A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, a first dielectric layer, and a first hole. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface. The first dielectric layer is disposed on the second surface and has a third surface away from the substrate. The first hole extends from the first dielectric layer and the substrate. The first hole is substantially aligned with the first electronic component.

Representative implementations of techniques and devices provide seals for sealing the joints of bonded microelectronic devices as well as bonded and sealed microelectronic assemblies. Seals are disposed at joined surfaces of stacked dies and wafers to seal the joined surfaces. The seals may be disposed at an exterior periphery of the bonded microelectronic devices or disposed within the periphery using the various techniques.

A chip package includes a first die, a second die, a molding material, and a redistribution layer. The first die includes a first conductive pad. The second die is disposed on the first die and includes a second conductive pad. The molding material covers the first die and the second die. The molding material includes a top portion, a bottom portion, and an inclined portion adjoins the top portion and the bottom portion. The top portion is located on the second die, and the bottom portion is located on the first die. The redistribution layer is disposed along the top portion, the inclined portion, and the bottom portion. The redistribution layer is electrically connected to the first conductive pad and the second conductive pad.

A sensing device includes a lead frame, a first insulating film, a semiconductor integrated circuit chip provided over the lead frame via the first insulating film, and a first bonding wire via which an external derivation lead and the semiconductor integrated circuit chip are electrically coupled to each other. The sensing device includes a sensor chip disposed over the semiconductor integrated circuit chip such that a first surface of the sensor chip faces the semiconductor integrated circuit chip. The sensing device includes a sensor provided on a second surface of the sensor chip. The sensing device includes a molding resin with which the lead frame, the semiconductor integrated circuit chip, the sensor chip, and the first bonding wire are sealed. The sensor chip is electrically coupled to the semiconductor integrated circuit chip, and the molding resin has an opening in which the sensor is exposed.

A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.

A method of manufacturing an electronic device includes a preparation step of preparing a substrate to which a lead is bonded, and a molding step of mounting a cap in a mold in a state in which the cap is disposed on the substrate and forming a mold portion by filling a mold material into the mold. The mold includes a first mold including a cap mounting portion, and a second mold including a lead pressing portion. The molding step includes a step of mounting the cap in the cap mounting portion, a step of mounting the substrate on the cap, a step of pressing the lead with the lead pressing portion to elastically deform the lead, and biasing the substrate toward the cap by a restoring force generated in the lead, and a step of filling the mold material into the mold.

A MEMS microphone with a hybrid packaging structure is provided. The microphone comprises: a first circuit board; a second circuit board, spaced apart from the first circuit board and parallel to the first circuit board; a packaging cover, covering the second circuit board, and forming an acoustic cavity with the second circuit board; wherein the first circuit board and the second circuit board form an accommodating space in which a pressure sensor is disposed. In the present invention, the chip and electronics of the MEMS microphone are installed on two different circuit boards, respectively, so that an interior space of the microphone is fully utilized, a good heat dissipation is achieved, a better sound transmission effect is achieved, and the microphone can be widely used.

A method of manufacturing an inertial measurement unit (IMU) comprises fabricating a plurality of individual MEMS inertial sensor packages at a package level as sealed packages containing a MEMS inertial sensor chip and an integrated circuit electrically connected together. Fabricating the individual MEMS inertial sensor packages comprises forming mechanical interconnect features in each package and assembling the IMU by mechanically interconnecting each individual MEMS inertial sensor package with another individual MEMS inertial sensor package in a mutually orthogonal orientation.

Alignment features for an optical fibre assembly are formed directly into an ion trap chip to align an optical module with respect to the ion trap chip. This is achieved using microfabrication techniques to etch alignment elements into the surface of the ion trap chip, advantageously carried out with lithographic precision achieving the alignment accuracy required of the optical beam geometries for the application, with an alignment accuracy of a few micrometres. The alignment elements are advantageously etched along defined crystal planes of the silicon substrate of the chip. An external microstructure can be micromachined with lithographic precision to contain locating features that will fit, or “plug”, into the recesses of the chip, for instance ion microtrap chip.

A microelectromechanical (MEMS) system may comprise multiple sensors within cavities of the MEMS system. The operation of different sensors requires different pressures within the respective cavities. A first cavity may be sealed at a first pressure. A through-hole may be etched into a cap layer of the MEMS system to introduce gas into a second cavity such that the cavity has a desired pressure. The cavity may then be sealed by a MEMS valve to maintain the desired pressure in the second cavity.