A micro-electromechanical system (MEMS) apparatus has an array of micro-mirrors and a control circuit for rotating the micro-mirrors synchronously at a resonant frequency. An array of heating resistors is used to heat the array of micro-mirrors compensate for changes in resonant frequency with temperature. A temperature sensor is mounted proximate the chip package for detecting a temperature proximate the array of micro-mirrors. A temperature control circuit, coupled to the temperature sensor and the array of heating resistors, provides current to the array of heating resistors in response to a change in temperature that will change the resonant frequency.

A microelectromechanical system (MEMS) transducer for integration in a microphone assembly is designed to produce heat-generated acoustic signals. The MEMS transducer generally comprises a substrate having an aperture, a transduction element located at least partially over the aperture and coupled to the substrate, electrical contacts coupled to the transduction element, and a resistor integrated with the substrate or the transduction element. The resistor is coupled to electrical contacts that are electrically isolated from the contacts of the MEMS transducer or transduction element. The transduction element includes an insulating material coupled to the substrate. The transduction element comprises a fixed electrode and a movable electrode located at least partially over the aperture of the substrate. The fixed electrode or the moving electrode is formed on the insulating material. The resistor can be formed on the insulating material or suspended from the insulating material.

An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.

The performance of a microelectromechanical systems (MEMS) device may be subject to unwanted thermal gradients or nonuniform temperatures. The thermal gradients may be approximated based on voltage measurements taken through bond wires coupled to bond points located on the MEMS device. Thermal gradient measurement may be improved depending on the arrangement of bond wires and/or the material of the bond wires. Sense circuitry that is coupled to the MEMS device may determine corrective actions, such as updating the operation of the MEMS device, that compensate for the adverse effects from the thermal gradients.

An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.

A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.

A microelectromechanical (MEMS) device may be coupled to a dielectric material at an upper planar surface or lower planar surface of the MEMS device. One or more temperature sensors may be attached to the dielectric material layer. Signals from the one or more temperature sensors may be used to determine a thermal gradient along on axis that is normal to the upper planar surface and the lower planar surface. The thermal gradient may be used to compensate for values measured by the MEMS device.

A microelectromechanical system (MEMS) mirror assembly may comprise a frame and a MEMS mirror coupled to the frame. The MEMS mirror assembly may also include at least one piezoelectric actuator including a body and a piezoelectric element. When subjected to an electrical field, the piezoelectric element may be configured to bend the body, thereby moving the MEMS mirror with respect to a plane of the frame. The MEMS mirror assembly may further include at least one heating resistor configured to heat the piezoelectric element when an electric current passes through the at least one heating resistor.

A sensor module including a microelectromechanical systems (“MEMS”) gyroscope resonator and an accelerometer positioned adjacent the MEMS gyroscope resonator is disclosed herein. The MEMS gyroscope resonator and accelerometer can be co-fabricated on a sensor die and a control circuit can be electrically coupled to the sensor die. The control circuit can be configured to receive signals from and control the MEMS gyroscope resonator and the accelerometer. An interposer can be positioned between and mechanically coupled to the sensor module and a substrate, wherein the interposer is configured to relieve stresses imposed by an operating environment on the sensor module and the substrate.

The present disclosure relates to fluidic systems and devices for processing, extracting, or purifying one or more analytes. These systems and devices can be used for processing samples and extracting nucleic acids, for example by isotachophoresis. In particular, the systems and related methods can allow for extraction of nucleic acids, including non-crosslinked nucleic acids, from samples such as tissue or cells. The systems and devices can also be used for multiplex parallel sample processing.