Sensors, systems, and methods for monitoring environmental conditions, such as physical, electromagnetic, thermal, and/or chemical parameters within an environment, over extended periods of time with the use of one or more electromechanical sensing devices and electronic circuitry for processing an output of the sensing devices. The sensing devices each include a cantilevered structure and at least one contact configured for contact-mode operation with the cantilevered structure in response to the cantilevered structure deflecting toward or away from the contact when exposed to the parameter of interest. The cantilevered structure has at least first and second beams of dissimilar materials, at least one of which has at least one property that changes as a result of exposure to the parameter.

A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board.

A self-cleaning sensor to determine a level of a liquid includes a tube with an interior coating and a plurality of horizontally aligned, electrically isolated, electrical contacts. The self-cleaning sensor includes the plurality of horizontally aligned, electrically isolated, electrical contacts that each terminate in an outer surface of an interior wall of the tube and are electrically connected to one or more electrical devices in a cap residing on the tube. Additionally, the self-cleaning sensor includes a float that is composed of a low density, low dielectric constant material buoyant in one or more liquids to be measured where each horizontal dimension of the float corresponds to each horizontal dimension of the tube.

A microelectromechanical system (MEMS) test structure includes a plurality of capacitors formed from sense electrodes and capacitive plates having a predetermined geometry and size associated with a related MEMS device such as a MEMS sensor. Based on the predetermined relationships between the capacitors of the test structure, and between the test structure and the MEMS devices, an effect of fringing fields on the sensed capacitances of the MEMS devices may be eliminated, and the capacitive gap of the MEMS device may be accurately measured.

A passive micromechanical counter for counting and storing a number of mechanical pulses includes at least one memory cell, the memory cell having a cell input, a latching mechanism and an electromechanical coding unit, the cell input being designed to mechanically transmit the mechanical pulse to the latching mechanism, and the latching mechanism being designed to store the number of mechanical pulses transmitted by means of its discrete latching position. It is provided that an electrical digital signal can be generated by applying an electrical voltage to the electromechanical coding unit, the electrical digital signal representing the discrete latching position of the latching mechanism.

A MEMS sensor, includes a substrate with a back cavity, and a capacitive system arranged on the substrate, the MEMS sensor includes a first back plate assembly and a diaphragm opposite to the first back plate assembly. The first back plate assembly includes a first back plate and a second back plate, the first back plate includes a plurality of a first back plate holes, the second back plate includes a plurality of a second back plate holes, each first back plate hole and each second back plate hole are staggered with each other in a vibration direction of the diaphragm. Compared with the related art, the MEMS sensor disclosed by the present disclosure could play a good dustproof effect.

An electrical voltage values measuring device having at least one microelectromechanical device comprising a first electrode connectable to an anode of an electrical voltage source and a second electrode connectable to a cathode of the electrical voltage source, wherein the microelectromechanical device is configured to receive an electrical voltage from the electrical voltage source causing a deviation of the first electrode, associated with the electrical voltage, wherein the deviation causes a distance variation between the first electrode and the second electrode, and an optical processor that comprises a laser and an optical sensor.

Nano-electromechanical systems (NEMS) devices that utilize thin electrically conductive membranes, which can be, for example, graphene membranes. The membrane-based NEMS devices can be used as sensors, electrical relays, adjustable angle mirror devices, variable impedance devices, and devices performing other functions. The NEMS devices have a serpentine shape arrangement of the electrically conductive membrane. The electrically conductive membrane can be controllably wicked down on the edge of the oxide cavity to increase sensitivity of the NEMS device.

A template based process is used for the production of the nanowire structural element, wherein the nanowires are electrochemically depositioned in the nanopores. The irradiation is carried out at different angles, such that a nanowire network is formed. The hollow chamber-like structure in the nanowire network is established through the dissolving of the template foil and removal of the dissolved template material. The interconnecting of the nanowires provides stability to the nanowire structural element and an electrical connection between the nanowires is created thereby.

A device includes: a die including a microfluidic device; a polymer substrate formed around the die; and a separate fluid manifold attached to the polymer substrate over the die and on a same side of the substrate as the die, the manifold to deliver fluid to the die.