A thin-film filter includes thin-film part having a film surface and a rear film surface arranged at the rear side of the film surface, a plurality of through holes, being formed to penetrate the thin-film part from the film surface to the rear film surface, the through holes are formed along by a slanting direction being made an acute angle or an obtuse angle with the film surface, and stripes-formed inner wall surfaces. The stripes-formed inner wall surfaces include stripe-like parts formed along by the slanting direction. The stripes-formed inner wall surfaces are formed inside the respective through holes.

A microphone is provided. The microphone includes a shell with an accommodating cavity, as well as a micro-electro-mechanical system chip and a control circuit chip accommodated in the accommodating cavity, where the shell is provided with a sound hole penetrating through a thickness of the shell and communicated with the accommodating cavity; the microphone further includes an electric anti-dust device at least completely covering the sound hole, the electric anti-dust device is electrically connected with the control circuit chip, and can open the sound hole when receiving a power-on signal of the control circuit chip and close the sound hole when not receiving the power-on signal of the control circuit chip, thus effectively improving a pollution problem of the microphone during such process as transportation, assembly, SMT or unused state that dust is fed most easily without affecting an acoustic performance.

Methods and devices to mitigate time varying impairments in sensors are described. The application of such methods and devices to pressure sensors facing time varying parasitic capacitances due to water droplets is detailed. Benefits of auto-zeroing technique as adopted in disclosed devices is also described.

A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.

Capped microelectromechanical systems (MEMS) devices are described. In at least some situations, the MEMS device includes one or more masses which move. The cap may include a stopper which damps motion of the one or more movable masses. In at least some situations, the stopper damps motion of one of the masses but not another mass.

Methods for an embedded vibration management system are disclosed and may include fabricating a semiconductor package that supports vibration management by forming an array of vibration absorbing structures, placing the array proximate to a leadframe comprising two-legged supported leads, placing a semiconductor device above the leadframe, and encapsulating the semiconductor device and the leadframe. Each vibration absorbing structure may comprise a mass element formed on a material with lower density than that of the mass element. The array may be placed on a top, a bottom, or both surfaces of the leadframe. Sections of the array may be placed symmetrically with respect to the semiconductor device. The vibration absorbing structures may be cubic in shape and may be enclosed in an encapsulating material. The two-legged supported leads may be formed by bending metal strips with holes. The vibration absorbing structures may be exposed to the exterior of the semiconductor package.

A sensor unit includes: a sensor module having an inertial sensor installed therein and having a bottom wall and a sidewall; abase where the sensor module is provided; a first bonding member bonding the base and the sidewall together; and a second bonding member bonding the base and the bottom wall together. The sensor module is a polygon as viewed in a plan view of the bottom wall. The base and the sidewall are bonded together via the first bonding member at a part of at least one side of the polygon except corners.

A vibrator device includes a base, a vibrator that includes a vibrator element and a vibrator element package, which accommodates the vibrator element and has a first terminal on a surface on a base side, a circuit element that is disposed between the base and the vibrator and has a first connection pad on a surface on a vibrator side, and a conductive connecting member that is disposed between the circuit element and the vibrator, bonds the circuit element and the vibrator together, and electrically connects the first connection pad and the first terminal together.

A micromechanical apparatus and a corresponding production method are described. The micromechanical apparatus encompasses a base substrate having a front side and a rear side; and a cap substrate, at least one surrounding trench having non-flat side walls being embodied in the front side of the base substrate; the front side of the base substrate and the trench being coated with at least one metal layer; the non-flat side walls of the trench being covered nonconformingly with the metal so that they do not form an electrical current path in a direction extending perpendicularly to the front side; and a closure, in particular a seal-glass closure, being embodied in the region of the trench between the base substrate and the cap substrate.

Systems and methods for suppressing bias in a non-degenerate vibratory structure are provided. In certain embodiments, a vibratory structure includes a first proof mass; a second proof mass, wherein the first proof mass and the second proof mass are driven into motion along a first axis, wherein the first proof mass and the second proof mass move in anti-phase along a second axis, wherein the motion of the first proof mass and the second proof mass along the second axis is such that the centers of mass of the first proof mass and the second proof mass move collinearly along a same axis.