A micro-electro-mechanical system (MEMS) microphone package is provided. The MEMS microphone package includes a first micro-electro-mechanical system (MEMS) sensor die, an integrated circuit (IC) die and a first conductive lid. The first micro-electro-mechanical system (MEMS) sensor die has a first surface and a second surface opposite to the first surface. The IC die is stacked on the first surface of the first MEMS sensor die. The first conductive lid is disposed on the second surface of the first MEMS sensor die.

Alignment features formed on a cover substrate allow for a second substrate to be bonded to the cover substrate while ensuring that the second substrate is not titled with respect to a plane defined by the alignment features. Die attachment material is patterned such that it deforms or flows underneath the second substrate while allowing corners of the second substrate to rest on landing areas that are elevated above the top surface of the cover substrate. Some of the landing areas may include additional features that are elevated above the landing areas to form notches which constrain the rotational position of the second in addition to its tilt.

A MEMS sensor module includes an inner space enclosed by a side wall, a first circuit board, a second circuit board, a dividing wall for dividing the inner space into two cavities, a first MEMS sensor in one cavity wrapped by glue, a second MEMS sensor in another cavity, a first golden finger layer between the side wall and the first circuit board as well as between the dividing wall and the first circuit board for respectively surrounding the two cavities, a second golden finger layer between the side wall and the second circuit board as well as between the dividing wall and the second circuit board for respectively surrounding the two cavities, and a notch in the first golden finger layer at the dividing wall for communicating the two cavities. The MEMS sensor module can avoid the heat generated by one MEMS sensor affecting another one.