wall for dividing the inner space into two cavities, a first circuit board, a second circuit board, two MEMS sensors respectively disposed in the two cavities, and two golden finger layers. One or both of the two golden finger layers at the dividing wall have a notch communicating the two cavities. One MEMS sensor includes an ASIC chip on the second circuit board and a MEMS chip on the ASIC chip. Another MEMS sensor includes an ASIC chip on the first circuit board and a MEMS chip on the second circuit board. The side wall has a conductor connecting the two circuit boards. A bonding wire connects the MEMS chip and the second circuit board. The MEMS sensor module can avoid the heat generated by one MEMS sensor affecting another one.